FCT Assembly announced that Field Application Engineer Tony Lentz has joined several IPC task groups. As part of the subcommittee, Lentz will assist with the development of IPC documents, Joint Industry Standards, and Internationally Recognized Standards (ISO) for materials used in the assembly and joining processes.
Over the last year, the Executive Council of IMAPS (International Microelectronics Assembly and Packaging Society) has conducted extensive and thorough economic and financial analysis regarding a move of the Society office outside of the Washington, DC area for a location more suited for growth and enhanced service. Much evaluation and discussion of multiple scenarios and sites across the US were conducted.
CVD Equipment Corporation (NASDAQ): CVV) announces revenue and earnings for the three months ended March 31, 2013. On revenue of approximately $3,450,000 for the three months ended March 31, 2013 the company recorded a net loss of approximately ($440,000) or a ($0.07) per basic and diluted share loss.
TR Fastenings is celebrating 40 successful years at the forefront of the fastener industry this month with the expectation that year-end operating profits will have grown for the fourth year in succession since the appointment of a new Board in 2009, and that it is on track to double profitability by 2016 through a combination of new acquisitions and new product ranges, rolling out sales to more than 500 assembly sites around the world.
Saline Lectronics, Inc., a leading domestic contract manufacturer, announces that President and CEO Mario Sciberras recently was featured on Ann Arbor SPARK’s CEO Podcast for a conversation about economic opportunity. The podcast is now available at http://www.annarborusa.org/podcasts In his conversation with Paul Krutko, president and CEO of Ann Arbor SPARK, Mario talks about the importance of programs such as Pure Michigan Business Connect and why the region has been the ideal location to grow his company.
The certification program is customized to future application purposes. It comprises intensive training for several days dealing with the theoretical principles of JTAG/Boundary Scan and pursuing Embedded System Access (ESA) technologies (VarioTAP, ChipVORX…) as well as practical work with example projects. The final assessment, verifying the learning progress, is a substantial part of the certification.
ADLINK Technology, Inc., a trusted global source of embedded building blocks and application-ready platforms, announced new leadership for its global business unit with the addition of Dirk Finstel as Executive Vice President of MCPS and CEO of ADLINK´s European headquarters, Lippert ADLINK Technology GmbH in Mannheim, Germany. He brings over 22 years of experience in embedded computing, with a strong background in computer-on-module technologies and application-ready platforms.
SEHO Systems GmbH, a worldwide leading manufacturer of automated soldering systems and customer-specific solutions, announces that the company is one of the first in the industry to achieve Authorised Economic Operator (AEO) status as designated by the European Commission Taxation and Customs Union.
The GX7200 features the most slots in the industry and requires only a single slot for the controller, providing 20-slots for supporting PXI-1, PXI-hybrid, and PXIe modules. The backplane architecture supports the use of both x1 or x4 system controllers and the system power supply provides 900 watts of system power.
Fisnar Inc., Free Robot Trial Service provides an opportunity to first prove an automated dispensing application using a Fisnar robot before purchasing equipment or allocating engineering time to justify an investment. Fisnar’s Engineers will help select the right robot for an application and provide integration advice completely FREE. Only shipping costs will be charged.
The McDry DXU models maintain one percent RH levels and the MCU models maintain three percent RH levels. All McDry Ultra-Low Humidity Storage Cabinets conform to IPC/JEDEC J-STD 033C and IPC 1601 Standards. Additionally, the ESD-Safe Design adheres to the IEC-61340-5-1 (ESD) Standard. McDry cabinets dehumidify ICs to prevent micro-cracking and are an alternative to baking, MBBs and Nitrogen storage.
Oven Industries' is now offering a High Powered Temperature Controller mounted on a heat sink that creates a seamless transition between heating and cooling devices, as it serves as the commander of thermoelectric modules. With a bi-directional or unidirectional H-bridge configuration, the controller has many benefits. The included, user-friendly PC software makes it quick and simple for users to change any temperature control configurations, which eliminates signal interference or errant signals.
By downloading the latest BPWin software release, 3000 and 4000 series users with a laser marker can mark an additional line of text that specifies the programming socket location. This feature can help trace the programmed device back to the specific programming socket location for improved traceability and quality assurance. The socket location laser mark feature is an enhancement over previous software versions that allowed customers to mark serial numbers and date and time.
Molex Incorporated supports challenging industrial automation, aerospace and defense network connectivity with its compact Brad® Nano-Change® (M8) connectors. The rugged Nano-Change product line offers the industry’s broadest selection of space-saving connectors, cordsets, receptacles, inserts, splitters and molded junction boxes for sensor and actuator applications.
Formulated for medical device applications, MasterSil 153Med passes USP Class VI and ISO 10993-5 testing. This two part silicone with a paste consistency features a convenient one to one mix ratio by weight, and does not require exposure to air and humidity for cross-linking. It has a long working life of 5-7 hours and will not outgas while curing. As is true with most silicones, MasterSil 153Med delivers high temperature resistance up to 400°F and superior flexibility.
The eagerly anticipated Raspberry Pi camera board is making its debut with element14 enabling pictures and video to be taken with the Raspberry Pi which can be used for security and VoIP projects as well as image and video capture. One of a strong pipeline of exclusive Raspberry Pi accessories to be launched this year, the camera board, which retails at $25 is available through Newark element14 and MCM in North America, Farnell element14 in Europe, CPC in the UK and Ireland and element14 in Asia Pacific.
