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Grosso said that the committee has identified three other critical
components for the next phase of standardization: power conversion
(supplies) and active and passive components.
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iNEMI is sponsoring a symposium in San Diego to discuss successful applications of liquid cooling in the electronics industry. |
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Capitol Hill Day is the industry’s premier lobby event.
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Symposium to be held May 17 & 18 at the Hyatt San Jose. |
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Two programs are coming up mid-May.
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IPC-Association Connecting Electronics Industries announced the
findings from its monthly Printed Circuit Board (PCB) Statistical
Program.
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Co-sponsored by iNEMI, the IEEE CPMT Society and ECTC, the event will be held on May 30. |
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Deadline for abstracts is June 17, 2006 |
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May 23rd JJS Electronics Ltd, Leicestershire |
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Deadline for abstracts is June 18, 2006 |
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Partnering with CircuiTree and EMSNow, the EIPC will bring global OEM,
ODM, EMS, PCB makers and industry suppliers together in Cologne,
Germany, on October 4-5, 2006.
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The SMTA is pleased to announce the third annual SMTA MEDICAL
ELECTRONICS SYMPOSIUM to be held on May 15-17 at the Sheraton Hotel
Minneapolis South in Bloomington, Minnesota.
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On June 21st 2006 David Hillman and Doug Pauls will present their Master Class ‘Crafting of a Lead-Free Solder Process’.
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IPC – Association Connecting Electronics Industries announces an
“International Electronics Conference on RoHS Compliance and Beyond”.
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IPC-1752 outlines a supply chain materials declaration format and
process that provides a simple, effective approach to collecting,
tracking and disclosing product material content information. |
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The SMTA and Chip Scale Review invite you to exhibit at the
International Wafer-Level Packaging Conference to be held November 2-3
at the Wyndham Hotel in San Jose, California.
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iNEMI’s High-Reliability RoHS Task Force has published recommendations
for Pb-free manufacturing of complex, thermally challenging electronic
assemblies.
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Christopher Hunt, PH.D., and Martin Wickham were awarded Best International Conference Paper at IPC
Printed Circuits Expo, APEX and the Designers Summit 2006.
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‘MEMS Packaging Trends: From Production to Market – Large Volume Drivers for MEMS Technologies.’
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SMTA Boston will be held May 9-11 at the new Boston Convention and Exhibition Center in Boston, Massachusetts, in conjunction with NEPCON East/Electro.
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