With the Open Source Workshop on Wednesday, 6 May 2015 in the afternoon, SMT Hybrid Packaging 2015 presents a new workshop concept. Unlike other workshops, all participants actively discuss three different subject areas of the “Challenges of 3D-IC Integration for PCB Technologies”. Each group is supervised by a moderator who guides the time-limited discussions in the respective subject areas. After the show, the results will be summarized and made available to the participants.
Visit our Show Central area for SMT Hybrid Packaging to see what's in store on the show floor.