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Wednesday, May 23, 2012
Following a calamitous decline during the last three months of 2011, the market for power management semiconductors recovered somewhat at the beginning of 2012 and is finally on its way to discernible growth in the second quarter, driven primarily by an expansion in the consumer and industrial sectors.
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Wednesday, May 23, 2012
Fabrico, design and manufacturing services for flexible materials and advanced assembly solutions, has helped Crane Aerospace and Electronics to protect advanced microelectronics.
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Wednesday, May 23, 2012
Put a fair amount of stress on the bond between printed boards and electronic components and there’s a chance problems will arise, from solder ball cracking to conductor damage to pad cratering. Although measuring stress was a challenge for EMS and OEM companies, the recently updated joint industry guideline, IPC/JEDEC-9704A, Printed Circuit Assembly Strain Gage Test Guideline, makes it easier for engineers to run strain gage tests during the manufacturing process.
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Wednesday, May 23, 2012
In an effort to ensure its status as a premier stencil supplier, Fine Line Stencil continues to improve its products and services with positive changes. Keeping a firm handle on quality is our prime focus and, therefore, we announce two new additions to the team.
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Wednesday, May 23, 2012
Nordson MARCH, plasma processing technology, announces the appointment of Carla Loeffler to the position of western regional sales manager. Carla will provide sales and application support for Nordson MARCH's advanced plasma treatment systems for the semiconductor, printed circuit board (PCB), life science, hard disk drive, LED, and solar/photovoltaic industries.
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Wednesday, May 23, 2012
XJTAG today releases version 2.7 of its industry-leading boundary scan software which is now available with network licensing, allowing corporations to share the use of their XJTAG licences across multiple sites nationally or internationally.
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Wednesday, May 23, 2012
“New MEMS devices will benefit from the mobile device growth that is predicted for the coming years: phones and tablet will represent a 2.9B units in 2017 and most of them will integrate 5 to 10 MEMS devices”, announces Laurent Robin, Activity Leader, Inertial MEMS Devices & Technologies, Yole Développement.
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Tuesday, May 22, 2012
The Surface Mount Technology Association (SMTA) is accepting nominations for the 2012 SMTA Member of Distinction Awards. The awards honor members who have shown exceptional service to the association and the industry.
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Wednesday, May 23, 2012
The Wolfram Group announced the release of Wolfram SystemModeler--the high-fidelity modeling environment that uses versatile symbolic components and computation to drive design efficiency and innovation. Traditional systems have focused on optimization just within the modeling feedback loop.
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Wednesday, May 23, 2012
Linear Technology Corporation announces the H- and MP-grade versions of the LTC3787. This high power two-phase single output synchronous step-up DC/DC controller replaces the boost diodes with high efficiency N-channel MOSFETs, eliminating the heat sink typically required in medium to high power boost converters.
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Wednesday, May 23, 2012
The RF65x9 series of Transmit/Receive Modules integrate a complete solution in a single Front-End Module (FEM) for AMI/AMR and Smart Grid solutions. The FEMs integrate a PA, transmit (Tx) filtering, input and output switches, a Tx or receive (Rx) attenuation path, and an LNA with bypass mode. Single-ended input and output are included for optimized ease of use and implementation.
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Wednesday, May 23, 2012
The BVM Group has announced the LE-379, a 3.5 inch SBC based around the latest processors for embedded systems, the Intel Atom Cedar Trail next generation 32nm dual core family.
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Wednesday, May 23, 2012
C&K Components, a global manufacturer of pushbutton switches, tact switches, toggle and rocker switches, and smart card interconnect devices, has designed a D-sub connector that features a fast locking system for space applications. The highly reliable fast locking D-sub connector is the only device on the market that meets ESA qualification standards.
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Wednesday, May 23, 2012
3M’s Optical Systems Division revealed that its 3M™ FTB3-50 and FTB3-125 films—flexible, optically clear films that protect sensitive electronics from water vapor and oxygen—are now commercially available. Previously, these films had been sold primarily under limited research-and-development agreements. FTB3 (for flexible, transparent, barrier) film has application in a range of emerging display technologies.
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Tuesday, May 22, 2012
Photo Stencil, a full-service provider of high-performance stencils and tooling, has just taken delivery of its third stencil laser cutting system at its facility in Penang, Malaysia. The Tannlin TX with automatic optical inspection increases stencil production capacity and capabilities. Photo Stencil's Malaysia facility serves the solar, semiconductor packaging, and printed circuit board industries in Asia.
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Tuesday, May 22, 2012
DENSO announced the introduction of ISO 5 (class 100) cleanroom versions of its new VS-Series six-axis articulated robots. The new VS-Series robots offer the world’s highest speed and precision in their class, with cycle times from 0.37 to 0.33 sec. and repeatability from ±0.03 to ±0.02 mm. Reaches are from 500 to 900 mm and payload capacities from 4 to 7 kg.
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Friday, September 30, 2011
ZESTRON have been developing customized solutions for precision cleaning applications for more than 30 years.
