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IME develops advanced RF CMOS chip
The Institute of Microelectronics (IME) has once again broken new grounds in its development of RFID solutions with the demonstration of a silicon chip that enables low cost UHF (Ultra High Frequency) RFID reader/writer modules.
 
New desktop electroplating system for in-house prototyping
This table-top system is specially designed for the professional production of prototypes and small batch production PCBs.
 
National Semiconductor introduces industry’s lowest-power, radiation-tolerant, 8-bit, 1 GSPS ADC

ADC08D1000WG-QV provides single event latch-up levels of 120 MeV and 300K rad for total ionising dose.

 
New universal, standalone production in-system programmer
Fast, flexible, reliable.
 
Weller® WD1002 digital soldering station offers power with screen simplicity

The new Weller® WD1002 soldering station features an 85-watt, single-channel power unit with three programmable presets and a large LCD display for easy operation.

 
DEK Cyclone™ high performance understencil cleaning
DEK’s Cyclone precision cleaning technology cuts total cleaning time to under half that required by conventional cleaning systems.
 
New light curing adhesive for acrylic and polycarbonate vehicle lighting assembly
Intertronics have introduced the DYMAX 3-20469 which features fast cure speeds and the ability to cure through clear, UV blocked plastic and offers advanced features for a variety of vehicle lighting assembly applications.
 
Plurality Ltd announces new HyperCore Architecture Line (HAL) of multicore processors

The completion of Plurality's proof of concept represents a breakthrough in multicore architecture. The solution is currently available as an evaluation and development kit and will be soon followed by a 64-core commercial chip.

 
Crouzet introduces Millenium 3 - the third generation of logic controllers & accessories

Millenium 3 logic controllers are designed for use in many types of systems including access control, irrigation control, air-conditioning and heating and ventilation.

 
TES announces reference platform for TI's DaVinci digital media processors
Comprehensive new platform leverages TES's custom Design and Manufacture to provide fast time-to-market for wide range of multimedia applications.

 

 
FPGA devices come in smaller BGA packages

Advanced packaging meets the aggressive requirements of handheld electronics integrating storage, wireless, mobile TV and other emerging technologies.

 
Compact socket adapter system now available for 0.65mm pitch BGA and LGA device validation
The patented design features the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket.
 
EVE launches next-generation ZeBu-XXL during EDS Fair in Japan
Latest addition to the ZeBu emulation/prototyping family offers fastest performance, largest capacity.

 

 
Tanner EDA - Enhanced analogue / mixed-signal / MEMS design suite

The latest release of the Windows-based EDA tool suite, Tanner Tools 12.2, for analogue, mixed-signal and MEMS design is now available from Tanner EDA.

 
New FINETECH automated, sub-micron bonder for assembly of opto-electronic components and modules

The system marks a breakthrough by combining high accuracy (+/-0.5 micron) and process flexibility in arguably the smallest footprint (1270 x 900 mm) for such sophisticated technologies.

 
ZESTRON® CoRe Test: fast coating teliability testing

ZESTRON America’s new service development, the ZESTRON® CoRe Test, offers a fast, cost-effective alternative to the traditional reliability tests.

 
Schloetter have released their latest processes for blind via plating and filling

Slotocoup BV 110 and Slotocoup CU 140 are part of a complete portfolio of PCB manufacturing processes.

 
Fast turn BGA reballing technique developed

Recently BEST has developed and perfected a reballing technique for area array devices that is designed for speed and fast turn-around of small quantities.

 
New PowerStrip from Samtec combines high current carrying capacity with signal routing options

Samtec has expanded its new high power-to-board interconnect system on (6,35mm) .250” pitch (PES/PET Series) with signal pins on 25,4mm (.100”) pitch (PESC/PETC Series).

 
ESD-safe lead cutter shears

Intertronics have recently introduced the Plato range of ergonomic lead cutters.

 
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