March Plasma Systems released an improved version of its highly successful AP-1000 plasma system for high-volume plasma processing of semiconductor and microelectronics devices.

Designed for Pb-Free, Sn/Pb and high-lead-containing applications, Indium's WS-366 excellent solderability and cleanability.

Enhanced option on PCB handling equipment that tracks and displays the operational sequence of the station through its various functions.

The new design has been greatly influenced by the new stringent process requirements of lead-free technology.

IX-200 ChromaDice™ DPSS version is a high-precision wafer dicing (singulation) system also suitable for wafer trimming and scribing applications.

BEST Inc. has developed a simpler process for reworking or hand-placing high lead count connectors.

Elektrobit’s Dual Rail Conveyor J204-53 is part of the Dual Rail Line concept that optimizes manufacturing process equipment.

New EVS systems represent a quantum leap forward in the processing of solder dross. 

Initially the company is offering two models, the m1-10, which is aimed at lower current type precision applications and the m1-40, designed for higher current applications.

This new level of data and process management allows for expanded product traceability, recipe verification, and automatic recipe changeover.

ALPHA® OM-338 PT is targeted to both EMS and OEM customers using in line circuit testing.

Simple Green Stencil and Misprint Cleaner combines exceptionally effective results with a high level of user and environmental safety associated with Simple Green products.

Samtec’s expanded Data Rate™ Cable assembly systems provide flexible high speed Cable-to-Board solutions.

Tecan offers optimised multi-level stencils with local thickness variations across their surface to ensure appropriate solder deposits result on each component pad.

COMET’s new FEINFOCUS COUGAR features CT capability.

JTAG Technologies’ new JT 2127 series of Digital I/O Scan (DIOS) modules facilitate the enhanced testing of complex printed circuit boards.

Typical applications for T2781 include power semiconductor and hybrid circuit substrates to heat sinks and for general bonding where excellent thermal conductivity is desired.

Advanced Interconnections Corp. recently launched the next generation Flip-Top™ BGA Socket.

DELTA 5 solder paste can decrease the Delta-T down to 5°C across the board.

Wembly offers a reflow system and a wave solder system for lead-free.