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 All sizes of its new CSP/micro BGA test and burn-in sockets accept devices with pitches as low as 0.40mm.
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Upgrade packages for CBT6000 and model 8000 wire bonders and model 3500 component placement work cell include Bond Data Miner software. |
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Software enables quad-flat no-lead inspection and new defect characterisation to reduce false call rates. |
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 Cost savings in purchasing, improvements in the production efficiency and a product advancement are leading to lower manufacturing cost for tape feeders of the HLX and CSM pick and place series
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.jpg) The Gen4 laser system is designed to mark and verify ECC200 data matrix symbology as well as other machine code formats, man-readable text and graphic images.
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 The test visually identifies resin-based residues on electronic assemblies.
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The platform provides key new benefits, including reduced thickness, high yield, and superior reliability. |
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 With a built-in industrial microprocessor, the Fonton BGA 936A does not require extra tools or PCs. |
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7cc-capacity pen allows users to reach even the smallest of areas with precision.
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 As process requirements change, this unique system can be easily reconfigured in the field.
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 Emerson & Cuming bring two new adhesives and an adhesive film onto the market.
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 Selective soldering pioneer A.C.E. Production Technologies has teamed with On-Site Gas Systems, Inc. to offer On-Site’s superior nitrogen generation systems under the A.C.E. brand. |
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Aeroflex to also demonstrate its complete 3G test coverage highlighted by various new product developments and enhancements.
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SAES’ getter film PageLid® and SST’s 3150 High Vacuum Sealing Furnace enhance lifetime and performance of discrete packaged MEMS.
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 Intertronics offers an alternative to messy quick-set glues for jumper wires for ECOs and surface conductor repair. |
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 The MUST System 3 measures the solderability of a printed circuit board and/or component's metallic terminations by documenting the wetting curve of the unit under test.
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 AXI identifies process errors based on product inspection, identifies error trends, and allows the operator to correct the process error before a high-volume of product is affected.
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 I&J7900-LF is a fully RoHS compliant compact 3-Axis Dispensing Robot with a sizable work area of 8 x 8 inches (200 x 200mm) and a Z-Axis of 2 inches (50mm).
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 Unlike other benchtop dispensing robots, Ultra®TT saves valueable workspace by eliminating the need for a separate computer or external dispenser controller.
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 New Permalex-3D thickness adjustment option for blades allows you to "fine tune" your SMT printing.
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