Teknek is unique in its sector in that it is the only contact cleaning company that produces its own cleaning rollers. In the last twelve months it has manufactured over 10,000 rollers. It also produces its own unique sheeted adhesive rolls producing over 1.5million sq. metres per annum. This experience and capacity allow Teknek to offer products which easily meet or exceed recognised quality standards.
Microscan, a global technology leader in barcode, machine vision and lighting solutions, announces that its HS-41X Handheld DPM Imager has won a 2013 Ringier Technology Innovation Award in the Pumps & Valves Industry category. Pako Pang, Field Applications Engineer at Microscan’s regional office in Shanghai, accepted the award for Microscan during a ceremony at IE expo 2013 held in the Shanghai New International Expo Center on May 14, 2013.
The element14 community celebrates its 4th birthday, and to mark the occasion, members can test their brain power by taking part in a fun competition over the next two weeks. Members are being encouraged to flex their mental muscles in a brainteaser competition on the community with three winners being selected per week to win a Freescale SabreLite development kit.
Pillarhouse International announced that it has achieved an annualized average growth rate of over 21% for the past three consecutive years, with each year being a new record for gross sales. Pillarhouse continues to maintain its dominant market share and has accelerated expansion into several new markets in 2013. At the conclusion of the fiscal year, Pillarhouse was actively selling into 46 countries.
ESCATEC, the EMS innovator, has just installed a Nikon XTV160 2.5D X-Ray inspection system as part of its continual upgrade programme. This €150,000 installation is used for inspecting solder joint quality of PCBA for hidden interconnections and features, like BGA balls, QFN interconnections or bond wires.
LPKF is one of the leading global suppliers of laser welding systems for plastics. This product area has been growing rapidly for a number of years. Revenue growth was hindered recently due to capacity bottlenecks at the location of Erlangen.This week the board of directors of the LPKF Group sealed the planned move to a new production and office building by signing a purchase contract. At around 10,000 m² the new premises in Fürth is more than twice as big as the previous location and offers further potential for expansion.
Both companies utilize similar operations which incorporate synchronous flow manufacturing to provide medium volume customers with minimal production cycle times and schedule flexibility. The JV will incorporate the Lean manufacturing approach, as well. The JV will also capitalize on the companies’ complementary purchasing strategies and synergies.
Peak Production Equipment Ltd., the test-fixture manufacturer and systems integrator of in-circuit and functional test systems, has been promoted to Select Member status of GOEPEL electronic’s global alliance program GATE™ (GOEPEL Associated Technical Experts). Under the terms of the GATE program, members receive application-specific transfer of GOEPEL electronic’s product expertise in the area of JTAG/Boundary Scan utilisation, as well as participating in the joint development of customised automated test systems incorporating these technologies.
Linear Technology announces the high temperature H-grade (-40°C to 150°C junction temperature) and high reliability MP-grade (-55°C to 150°C) version of the LTC3115-1 in a 20-lead thermally enhanced TSSOP package. The LTC3115-1 is a synchronous buck-boost converter that delivers up to 2A of continuous output current from a wide range of power sources from single-cell Li-Ion to 24V/28V industrial rails to 40V automotive inputs.
EV Group (EVG), a supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics industry and wholly owned subsidiary of Eastman Chemical Company, introduced CoatsClean™—an innovative single-wafer photoresist and residue removal technology designed to address thick films and difficult-to-remove material layers for the 3D-ICs/through-silicon vias (TSVs), advanced packaging, microelectromechanical systems (MEMS) and compound semiconductor markets.
GOEPEL electronic offers an enhanced version of its system for the automated optical inspection of fluorescing conformal coating. The TOM system (Teachable Optical Measurement) can be utilized for inspection of PCB coatings as well as PCB areas, which mustn’t be coated. The maximum PCB size is 460 X 400 mm.
Engineered Material Systems, Inc., a global supplier of negative photoresist materials for MEMs and IC cooling applications, introduces NR-2500 Liquid Negative Photoresist for use in micro-electromechanical systems (MEMS). This material formulation has been optimized for spin coating and processing on MEMS and IC wafers.
Many are unaware that 50-80% of wave solder dross is usable solder alloy. The SEPARO solder recovery system from Manncorp allows companies to quickly and easily reclaim valuable solder in-house for significant cost savings. With the SEPARO solder recovery system, a shift's worth of wave solder dross can be turned into usable solder ingots in under an hour.
ASYS Group is proud to announce an upgraded feature set now offered in the XACT 3 Screen and Stencil Printers. The XACT 3 is a part of the expanded SERIO family of EKRA printers, and represents a value-oriented entry into the in-line printing process.
Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, announces the debut of its 357-284 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications. This new encapsulant/adhesive is designed to protect wire bonds and reduce stresses associated with thermal cycling. This material has excellent chemical resistance to inks.
Pulse Electronics Corporation (NYSE: PULS), a provider of electronic components, introduces the mLUX Translucent Flex Antenna, which enables more innovative, creative, and impressive design effects for mobile devices. The mLUX is an invisible antenna concept. It allows light and color to shine through the translucent device cover, offering multiple options for industrial design. When integrated into the display, the antenna enables increased use of metal on the back cover of the handset.
