The first IC manufacturer to join imec’s R&D program on emerging memory technologies, GLOBALFOUNDRIES completes the value chain of imec’s research platform, which fuels industry collaboration from technology up to the system level. GLOBALFOUNDRIES is joining a team with a leading fabless company (http://www2.imec.be/be_en/press/imec-news/qualcomm2013.html) and several worldwide equipment suppliers providing the complete infrastructure necessary for R&D on STT-MRAM.
STI Electronics, Inc. offers a wide variety of electronics assembly and solder training courses, ranging from commercial to high-reliability requirements including NASA for through-hole, surface mount and cable/harness assembly, as well as staking and conformal coating. STI is an IPC Approved Certification center for all currently available courses (IPC-A-600, IPC-J-STD-001, IPC-A-610, IPC-7711/7721, IPC/WHMA-620). Most courses can be customized to meet a specific need or requirement and can be conducted at a customers’ site, STI’s facility in Madison, AL, or the new Warner Robins, GA location.
Digicom Electronics, Inc., a technology and quality-driven electronics manufacturing services (EMS) company, announces the availability of its new, multi-faceted website. The website features video clips of each process stage, articles, and information to assist those seeking an EMS in making a more informed selection. Digicom specializes in turn-key electronics manufacturing solutions for small to high-volume production, complex prototypes, PCB assemblies, and complete box-build systems.
ACD, a supplier to the electronics industry, announced Khoi (Henry) Dao’s five-year anniversary with the company. Henry has been a Flying Probe Test Operator at ACD since 2008. Henry is always willing to help out in other departments and is very dependable. He is instrumental in providing ACD’s customers with confidence in receiving a quality, defect-free assembly. This is accomplished by the use of both single- and double-sided testers.
Following several years of sustained and unprecedented growth, Pektron Group Ltd enhances its production capacities with important investment in upgrading two production lines to include six Hitachi Sigma Series machines. This increases the total number of Hitachi placement systems to fourteen on site at Pektron’s Derby (UK) manufacturing facility.
IPC – Association Connecting Electronics Industries® has teamed up with PCB Libraries, Inc. to provide updated library documentation and more powerful PCB library tools to support users of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. IPC-7351B now incorporates the new PCB Libraries Footprint Expert, a land pattern calculation tool that includes a library of more than 5,000 components. This library documentation conforms to the engineering rules established within IPC-7351B.
Dymax Corporation is pleased to announce the appointment of Marufur Rahim as R&D Manager. In his new position, Marufur will report to Stephen LaCroce, Director of Technology, and will manage the R&D Adhesives Laboratory, oversee manufacturing support, and establish new product development programs and objectives. He will be responsible for planning, budgeting, and implementing approved research and development activities as necessary for new product development, coordinate interdepartmental activities, and provide support to sales and application engineering.
ESCATEC has announced the appointment of Johan Halling as General Manager of ESCATEC Electronics Sdn, Bhd. and ESCATEC Medical Sdn. Bhd. in Penang, Malaysia, effective now. Based in a purpose-built, 10,000 square metre facility in the Free Trade Zone, the two operations employ over 900 people and produce millions of products every year for a wide range of customers around the world.
ADLINK Technology, Inc., a provider of machine vision platforms and boards, announced the release of its new EOS-1220 GigE Vision-compliant embedded vision system, featuring 3rd Generation Intel® Core™ i7 quad core processors, four independent PoE (power over Ethernet) ports, full compatibility with GigE Vision cameras and support for smart PoE APIs, allowing remote switching of PoE status. With high-end CPUs and multi-channel connectivity in a compact housing, the EOS-1220 is ideally suited to multi-camera imaging applications such as 3D robot guidance.
Olmec-UK has partnered with web handling specialists, Universal Converting Equipment Ltd, to produce a vision system capable of real-time measurement of laser machined holes in film. The vision system is mounted directly onto the web, which runs at 350m/min. Lasers are used to perforate the extruded web material with hole sizes from 30 – 120 µm depending on the particular requirement.
Cognex Corporation (NASDAQ: CGNX), the world's leading supplier of machine vision systems and software, announced the Cognex Industrial Camera (CIC) series, a new line of GigE Vision® digital industrial cameras designed for easy integration with VisionPro® and CVL® vision software. The first four models of the CIC series are compact (29mm x 29mm), monochrome, area scan cameras designed to address the most popular combinations of resolution, speed and pricing in the machine vision market. More models are planned for the future.
BPM Microsystems announces that with the release of BPWin version 5.32.0, tape loader users now have the option to advance their tape reel by millimeters, mils or pocket count at the end of a job for an improved teaching process.
The Large Hadron Collider (LHC) at the European Organisation for Nuclear Research, known as CERN, has come to the forefront of public attention recently with the discovery of the Higgs boson – the so called God’s particle. CERN operates a high energy collider 100m under the Swiss and French border near Geneva to explore the boundaries of high energy physics. It is high energy physics on a huge scale, matched by no other facility in the world.
Essemtec, a Swiss manufacturer of production systems for electronic assembly and packaging, will introduce the Scorpion high-speed jetter in booth #6766 at the upcoming SEMICON West, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco.
Farnell element14 announces it will stock the Fluke CNX3000 wireless multimeter, which allows the user to solve problems faster and manage results from multiple sources. Part of the new Fluke wireless troubleshooting team, the CNX3000 gives visibility of live measurements from multiple modules simultaneously and remotely on a single screen.
