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IPC releases air moving device standard, first in series of OEM critical components standards

Grosso said that the committee has identified three other critical components for the next phase of standardization:  power conversion (supplies) and active and passive components.

 
iNEMI Liquid Cooling Symposium to be held May 31

iNEMI is sponsoring a symposium in San Diego to discuss successful applications of liquid cooling in the electronics industry.

 
Capital Hill Day provides participants a chance to be heard by Congree

Capitol Hill Day is the industry’s premier lobby event.

 
MEPTEC finalizes program for MEMS Symposium

Symposium to be held May 17 & 18 at the Hyatt San Jose. 

 
Register now for SMTA lead-free programs

Two programs are coming up mid-May.

 
IPC releases new IMS/PCB business report

IPC-Association Connecting Electronics Industries announced the findings from its monthly Printed Circuit Board (PCB) Statistical Program.

 
Third annual Tin Whisker Workshop
Co-sponsored by iNEMI, the IEEE CPMT Society and ECTC, the event will be held on May 30.
 
Call for papers: IPC Printed Circuits Expo, APEX, Designers Summit

Deadline for abstracts is June 17, 2006 

 
SMART/LEADOUT Lead-Free Implementation Seminar

May 23rd JJS Electronics Ltd, Leicestershire 

 
Call for papers - Forum 2006 'be-flexible'

Deadline for abstracts is June 18, 2006

 
ESCC2006 – a unique event from EIPC, CircuiTree Magazine and EMSNow

Partnering with CircuiTree and EMSNow, the EIPC will bring global OEM, ODM, EMS, PCB makers and industry suppliers together in Cologne, Germany, on October 4-5, 2006.

 
SMTA Medical Electronics Symposium

The SMTA is pleased to announce the third annual SMTA MEDICAL ELECTRONICS SYMPOSIUM to be held on May 15-17 at the Sheraton Hotel Minneapolis South in Bloomington, Minnesota.

 
Duo from Rockwell Collins to present Lead-Free Master Class

On June 21st 2006 David Hillman and Doug Pauls will present their Master Class ‘Crafting of a Lead-Free Solder Process’.

 
Conference to focus on EU member state enforcement and compliance

IPC – Association Connecting Electronics Industries announces an “International Electronics Conference on RoHS Compliance and Beyond”.

 
IPC publishes IPC-1752, Materials Declaration Management Standard

IPC-1752 outlines a supply chain materials declaration format and process that provides a simple, effective approach to collecting, tracking and disclosing product material content information.

 
Exhibit at the 3rd annual IWLPC November 2-3

The SMTA and Chip Scale Review invite you to exhibit at the International Wafer-Level Packaging Conference to be held November 2-3 at the Wyndham Hotel in San Jose, California.

 
iNEMI makes recommendations for Pb-free manufacturing

iNEMI’s High-Reliability RoHS Task Force has published recommendations for Pb-free manufacturing of complex, thermally challenging electronic assemblies.

 
NPL wins Best International Conference Paper

Christopher Hunt, PH.D., and Martin Wickham were awarded Best International Conference Paper at IPC Printed Circuits Expo, APEX and the Designers Summit 2006.

 
MEPTEC announces 4th annual MEMS Symposium

‘MEMS Packaging Trends: From Production to Market – Large Volume Drivers for MEMS Technologies.’

 
Don’t miss your opportunity to attend SMTA Boston

SMTA Boston will be held May 9-11 at the new Boston Convention and Exhibition Center in Boston, Massachusetts, in conjunction with NEPCON East/Electro. 

 
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