Trevor Galbraith had a chance to sit down with Semblant CEO Steven Lowder at SMTA International in Orlando. Semblant develops nanomaterials process solutions for the electronics industry using a fusion of science and engineering that blends the disciplines of chemistry and physics with mechanical and electrical engineering.
MYDATA are one of the leading manufacturers of mid-range, high-mix pick ‘n place machines and specialty printers in the world. Trevor Galbraith interviews MYDATA’s Senior Vice President and General Manager, Robert Goethner at SMT/Hybrid/Packaging in Nuremberg, Germany.
Bernd Lange is the chief technology officer for LPKF Laser & Electronics. We spoke at their booth at SMT HYBRID PACKAGING in Nuremberg earlier this year about the latest developments of two of their newest, most exciting products,
GPD Global has a unique technology for precise control of volumetric fluids from water up to 70,000 centipoise. Trevor Galbraith spoke to GPD’s President and CEO, Sven Wedekin at APEX about their technology and plans for the future.
Jennifer Category: Cleaning (3 answers) We have a customer that believes that multiple wash steps (three) degrades the value of an 0805 resistor. We have never had this issue before?? I am at a loss. Any suggestions?
These days, we can find microcapsules in almost every industrial sector, where they take numerous roles. However, dispensing these fragile materials can be a problem since clearly it is important that the microcapsules be undamaged by the dispensing process. In adhesive technology, microcapsules can fulfil several functions. For example, microcapsules may be an integral part of the control of reaction and curing processes.
The first quarter of 2013 was challenging for most companies in the global electronic supply chain. Economic conditions were weak world-wide at the beginning of the year. Based upon regional Purchasing Managers 3/12 growth rates (comparing 1Q’13 to 1Q’12), China ended the first quarter very slightly in an expansion mode, but the other key regions in Chart 1 were still contracting.
They say travel broadens the mind; if so, I must now be more broad-minded than Hugh Heffner (much younger too!). The global show calendar becomes more congested each year, and it is now at a point where companies have to chose which major shows to focus on and which to miss, so this would indicate that the market is beyond saturation point. As a new show appears it is now simply dissecting the exhibitors and audience.
The use of structural metal in the manufacture of electronic circuits has been a part of the electronics’ industry technology toolkit for many decades. For example, metal chassis structures were required and used in the early days of the electronics industry to both support the weight and handle the heat generated by the vacuum tube components which were the transistors of their day.
Electrolytic capacitors are the ancients of the electronics world. They were discovered, patented, and used long before diodes, printed circuit boards, and surface mount technology. While more recently surpassed in production volume by their smaller cousins, the ceramic capacitor, aluminum electrolytic capacitors (E-caps) are still the work house of power conversion designs.
Once again SMT Hybrid Packaging acts as a platform providing comprehensive information on innovations, products and solutions in the field of System Integration in Micro Electronics. From 16 – 18 April 2013 visitors will find well-known companies such as ASYS, Assembleon, AAT Aston, Heraeus, KSG Leiterplatten, LPKF and Yamaha in Nuremberg, Germany. Moreover, numerous first time as well as small- and medium-sized exhibitors will be present on the show.
Delivering answers, solutions and opportunities for future innovation in electronics manufacturing, IPC APEX EXPO® 2013 will take place February 19–21, at the San Diego Convention Center. Information and online registration are now available. www.IPCAPEXEXPO.org
Unlike any other show, IPC APEX EXPO hosts an exhibition with more than 400 of the industry’s top suppliers, professional development courses, standards development meetings, executive management meetings as well as the world’s most highly selective technical conference in electronics manufacturing.
Visit our Show Central area for IPC APEX Expo 2013 to see what's in store on the show floor.
SMTA International Electronics Exhibition 2012
SMTA International (SMTAI) 2012 boasts the electronics assembly industry's strongest technical conference and an extensive exhibition. The quality of technical information and networking offered at this event gives your company the advantage to become more competitive, profitable and successful. SMTAI will be held Oct. 14 - 18, 2012 (conference) / Oct. 16 - 18, 2012 (exhibition), at the Walt Disney World Dolphin Hotel, Orlando Florida.
NEPCON South China 2012 will take place between August 28 and August 30 at the Shenzhen Convention & Exhibition Center. As the largest and longest-running SMT exchange platform in South China, the annual event is a popular industry highlight. To date, several electronics manufacturers have accepted invitations to exhibit at the event, many of them giants of global electronics manufacturing. More
SMT Hybrid Packaging celebrates 25th anniversary In 2012 SMT Hybrid Packaging celebrates the 25th jubilee. With companies like Heraeus, ERNI, ERSA, Multi-Components, SEHO and Systronic there will be companies in Nuremberg who are exhibiting since the first exhibition in 1987. This year over 530 companies will present the latest trends and products in the field of System Integration in Micro Electronics from 8-10 May in Nuremberg. http://www.mesago.de/en/SMT/home.htm
IPC APEX Expo, William Shatner to Keynote IPC APEX EXPO 2012 Shatner’s opening keynote address on Tuesday, February 28, is free to all registered IPC APEX EXPO attendees. Following his keynote, he will sign copies of his latest book which will be available for purchase on-site. The IPC APEX EXPO conference and exhibition will run February 28–March 1, 2012; standards development meetings, professional development courses and other show activities will take place February 26–March 1. For more information on IPC APEX EXPO or to register, visit www.IPCAPEXEXPO.org