The IMAPS EMPC is Europe’s premier conference related to microelectronic packaging and interconnection technologies. The EMPC conference, which takes place June 17-20, 2007, addresses "everything in electronics between the chip and the system."

The stated goal of both Kester and EasySpheres is to provide customers and distribution partners with instant online access to a broad inventory of solder sphere and flux products that can be quickly shipped against demand.

The reflow oven, a Vitronics SMR1030N, has undergone stringent NEA remanufacture and certification processes. 

iNEMI and IPC sponsor event to discuss emerging environmental regulations. 

Jaltek/NOTE AB agreement annulled due to a significant strategic change of direction by NOTE AB.

The 3rd international conference—3D ARCHITECTURES FOR SEMICONDUCTOR INTEGRATION AND PACKAGING—will be held October 31 – November 2 at the San Francisco Airport Marriott. 

Workshop to be held Wednesday, 11 October 2006 at the Oxfordshire conference center in Thame. 

Research project More Moore creates innovative photoemission electron microscope. 

Nortec Inc, has been created to provide a direct link between the North American marketplace and the company’s headquarters in Israel. Rick Howe to take on role as president.

EFD's Ultra® PP dispense tips won’t scratch delicate surfaces. 

The approval adds to the momentum that SACX™ lead-free wave solder alloy is achieving in the highly competitive lead-free alloy market. 

Business was booming in Shenzhen last week at the annual Nepcon South China exhibition with a number of multi-million dollar orders confirmed.

Agreement with world's largest manufacturer of camera models expands Tessera's presence in cell phones. 

Valor Computerized Systems is witnessing rapid market share growth in the demanding automotive manufacturing industry with its flagship TraceXpert software solution. 

iSuppli’s quarterly semiconductor market share research of the leading 100-plus chip suppliers shows that total semiconductor market revenue grew by 1.2 percent between the first and second quarters of 2006.

Partnering with CircuiTree and EMSNow, EIPC will bring global OEM, ODM, EMS, PCB makers and industry suppliers together in Koelnmesse, Cologne, Germany, October 4th & 5th.

To emphasize these developments and the ongoing renewal of its products, Europlacer has decided to refresh its image and has changed its corporate image with new logos, a new Web site, new sales brochures and new machine livery, effective September 1, 2006.  

The IWLPC, co-presented by Chip Scale Review and the SMTA, will take place from November 1-3, 2006, at the Wyndham Hotel, San Jose.

This serialization feature was integrated with the release of BPWin 4.62 to accommodate the increased demand for Enhanced 7th Generation device programming technology.

The revised site offers visitors more information on Europlacer’s products, classified in three categories: Pick-and-Place, Feeding Solutions and Software.