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Call for Papers

SMT Hybrid 2013


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Panel of Experts

The Custers
February “bump in the road” hopefully followed by spring upturn

February was a bad month for the global electronics industry—especially in SE Asia.  Lunar New Year shutdowns, some “adjustments” to the Apple supply chain and normal post-Christmas seasonality combined to create a major contraction in February. 
Although “recovery” was underway in late 2012, Chinese, Taiwanese and European PMI manufacturing indices contracted in February.  This PMI decline was reflected in Taiwan/China electronic equipment shipments as they plunged below their February 2012 levels. appears to be unsustainable. 

Read More

Keith Bryant
San Diego or Bust!

I must say I love San Diego as an event location, lots of hotels and places to eat close by, great transport links, and during APEX the local area has a buzz about it, which is great for exhibitors and visitors. Productronica is also a great show, but everyone is scattered throughout Munich and its suburbs. Here you cannot go into any hostelry without seeing a face or two that you recognize; indeed The Field becomes the APEX afterparty for the whole show. 

Read More

Joe Fjelstad
Thermal design validation techniques

Heat is the bane of semiconductor devices, and yet it is a natural byproduct of their operation. There is in fact an inverse relationship between product reliability and the range and number of number thermal excursions experienced by a semiconductor device; thus knowing what kind of thermal challenge is presented by a particular design is key to
addressing and solving the problem in an intelligent and proactive way.

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Craig Hillman
What’s the secret to tin whiskers?

Most of the electronics industry by now knows about tin whiskers (hello, Toyota anyone?). They know whiskers are metallic filaments that emanate from the surface of tin platings.
They know these filaments are conductive and can cause shorts across adjacent conductors. And they know that these shorts can cause some really bad failures.
But with all of this knowledge, the industry is still struggling on how to predict and prevent these “Nefarious Needles of Pain.”

Read More

Events News

PCIM Europe 2013 continues to expand Friday, May 17, 2013 PCIM Europe has come to an end with a very positive outcome: a significant incr...
SMTA, IPC to co-locate fall events Friday, May 17, 2013

The Surface Mount Technology Association and IPC — Association Connecting ...

BPM Microsystems to bring its 8th Generation universal device programmers to DAC 2013 Friday, May 17, 2013 BPM Microsystems announces that it will exhibit its award-winning 2800ISP paral...

Show Central

SMT Hybrid Packaging 2013

Once again SMT Hybrid Packaging acts as a platform providing comprehensive information on innovations, products and solutions in the field of System Integration in Micro Electronics. From 16 – 18 April 2013 visitors will find well-known companies such as ASYS, Assembleon, AAT Aston, Heraeus, KSG Leiterplatten, LPKF and Yamaha in Nuremberg, Germany. Moreover, numerous first time as well as small- and medium-sized exhibitors will be present on the show.

Visit our Show Central area for SMT Hybrid Packaging 2013 to see what's in store on the show floor.

More information about SMT Hybrid Packaging is available at www.smt-exhibition.com

IPC APEX Expo 2013

Delivering answers, solutions and opportunities for future innovation in electronics manufacturing, IPC APEX EXPO® 2013  will take place February 19–21, at the San Diego Convention Center. Information and online registration are now available. www.IPCAPEXEXPO.org

Unlike any other show, IPC APEX EXPO hosts an exhibition with more than 400 of the industry’s top suppliers, professional development courses, standards development meetings, executive management meetings as well as the world’s most highly selective technical conference in electronics manufacturing. 

Visit our Show Central area for IPC APEX Expo 2013 to see what's in store on the show floor.

SMTA International Electronics Exhibition 2012

SMTAI_Logo_277x80SMTA International (SMTAI) 2012 boasts the electronics assembly industry's strongest technical conference and an extensive exhibition. The quality of technical information and networking offered at this event gives your company the advantage to become more competitive, profitable and successful. SMTAI will be held Oct. 14 - 18, 2012 (conference) / Oct. 16 - 18, 2012 (exhibition), at the Walt Disney World Dolphin Hotel, Orlando Florida.

Visit our Show Central area for SMTAI 2012 to see what's in store on the show floor.

NEPCON South China 2012

NEPCON_South_China_12NEPCON South China 2012 will take place between August 28 and August 30 at the Shenzhen Convention & Exhibition Center. As the largest and longest-running SMT exchange platform in South China, the annual event is a popular industry highlight.  To date, several electronics manufacturers have accepted invitations to exhibit at the event, many of them giants of global electronics manufacturing. More

Visit our Show Central area for NEPCON South China 2012 to see what's in store on the show floor.

For more details on NEPCON South China 2012, please visit www.nepconsouthchina.com

SMT Hybrid Packaging

smtpSMT Hybrid Packaging celebrates 25th anniversary
In 2012 SMT Hybrid Packaging celebrates the 25th jubilee. With companies like Heraeus, ERNI, ERSA, Multi-Components, SEHO and Systronic there will be companies in Nuremberg who are exhibiting since the first exhibition in 1987. This year over 530 companies will present the latest trends and products in the field of System Integration in Micro Electronics from 8-10 May in Nuremberg. http://www.mesago.de/en/SMT/home.htm

 

 

Visit our show central area for SMT Hybrid Packaging 2012 to see what's in store.

NEPCON China 2012

NEPCON_China_2012Thank you for your participation at NEPCON China 2012.

This is the 2nd reminder of onsite noise control for your kind attention.

As part of our customer service program, we would like to seek your support and co-operation to control the sound level of your speakers and audio/visual display

in your booth in order to ensure a smooth and successful event:

Please ensure that sound level of your booth is being controlled below 75 decibel. It should not cause any interference or annoyance to visitors or other Exhibitors.  

Please also place your speakers and other sound devices in a position where direct sound will be channeled into your booth and not the aisles.

The Organizer will reserve the right to reduce the sound level or switch off audio / visual displays causing problems if the sound level is over 75 decibel.

We urge your best understanding and cooperation on the above rules, which is to ensure we jointly build a friendly and comfortable environment for your own business networking on-site.

Thank you very much for your kind attention. Should you have any further inquiries, please feel free to contact your Reed representatives or our customer servicing hot line at:  86 21 2231 7015.

We wish you all the best at NEPCON China 2012.

Visit our show central area for NEPCON China 2012 to see what's in store.

IPC APEX Expo 2012

IPC APEX Expo 2011IPC APEX Expo, William Shatner to Keynote IPC APEX EXPO 2012
Shatner’s opening keynote address on Tuesday, February 28, is free to all registered IPC APEX EXPO attendees. Following his keynote, he will sign copies of his latest book which will be available for purchase on-site. The IPC APEX EXPO conference and exhibition will run February 28–March 1, 2012; standards development meetings, professional development courses and other show activities will take place February 26–March 1. For more information on IPC APEX EXPO or to register, visit www.IPCAPEXEXPO.org

Visit our Show Central area for IPC APEX 2012 to see what's in store.

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