Educational courses will take place July 24, technical conferences & exhibition on July 25. Conference will be held in  Minneapolis, MN.Don’t miss this opportunity to find out everything you need to know about flex circuits, and chip scale packaging.

Workshop will be held July 19-20 at the Crowne Plaza Hotel in Indianapolis, Indiana.

The EMPS Conference opened in Slovenia with a plenary session given by Phillip Gaucher on “functional materials in electronic devices”.

Abstracts must be turned in by June 18, 2006

Conference will take place August 16-17, 2006, in Montreal, Canada. 

NPL will be holding two lead-free events, a tutorial and a conference, back-to-back, in Teddington, TW11 0LW, UK. 

For industry professionals who have an interest in contract manufacturing, the SMTA has once again organized the popular Contract Manufacturing Symposium.

“Reaching 50 years is a wonderful milestone and we are really proud to have the opportunity to acknowledge IPC and the industry’s accomplishments,” says Denny McGuirk, IPC president.

Paul Langston, CEO of Coretec, Inc has been appointed vice chairman; Nilesh Naik, CEO of One Source Group, has been appointed secretary/treasurer. 

Engineers from Indium, SEHO, Exerra, SolderStar & Heller Industries will be available through out the day to provide advice on process, equipment and materials.

SMTA is again co-locating its annual conference, SMTA International, with the Assembly Tech Expo (ATExpo) show this fall in Rosemont, Illinois.

Opening session and meeting to be held during SMTA International in Chicago, late September. 

IPC/JEDEC 2006 International Conferences on Lead Free Electronic Assemblies and Components seek presentations from environmental managers and technical staff.

The CANEUS 2006 conference will be held in Toulouse France during the week of August 27 - September 1, 2006.

Paul Salmon immediately takes over from outgoing chairman Peter Marshall.

iNEMI, in conjunction with IEEE, CPMT and ECTC, is sponsoring the Third Tin Whisker Workshop on May 30.

IPC – Association Connecting Electronics Industries has launched the Certification for RoHS Lead Free Electronics Assembly Process Capability Program in North America and Europe.

IPC – Association Connecting Electronics Industries has launched the Certification for RoHS Lead Free Electronics Assembly Process Capability Program in North America and Europe.
 

IPC requests abstracts and proposals for fall Lead Free Implementation Conference at IPCWorks® 

Data is key to modelling behaviour of lead-free solder joints.