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The SMTA International Technical Committee invites you to submit an abstract for the 2007 conference. Short course descriptions are also being solicited. It is very important to note that this year’s conference will NOT be held in Chicago. SMTA’s world renowned premier technical conference will be held in Orlando, Florida, USA.
Abstract Deadline: February 16, 2007
Acceptance: April 16, 2007
Manuscripts Due: July 23, 2007
Please submit your abstract on-line at www.smta.org/smtai/call_for_papers.cfm
Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Material should be original, unpublished and non-commercial in nature.
The ET Summit has been expanded to also include “Hot Topics”. The renowned Lead-Free Symposium will return with a focus on “case studies” and lead-free reliability.
Papers are being solicited in the following categories:
Emerging Technologies/Hot Topics: Alternate Energy/Fuel Cells, Battery Interaction, China RoHS, Embedded Passives, “Getters”, MEMS/RF MEMS/MOEMS, Nanotechnology, NEW materials and processes, Optoelectronics, Printed Electronics, RFID, Sensors, Wireless Applications including Bluetooth and Wi-Fi, 0201/02005 Components and Assembly, “Getters”.
Components: BGA, CSP including Wafer-Level Packages, Component Solderability, Component Reliability, Connectors, Failure Analysis, Fine Pitch Technology, Flip Chip/ Direct Chip Attach, Harsh Environments (automotive, military, space), Lead/Termination Finish, Leadless Packaging, Multichip Packages including 3-D Packaging, MEMS/MOEMS, Package on Package (PoP), System in a Package
Assembly: Adhesives, Alternate Alloys, BGA/CSP Assembly, Cleaning, Connector Technology, Copper Erosion, DFX/Design for Six Sigma, Dispensing, Equipment Selection, Facility Layout, Flux and Solder, Land Pattern Design, Lead-Free Soldering (including case studies), Lead-Free Reliability, Lean Manufacturing, Low Volume/Prototype Assembly, Medical Electronics, Moisture Sensitivity, Placement, Printing, Reflow Soldering, Rework and Repair, RFID Assembly, Selective Soldering, Set Up Reduction, Solder Paste, Supplier Engineering, Wave Soldering, Yield Improvement
PCB Technology: Black Pad, Embedded Passive and Active Components, HDI, Microvias (filled and unfilled), Soldermask, Substrate Reliability, Substrate Solderability, Surface Finish
Process Control: AOI, CIM, In-Circuit Test, Process Modeling, Software, Test Strategies, X-Ray
Business: Capacity Modeling, Contract Manufacturing, Doing Business in Asia, Environmental Issues, Lean Manufacturing/Quality Initiatives, Operations Management, Remaining Competitive, RoHS Compliance, Supplier Management, and Technology Roadmaps
There are many benefits to participating:
- You will be making a contribution to our industry by sharing your work.
- You will help to advance the industry and your company as you will be recognized by industry colleagues.
- Discounted conference registration
- $1,000 cash awards for the best of conference paper, best of proceedings paper, and best international paper.
Please submit your abstract using the on-line form at www.smta.org/smtai/call_for_papers.cfm.
IMPORTANT: please be sure to obtain approval to both write and present your paper prior to submitting an abstract. Once a paper is accepted it is our expectation that you have the approvals required. www.smta.org/smtai/ |
