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SWEPEX differs from other tradeshows because it offers a simplified
experience for exhibitors, holds costs well below typical “national”
events and brings in the most desired attendees who fit the roles of
future customers.
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Southwest Electronics Production Exposition (SWEPEX), the premier
electronics trade event in Texas and the Southwest, announces its
debut, scheduled to take place November 14-15, 2006, in Plano, Texas. |
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Major international conference on printed electronics to be held in Phoenix, Arizona, December 5-6, 2006. |
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Kester will provide lead-free resources, technologies and products in
booth F28 at the upcoming GlobalTronics exhibition, scheduled to take
place October 10-13, in Suntec Singapore.
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Indium Corporation participated in the Special Olympics Airlift, which
provides transportation to over 1,500 athletes from all over the
country to the 2006 US National Games in Ames, Iowa, USA.
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Same great conference to be held in new location - with show and conference under one roof. |
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IBM shipped its refrigerator-sized IBM RAMAC 650HDD, a combination of a magnetic drum data
processing machine and a series of disk memory units, on Sept. 13, 1956. |
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Organic Light Emitting Diodes (OLEDs) have more market potential than any other form of potentially printed electronics
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The newly enhanced third generation Dage 4000HS 3G high-speed
bondtester addresses the need to detect brittle fracture failures in
the ball-to-pad interconnection of lead-free BGA and CSP semiconductor
devices.
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Broadly depolyed OCP verification component now supports mixed languages.
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Indium5.1AT is an air reflow, no-clean solder paste that provides
increased finished goods reliability when compared to competitive
solder pastes
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The combination of CoolCapTM and CoolShieldTM devices provides a new
level of flexibility and performance repeatability for process
engineers and rework technicians.
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While automotive engine management and safety systems will be the main
market drivers for Indian automotive electronics, production of
cutting-edge digital instrumentation and electronic ignition systems is
on the rise.
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A current study at Portelligent, based on teardown data of over 270 cell phones, portable media players, handheld GPS, and digital still cameras and camcorders, indicates that the percent of handheld devices with multi-chip packages (MCP’s) has doubled from 45% in 2002 to 90% by the end of 2005. However, among those devices that have adopted multi-chip packages, the quantity of MCP’s per device, on average, has remained nearly constant. |
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Leading mobile-phone makers Nokia and Motorola Inc. will increase their
semiconductor spending by the highest percentage among the world’s
top-10 OEM chip buyers in 2005 and 2006, iSuppli Corp. predicts.
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Antenova is a leading developer and supplier of high performance
integrated antenna solutions for a wide range of wireless applications
for mobile handsets, portable devices and other consumer electronics.
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The workshop, "Lead-free: A Hands-on Workshop", will be held October 16-19, 2006 at the Rochester Institute of Technology campus in Rochester, NY. |
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China’s rapid growth in electronic-design- generated semiconductor
purchasing activity is continuing and the country is closing in on the
United States and the other top nations.
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Since it was founded in 1986, WKKT has grown to more than $218 million in sales for 2003.
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The line is an industry first—it is an entire assembly system.
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