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SMART Group Scotland are delighted to be able to run the first event of its kind in the UK on Tuesday 27th February 2007 in Livingston. |
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The deadline for submission of abstracts is April 9, 2007. |
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The North American rigid PCB industry book-to-bill ratio for November 2006 decreased to 0.92. The North American flexible circuit book-to-bill ratio declined to 0.86. |
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Don't miss your chance to participate in upcoming SMTA events. |
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Industry event moves to Germany in 2007 & plans to inform and educate on PCB testing. |
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The IPC Certification for Lead Free Electronics Assembly Process Capability is an audit of an electronics assembly facility to determine if the facility is capable of producing product to meet the lead-free requirements of the RoHS Directive.
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Abstracts of 300 words are due by February 16, 2007. |
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Workshop will be held March 1 in Cupertino, Calif. |
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The event will be held at IPC Printed Circuits Expo®, APEX® and the Designers Summit. |
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Early bird registration for the International Conference on Alternative Energy will close on January 5, 2007 |
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To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Paper, Best of Proceedings Paper, and the Best International Paper. |
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Fifth annual showcase will introduce innovative new advanced manufacturing technologies to market. |
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Speakers at the International Wafer-Level Packaging Conference (IWLPC) that was held November 1-3, 2006, at the Wyndham Hotel - San Jose (CA), addressed issues in semiconductor packaging, chip scale packaging, 3D, system-in-package, system-on-chip, system-on-package, and wafer-level packaging. |
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 A report from the SMART Group RoHS Printed Circuit Boards Specification & Procurement Requirement seminar held on December 6th.
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Latest publication includes new guideliness, revised recommendations and expanded discussion of key issues. |
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Friday, December 15, is the deadline for abstract submissions for the 3rd International Device Packaging Conference and Exhibition.
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IPC’s EMS Management Council Meeting will be held February 19, 2007, in Los Angeles, Calif., in conjunction with IPC Printed Circuits Expo®, APEX® and the Designers Summit. |
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IPC – Association Connecting Electronics Industries® and its Designers Council are pleased to announce the Designers Summit, February 15-22, 2007, in Los Angeles, Calif., targeted specifically for printed circuit board (PCB) designers. |
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PCB executives will convene at the IPC PCB Executive Management Meeting, February 19, 2007 in Los Angeles, Calif., to meet with other industry leaders and plan for continued momentum and growth. |
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IMAPS 2nd Advanced Technology Workshop on Reliability of Advanced Electronic Packages and Devices in Extreme Cold Environments to be held February 27 - March 1, 2007 in Arcadia, California.
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