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Debasish Choudhury
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Paul Chen
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SMT Hybrid 2014 Gallery

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Productronica 2013, Munich, Germany


Panel of Experts

The Custers
2014 Ends with Selective Optimism; 2015 Faces Challenges

Electronic equipment demand improved selectively in late 2014 as China/Taiwan reached record high output. Taiwan-listed OEMs reported a
November 2014/Nov 2013 sales increase of 7% as Taiwan ODM company’s November revenues rose 11%. Both these company groups do significant manufacturing in China.

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Joe Fjelstad
Component carrier material selection for SAFE product designs

The last two columns focused on electronic component issues related to solderless assembly for electronics (SAFE). They stressed the importance of making thoughtful, proactive decisions in component selection rather than reactive ones, or using whatever happens to pop up first in a component search. 

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Craig Hillman
Physics of failure

When I tell people that I am a practitioner of physics of failure, the response is typically predictable:
I either get a blank look, or a large smile breaks out as if landsman has been discovered after many years in the wilderness.
What is physics of failure? In some respects, that is a good question. Historically, there are some nice academic definitions that will tend to put you to sleep.  

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Show Central

NEPCON China 2015

From April 21 to April 23, 2015, at the Shanghai World Expo Exhibition & Convention Center, the 25th edition of NEPCON China will bring together over 500 well-known electronics manufacturers from 22 countries and regions. Come to the show to discuss the latest industry trends and see the leading technologies with over 21,000 other visitors. Top quality and abundant opportunity await you at NEPCON China 2015!

Visit our Show Central area for NEPCON China 2015 to see what's in store on the show floor.

SMT Hybrid Packaging 2015

With the Open Source Workshop on Wednesday, 6 May 2015 in the afternoon, SMT Hybrid Packaging 2015 presents a new workshop concept. Unlike other workshops, all participants actively discuss three different subject areas of the “Challenges of 3D-IC Integration for PCB Technologies”. Each group is supervised by a moderator who guides the time-limited discussions in the respective subject areas. After the show, the results will be summarized and made available to the participants.

Visit our Show Central area for SMT Hybrid Packaging to see what's in store on the show floor.


Changing technologies that are driving the electronics industry will take center stage throughout the IPC APEX EXPO 2015 technical conference and professional development sessions, which will take place February 22-26 at the San Diego Convention Center in San Diego, California. Registration is now open at www.IPCAPEXEXPO.org

Visit our Show Central area for IPC APEX EXPO 2015 to see what's in store on the show floor.

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