Trevor Galbraith had a chance to sit down with Semblant CEO Steven Lowder at SMTA International in Orlando. Semblant develops nanomaterials process solutions for the electronics industry using a fusion of science and engineering that blends the disciplines of chemistry and physics with mechanical and electrical engineering.
MYDATA are one of the leading manufacturers of mid-range, high-mix pick ‘n place machines and specialty printers in the world. Trevor Galbraith interviews MYDATA’s Senior Vice President and General Manager, Robert Goethner at SMT/Hybrid/Packaging in Nuremberg, Germany.
Bernd Lange is the chief technology officer for LPKF Laser & Electronics. We spoke at their booth at SMT HYBRID PACKAGING in Nuremberg earlier this year about the latest developments of two of their newest, most exciting products,
GPD Global has a unique technology for precise control of volumetric fluids from water up to 70,000 centipoise. Trevor Galbraith spoke to GPD’s President and CEO, Sven Wedekin at APEX about their technology and plans for the future.
Jennifer Category: Cleaning (3 answers) We have a customer that believes that multiple wash steps (three) degrades the value of an 0805 resistor. We have never had this issue before?? I am at a loss. Any suggestions?
These days, we can find microcapsules in almost every industrial sector, where they take numerous roles. However, dispensing these fragile materials can be a problem since clearly it is important that the microcapsules be undamaged by the dispensing process. In adhesive technology, microcapsules can fulfil several functions. For example, microcapsules may be an integral part of the control of reaction and curing processes.
February was a bad month for the global electronics industry—especially in SE Asia. Lunar New Year shutdowns, some “adjustments” to the Apple supply chain and normal post-Christmas seasonality combined to create a major contraction in February. Although “recovery” was underway in late 2012, Chinese, Taiwanese and European PMI manufacturing indices contracted in February. This PMI decline was reflected in Taiwan/China electronic equipment shipments as they plunged below their February 2012 levels. appears to be unsustainable.
I must say I love San Diego as an event location, lots of hotels and places to eat close by, great transport links, and during APEX the local area has a buzz about it, which is great for exhibitors and visitors. Productronica is also a great show, but everyone is scattered throughout Munich and its suburbs. Here you cannot go into any hostelry without seeing a face or two that you recognize; indeed The Field becomes the APEX afterparty for the whole show.
Heat is the bane of semiconductor devices, and yet it is a natural byproduct of their operation. There is in fact an inverse relationship between product reliability and the range and number of number thermal excursions experienced by a semiconductor device; thus knowing what kind of thermal challenge is presented by a particular design is key to addressing and solving the problem in an intelligent and proactive way.
Most of the electronics industry by now knows about tin whiskers (hello, Toyota anyone?). They know whiskers are metallic filaments that emanate from the surface of tin platings. They know these filaments are conductive and can cause shorts across adjacent conductors. And they know that these shorts can cause some really bad failures. But with all of this knowledge, the industry is still struggling on how to predict and prevent these “Nefarious Needles of Pain.”
Once again SMT Hybrid Packaging acts as a platform providing comprehensive information on innovations, products and solutions in the field of System Integration in Micro Electronics. From 16 – 18 April 2013 visitors will find well-known companies such as ASYS, Assembleon, AAT Aston, Heraeus, KSG Leiterplatten, LPKF and Yamaha in Nuremberg, Germany. Moreover, numerous first time as well as small- and medium-sized exhibitors will be present on the show.
Delivering answers, solutions and opportunities for future innovation in electronics manufacturing, IPC APEX EXPO® 2013 will take place February 19–21, at the San Diego Convention Center. Information and online registration are now available. www.IPCAPEXEXPO.org
Unlike any other show, IPC APEX EXPO hosts an exhibition with more than 400 of the industry’s top suppliers, professional development courses, standards development meetings, executive management meetings as well as the world’s most highly selective technical conference in electronics manufacturing.
Visit our Show Central area for IPC APEX Expo 2013 to see what's in store on the show floor.
SMTA International Electronics Exhibition 2012
SMTA International (SMTAI) 2012 boasts the electronics assembly industry's strongest technical conference and an extensive exhibition. The quality of technical information and networking offered at this event gives your company the advantage to become more competitive, profitable and successful. SMTAI will be held Oct. 14 - 18, 2012 (conference) / Oct. 16 - 18, 2012 (exhibition), at the Walt Disney World Dolphin Hotel, Orlando Florida.
NEPCON South China 2012 will take place between August 28 and August 30 at the Shenzhen Convention & Exhibition Center. As the largest and longest-running SMT exchange platform in South China, the annual event is a popular industry highlight. To date, several electronics manufacturers have accepted invitations to exhibit at the event, many of them giants of global electronics manufacturing. More
SMT Hybrid Packaging celebrates 25th anniversary In 2012 SMT Hybrid Packaging celebrates the 25th jubilee. With companies like Heraeus, ERNI, ERSA, Multi-Components, SEHO and Systronic there will be companies in Nuremberg who are exhibiting since the first exhibition in 1987. This year over 530 companies will present the latest trends and products in the field of System Integration in Micro Electronics from 8-10 May in Nuremberg. http://www.mesago.de/en/SMT/home.htm
IPC APEX Expo, William Shatner to Keynote IPC APEX EXPO 2012 Shatner’s opening keynote address on Tuesday, February 28, is free to all registered IPC APEX EXPO attendees. Following his keynote, he will sign copies of his latest book which will be available for purchase on-site. The IPC APEX EXPO conference and exhibition will run February 28–March 1, 2012; standards development meetings, professional development courses and other show activities will take place February 26–March 1. For more information on IPC APEX EXPO or to register, visit www.IPCAPEXEXPO.org