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IPC solder joint microvoiding webcast on January 25, 2007 |
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The webcast "Solder Joint Microvoiding: How Reliable is Your Information?" will
Microvoids have become one of the most widely discussed PCB topics of the post-RoHS world. Solder joint microvoiding emerged as a serious reliability threat during a time of drastic change in electronics manufacturing: the lead free transition, use of high-stress BGA attachment, and deployment of new PCB surface finishes. Over the past three years, the topic has developed into a critical area of interest.
Don Cullen, Director of OEM and Assembly Applications, MacDermid, Inc. and John Swanson, Director of Final Finishes and Interconnects, MacDermid, Inc. will be presenting.
Join us for this hour-long informative webcast on January 25, 2007, at 10:00 am CT (11:00 am ET).
To register, please visit www.ipc.org/solderjointwc07.
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