La expansión de negocio en energía alternativa, componentes verdes y componentes eficientes de energía tiene un impacto significativo en la industria de semiconductor y la electrónica.

Typically, dispensing platform specifications do not include the error associated with positional mechanisms, which greatly contributes to final accuracy and repeatability.

Jetting adhesives for electronics and semiconductor packaging has provided enabling technology for high-throughput underfilling, small fillets and other applications for small, discrete amounts of material used in packaging.