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Friday, August 12, 2011
Everett Charles Technologies is a subsidiary of Dover Corporation, a leading manufacturer of electrical test products and services, including Pogo® test contacts, semiconductor test products, bare-board automatic test systems and bare and loaded PCB test fixtures.
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Wednesday, July 6, 2011
Automated Circuit Design (ACD) of Richardson, Texas, is one of the most dynamic and fast growing design and contract assembly companies in the greater southwest.
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Friday, June 3, 2011
Computrol is one of Idaho’s best kept secrets.
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Friday, April 22, 2011
Mike Konrad is probably one of the best-known faces in the cleaning industry.
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Tuesday, April 5, 2011
The Swiss machine manufacturer Essemtec is a market leader in manufacturing flexible production systems for industrial users.
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Friday, September 30, 2011
Over the last few years, there has been an increase in the evaluation and use of halogen-free soldering materials.
Friday, September 30, 2011
A PCB fails final test. Why? Was it the solder paste? The screen printer? The PCB assembly machine? The reflow oven or none of the above?
Thursday, September 29, 2011
Companies are constantly striving to reduce costs incurred during electronics production in order to increase cost effectiveness.
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| The Custers |
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Crystal ball: second half 2010 and 2011
The global electronic industry recovered significantly in the second quarter, but uncertainty lies ahead due to fragile economics, possible component inventory builds and weakening end market demand.
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| Bob Willis |
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BGA optical joint inspection criteria
Visual examination of ball grid array (BGA) solder joints is best achieved using an enderscope system, available from a number of suppliers world wide.
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SMT Hybrid Packaging
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 SMT Hybrid Packaging celebrates 25th anniversary
In 2012 SMT Hybrid Packaging celebrates the 25th jubilee. With companies like Heraeus, ERNI, ERSA, Multi-Components, SEHO and Systronic there will be companies in Nuremberg who are exhibiting since the first exhibition in 1987. This year over 530 companies will present the latest trends and products in the field of System Integration in Micro Electronics from 8-10 May in Nuremberg. http://www.mesago.de/en/SMT/home.htm
Visit our show central area for SMT Hybrid Packaging 2012 to see what's in store.
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NEPCON China 2012
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 Thank you for your participation at NEPCON China 2012.
This is the 2nd reminder of onsite noise control for your kind attention.
As part of our customer service program, we would like to seek your support and co-operation to control the sound level of your speakers and audio/visual display
in your booth in order to ensure a smooth and successful event:
Please ensure that sound level of your booth is being controlled below 75 decibel. It should not cause any interference or annoyance to visitors or other Exhibitors.
Please also place your speakers and other sound devices in a position where direct sound will be channeled into your booth and not the aisles.
The Organizer will reserve the right to reduce the sound level or switch off audio / visual displays causing problems if the sound level is over 75 decibel.
We urge your best understanding and cooperation on the above rules, which is to ensure we jointly build a friendly and comfortable environment for your own business networking on-site.
Thank you very much for your kind attention. Should you have any further inquiries, please feel free to contact your Reed representatives or our customer servicing hot line at: 86 21 2231 7015.
We wish you all the best at NEPCON China 2012.
Visit our show central area for NEPCON China 2012 to see what's in store.
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IPC APEX Expo 2012
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 IPC APEX Expo, William Shatner to Keynote IPC APEX EXPO 2012
Shatner’s opening keynote address on Tuesday, February 28, is free to all registered IPC APEX EXPO attendees. Following his keynote, he will sign copies of his latest book which will be available for purchase on-site. The IPC APEX EXPO conference and exhibition will run February 28–March 1, 2012; standards development meetings, professional development courses and other show activities will take place February 26–March 1. For more information on IPC APEX EXPO or to register, visit www.IPCAPEXEXPO.org
Visit our Show Central area for IPC APEX 2012 to see what's in store.
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SMTA International Electronics Exhibition 2011
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 SMTA International (SMTAI) 2011 boasts the electronics assembly industry's strongest technical conference and an extensive exhibition. The quality of technical information and networking offered at this event gives your company the advantage to become more competitive, profitable and successful. SMTAI will be held Oct. 16 - 20, 2011 (conference) / Oct. 18 - 19, 2011 (exhibition), at the Fort Worth Convention Center in Fort Worth, Texas.
Don't miss Global SMT & Packaging's VIP Celebrity Jeopardy Wednesday, October 19th at 2:00pm in the Exhibit Hall Theater. We're pitting last year's champ, Kyzen's Tom Forsythe, against Mike Konrad of Aqueous Technologies and Hal Hendrickson of Nordson DAGE.
Visit our Show Central area for SMTAI 2011 to see what's in store on the show floor.
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Productronica 2011
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 Productronica is the world’s leading international trade fair for innovative electronics production. It is the only event of its kind that covers the complete range of current and forward-looking products, technologies and system solutions in their entire breadth and depth and along the entire value-added chain. As a result, it is the industry's largest and most important gathering. Held November 15-18, 2011 in Nuremberg, Germany. Visit our Productionica show page to see what's instore on the show floor.
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Industry News