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Noticias de Ultima Hora
SWEPEX offers exhibitors numerous benefits

SWEPEX differs from other tradeshows because it offers a simplified experience for exhibitors, holds costs well below typical “national” events and brings in the most desired attendees who fit the roles of future customers.

 
New conference & exposition provides advanced resources for the electronics industry

Southwest Electronics Production Exposition (SWEPEX), the premier electronics trade event in Texas and the Southwest, announces its debut, scheduled to take place November 14-15, 2006, in Plano, Texas.

 
OLED progress on a broad front

Major international conference on printed electronics to be held in Phoenix, Arizona, December 5-6, 2006.

 
Visit Kester’s lead-free information center at GlobalTronics 2006

Kester will provide lead-free resources, technologies and products in booth F28 at the upcoming GlobalTronics exhibition, scheduled to take place October 10-13, in Suntec Singapore.

 
Indium Corporation assists Special Olympians

Indium Corporation participated in the Special Olympics Airlift, which provides transportation to over 1,500 athletes from all over the country to the 2006 US National Games in Ames, Iowa, USA.

 
SMTA International annual conference and show to move to Orlando, Florida for 2007

Same great conference to be held in new location - with show and conference under one roof. 

 
iSuppli wishes a happy 50th birthday to the hard disk drive

IBM shipped its refrigerator-sized IBM RAMAC 650HDD, a combination of a magnetic drum data processing machine and a series of disk memory units, on Sept. 13, 1956.

 
Illuminating the OLED lighting roadmap

Organic Light Emitting Diodes (OLEDs) have more market potential than any other form of potentially printed electronics

 
Dage wins Global Technology Award for 4000HS high-speed bondtester

The newly enhanced third generation Dage 4000HS 3G high-speed bondtester addresses the need to detect brittle fracture failures in the ball-to-pad interconnection of lead-free BGA and CSP semiconductor devices.

 
YOGITECH introduce industry first OCP universal verification component

Broadly depolyed OCP verification component now supports mixed languages.

 
Indium Corporation wins Global Technology Award

Indium5.1AT is an air reflow, no-clean solder paste that provides increased finished goods reliability when compared to competitive solder pastes

 
Cookson Electronics wins coveted industry award for ALPHA® CoolCap™ thermal management technology

The combination of CoolCapTM and CoolShieldTM devices provides a new level of flexibility and performance repeatability for process engineers and rework technicians.

 
Indian automotive electronics market poised for growth

While automotive engine management and safety systems will be the main market drivers for Indian automotive electronics, production of cutting-edge digital instrumentation and electronic ignition systems is on the rise.

 
Multi-chip packages now in 90 percent of handheld devices

A current study at Portelligent, based on teardown data of over 270 cell phones, portable media players, handheld GPS, and digital still cameras and camcorders, indicates that the percent of handheld devices with multi-chip packages (MCP’s) has doubled from 45% in 2002 to 90% by the end of 2005.  However, among those devices that have adopted multi-chip packages, the quantity of MCP’s per device, on average, has remained nearly constant. 

 
Nokia and Motorola boost chip spending in 2005 and 2006

Leading mobile-phone makers Nokia and Motorola Inc. will increase their semiconductor spending by the highest percentage among the world’s top-10 OEM chip buyers in 2005 and 2006, iSuppli Corp. predicts.

 
Digi-Key Corporation and Antenova sign global distribution agreement

Antenova is a leading developer and supplier of high performance integrated antenna solutions for a wide range of wireless applications for mobile handsets, portable devices and other consumer electronics.

 
Indium Corporation’s Dr. Ning-Cheng Lee and Dr. Ronald Lasky to present at lead-free workshop

The workshop, "Lead-free: A Hands-on Workshop", will be held October 16-19, 2006 at the Rochester Institute of Technology campus in Rochester, NY. 

 
U.S. maintains lead in electronic design influence—but China's advance continues

China’s rapid growth in electronic-design- generated semiconductor purchasing activity is continuing and the country is closing in on the United States and the other top nations.

 
Wong Kong King Technology wins Global Technology Award in contract services category

Since it was founded in 1986, WKKT has grown to more than $218 million in sales for 2003.

 
Tyco Electronics receives illustrious award for revolutionary RFID lin

The line is an industry first—it is an entire assembly system.

 
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Resultados 901 - 920 de 1197

Negocios Globales

La recuperación secuencial sigue pero las escaseces de componentes para 2010 permanece “en la pista”

Basado sobre datos MUY preliminares, las ventas de equipo electrónico mundiales crecieron secuencialmente para el tercer cuarto, pero eran todavía a la baja del 8 % en 3Q del 09’contra 3Q’ del 08’ (Carta 1).

 

Blogs de la Industria

Mantente al dia con lo que sucede en la industria. Visita los blogs relacionados a la industra escojidos por el equipo de Global SMT (Blogs son en inglés)

Detalles Sin Plomo

Criterios de inspección ópticos en uniones BGA

El examen visual de la serie de esferas (BGA) uniones de soldadura es mejor conseguido usando un sistema enderscope, disponible de varios proveedores por todo el mundo.

 

Detalles Pequeños

Manejo Termal Parte 2

El mes pasado se abrió esta discusión del manejo termal, proporcionando el fondo en cuanto a la importancia de la dirección termal afirmada en el aumento de densidad de transistor, y la subida de frecuencias en capacitores que se combinan para aumentar densidades de energía termales en el IC.

 

Entrevista del Dia

Entrevista - Scott Fillebrown de ACD y Bob Black de JUKI

Para esta entrevista yo tenía la única oportunidad  de hablar tanto con Scott Fillebrown, el presidente y CEO de ACD, y con el presidente y CEO de Sistemas de Automatización Juki Bob Black sobre este nuevo desarrollo emocionante.

 

Ultima Hora

ICI adquiere Advanced Applied Adhesives

ICI ha anunciado la adquisición de “Advanced Applied Adhesives” (AAA), un negocio de materiales electrónicos basado en San Diego , California , para añadir al grupo Materiales Electrónicos (EM por sus siglas an inglés). Los términos de la transacción no fueron divulgados. Lea mas...