MEPTEC, the MicroElectronics Packaging and Test Engineering Council, is pleased to announce the addition of speakers from Apple and Microsoft to its final program for the 3rd Annual Thermal Management symposium titled “The Heat Is On: Thermal Management in Microelectronics: Challenges and Innovations” to be held on February 15, 2007 at the Holiday Inn San Jose (San Jose, CA).
 
The one-day technical symposium will begin with a keynote presentation given by Jerry Bartley of IBM as he discusses the thermal engineer’s role in today’s product development cycle.  The addition of the OEM presentations by Apple and Microsoft will come in the final session of the day as they discuss thermal management for challenging products.
 
Building on the success of the first two Thermal Management symposiums and continuing with its proven symposium format, MEPTEC will bring together another group of technical speakers who are considered experts in the field of thermal management. These speakers will provide their expertise to highlight problems and potential solutions related to thermal management in four “area of interest” sessions.  Sessions and speakers include:
 
Thermal Management Overview: Trends & Technology
Session Chair, Jeff Demmin, Director of Advanced Programs, Tessera, Inc.

• Maniam Alagaratnam, Vice President for Manufacturing Technology, LSI Logic – Thermal Management Issues and Trends for Advanced ICs
• Hongyu Ran, Ph.D., Senior Engineer, Thermal, Tessera, Inc.– Thermal Management of Mobile Electronics: A Case Study in Densification
• Devesh Mathur, Ph.D., R&D Packaging Director, Honeywell Corporation– Thermal challenges in ICs and Memory: Hot spots - Passive Cooling and Beyond

Issues in Design and Analysis of Advanced Packages
Session Chair, Thomas Tarter, Principal Engineer, Neophotonics Corporation

• Sherman Ikemoto, Business Development Manager, Flomerics – New Techniques for Chip and Package Thermal Modeling
• Jesse Galloway, Ph.D., Senior Director, Thermal Characterization, Amkor Technology – High Power Packaging: Materials, Design and Thermal Considerations
• Roger Emigh, Ph.D., Director, WW Package Characterization, STATS ChipPAC – Thermal Behavior and Data Processing for Multi-Chip Packages: Lateral, Stacked, PoP and PiP

Thermal Effects and Solutions in the Back-end Operation
Session Chair, Mark Murdza, Director of Marketing, Antares Advanced Test Technologies

• Bernie Siegal, President, Thermal Engineering Associates, Inc. – Semiconductor Thermal Resistance – Standards Versus Real Life
• Chris Lopez, Business Development Manager, Thermal Solutions, Antares Advanced Test Technology– Limitations of Traditional Burn-In and Test Methods Due to Thermal Implications
• Tony Flowers, Product Engineering Efficiency Manager, Texas Instruments – Challenges of Process Variation and Temperature at Burn-In

Thermal Management in Challenging Product Applications
Session Chair, Nick Leonardi, VP Sales and Marketing, CMC Interconnect Technologies

• Seri Lee, Ph.D., Chief Technology Officer, Nextreme Thermal Solutions, Inc. – Mitigating Semiconductor Hot Spots
• Julia Purtell, Microsoft – XBOX360 Thermal System Design and Verification
• Andre Ali, Mobile Thermal Architecture Manager, Apple, Inc.. – System Design Challenges

Complete abstracts for all sessions are available at www.meptec.org.
 
To register for or learn more about the symposium, please contact Bette Cooper at 650-714-1570 or bcooper@meptec.org or visit MEPTEC at www.meptec.org.