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Schroeder substituye a Jack Calderon, el director de gerente de Lincoln International (Chicago), que sirvió
como
presidente desde 2003 a 2006. |
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Building on the success of the first two Thermal Management symposiums and continuing with its proven symposium format, MEPTEC will bring together another group of technical speakers who are considered experts in the field of thermal management. |
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The exhibition, targeted specifically at the electronics assembly and PCB manufacturing industries, will begin at 10 am on Wednesday, September 26 and run through 2 pm on Friday, September 28. |
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Abstract submission is now open for the upcoming AIMS Harsh Environment Electronics Workshop and Successful Lead-Free/RoHS Strategies Conference events to be held in June. |
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escrito por Global SMT & Packaging
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AIMS (automotive, industrial, military and space) Harsh Environment Electronics Workshop will be held in June in Indianapolis, IN, USA. |
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escrito por Global SMT & Packaging
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The SMTA International Technical Committee invites you to submit an abstract for the 2007 conference. |
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escrito por Global SMT & Packaging
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Do not miss the big IMAPS UK event for “Advanced Interconnection”. |
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The SMTA Boston Tabletop exhibition takes place on Wednesday, June 20, 2007 at the Holiday Inn in Boxborough, MA. |
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Proposals including course descriptions must be submitted by April 18, 2007. |
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escrito por Global SMT & Packaging
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Once measured in the hundreds, MEMS devices-tiny machines that combine intelligent sensing and semiconductor circuitry to improve the functionality, cost and flexibility of a range of electronic systems-are being measured in the hundreds of thousands and are being sold by the millions. |
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New members who join and pay their subscription fee before 1st February 2007 will receive one free full conference delegate pass to the EIPC Winter Conference in Salzburg. |
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IMAPS UK conference and table top exhibition to be held March 6th and 7th at the Hellidon Lakes Convention Center, Daventry, UK. |
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escrito por Global SMT & Packaging
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IMAPS-UK unveils speaker programme for its annual UK conference. |
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Seminar & table-top exhibition to be held 13th February 2007 Wycombe Football Club Conference Centre.
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escrito por Global SMT & Packaging
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Forum on lead-free processes and summit on reliability are also planned. |
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The IPC webcast "Solder Joint Microvoiding: How Reliable is Your Information?" will be presented by MacDermid's Don Cullen and John Swanson.
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SMART Group's upcoming design event takes place Tuesday 30th January 2007 at the Oxfordshire, Thame, Oxfordshire.
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SMTA's "International Conference on Soldering and Reliability" will be held April 17-19, 2007 at the Park Plaza Hotel in Toronto, Ontario, Canada. |
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IPC has launched a dedicated website to recognize and celebrate the achievements and contributions made by thousands of volunteers since the founding of the organization in 1957. |
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Advances in Production Processes for the Future Seminar & Table-Top Exhibition to be held 13th February 2007 at the Wycombe Football Club Conference Centre |
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Joe Fjelstad will lead "Advanced Packaging Technologies and Future Trends" workshop January 18, 2006 in Phoenix, Ariz., USA.
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Seminar and tabletop exhibition to be held Tuesday 30th January 2007 at The Oxfordshire, Thame, Oxfordshire. |
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A December SMART Group seminar raised engineers’ and purchasing people’s awareness of the realities and limitations of printed circuit materials and processes; delegates went away with a clearer understanding of how to define their requirements to their printed circuit suppliers. |
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The authors will formally be presented their awards at the SMTAI Opening Ceremony during SMTA International 2007 in Orlando, Florida. |
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SMART Group Scotland are delighted to be able to run the first event of its kind in the UK on Tuesday 27th February 2007 in Livingston. |
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The deadline for submission of abstracts is April 9, 2007. |
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The North American rigid PCB industry book-to-bill ratio for November 2006 decreased to 0.92. The North American flexible circuit book-to-bill ratio declined to 0.86. |
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Don't miss your chance to participate in upcoming SMTA events. |
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Industry event moves to Germany in 2007 & plans to inform and educate on PCB testing. |
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The IPC Certification for Lead Free Electronics Assembly Process Capability is an audit of an electronics assembly facility to determine if the facility is capable of producing product to meet the lead-free requirements of the RoHS Directive.
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