The MPM Momentum Compact printer by Speedline Technologies is a faster, more precise Momentum-series printer that delivers cutting-edge performance in an unexpectedly small package. Designed to meet the challenges of finer pitch PCB applications, it is ideal for tight floor space requirements, and delivers the highest throughput for its footprint in the industry.
Trevor Galbraith had a chance to sit down with Semblant CEO Steven Lowder at SMTA International in Orlando. Semblant develops nanomaterials process solutions for the electronics industry using a fusion of science and engineering that blends the disciplines of chemistry and physics with mechanical and electrical engineering.
MYDATA are one of the leading manufacturers of mid-range, high-mix pick ‘n place machines and specialty printers in the world. Trevor Galbraith interviews MYDATA’s Senior Vice President and General Manager, Robert Goethner at SMT/Hybrid/Packaging in Nuremberg, Germany.
Bernd Lange is the chief technology officer for LPKF Laser & Electronics. We spoke at their booth at SMT HYBRID PACKAGING in Nuremberg earlier this year about the latest developments of two of their newest, most exciting products,
GPD Global has a unique technology for precise control of volumetric fluids from water up to 70,000 centipoise. Trevor Galbraith spoke to GPD’s President and CEO, Sven Wedekin at APEX about their technology and plans for the future.
Jennifer Category: Cleaning (3 answers) We have a customer that believes that multiple wash steps (three) degrades the value of an 0805 resistor. We have never had this issue before?? I am at a loss. Any suggestions?
These days, we can find microcapsules in almost every industrial sector, where they take numerous roles. However, dispensing these fragile materials can be a problem since clearly it is important that the microcapsules be undamaged by the dispensing process. In adhesive technology, microcapsules can fulfil several functions. For example, microcapsules may be an integral part of the control of reaction and curing processes.
February was a bad month for the global electronics industry—especially in SE Asia. Lunar New Year shutdowns, some “adjustments” to the Apple supply chain and normal post-Christmas seasonality combined to create a major contraction in February. Although “recovery” was underway in late 2012, Chinese, Taiwanese and European PMI manufacturing indices contracted in February. This PMI decline was reflected in Taiwan/China electronic equipment shipments as they plunged below their February 2012 levels. appears to be unsustainable.
I must say I love San Diego as an event location, lots of hotels and places to eat close by, great transport links, and during APEX the local area has a buzz about it, which is great for exhibitors and visitors. Productronica is also a great show, but everyone is scattered throughout Munich and its suburbs. Here you cannot go into any hostelry without seeing a face or two that you recognize; indeed The Field becomes the APEX afterparty for the whole show.
Heat is the bane of semiconductor devices, and yet it is a natural byproduct of their operation. There is in fact an inverse relationship between product reliability and the range and number of number thermal excursions experienced by a semiconductor device; thus knowing what kind of thermal challenge is presented by a particular design is key to addressing and solving the problem in an intelligent and proactive way.
Most of the electronics industry by now knows about tin whiskers (hello, Toyota anyone?). They know whiskers are metallic filaments that emanate from the surface of tin platings. They know these filaments are conductive and can cause shorts across adjacent conductors. And they know that these shorts can cause some really bad failures. But with all of this knowledge, the industry is still struggling on how to predict and prevent these “Nefarious Needles of Pain.”
Once again SMT Hybrid Packaging acts as a platform providing comprehensive information on innovations, products and solutions in the field of System Integration in Micro Electronics. From 16 – 18 April 2013 visitors will find well-known companies such as ASYS, Assembleon, AAT Aston, Heraeus, KSG Leiterplatten, LPKF and Yamaha in Nuremberg, Germany. Moreover, numerous first time as well as small- and medium-sized exhibitors will be present on the show.
Delivering answers, solutions and opportunities for future innovation in electronics manufacturing, IPC APEX EXPO® 2013 will take place February 19–21, at the San Diego Convention Center. Information and online registration are now available. www.IPCAPEXEXPO.org
Unlike any other show, IPC APEX EXPO hosts an exhibition with more than 400 of the industry’s top suppliers, professional development courses, standards development meetings, executive management meetings as well as the world’s most highly selective technical conference in electronics manufacturing.
Visit our Show Central area for IPC APEX Expo 2013 to see what's in store on the show floor.
SMTA International Electronics Exhibition 2012
SMTA International (SMTAI) 2012 boasts the electronics assembly industry's strongest technical conference and an extensive exhibition. The quality of technical information and networking offered at this event gives your company the advantage to become more competitive, profitable and successful. SMTAI will be held Oct. 14 - 18, 2012 (conference) / Oct. 16 - 18, 2012 (exhibition), at the Walt Disney World Dolphin Hotel, Orlando Florida.
NEPCON South China 2012 will take place between August 28 and August 30 at the Shenzhen Convention & Exhibition Center. As the largest and longest-running SMT exchange platform in South China, the annual event is a popular industry highlight. To date, several electronics manufacturers have accepted invitations to exhibit at the event, many of them giants of global electronics manufacturing. More
SMT Hybrid Packaging celebrates 25th anniversary In 2012 SMT Hybrid Packaging celebrates the 25th jubilee. With companies like Heraeus, ERNI, ERSA, Multi-Components, SEHO and Systronic there will be companies in Nuremberg who are exhibiting since the first exhibition in 1987. This year over 530 companies will present the latest trends and products in the field of System Integration in Micro Electronics from 8-10 May in Nuremberg. http://www.mesago.de/en/SMT/home.htm
IPC APEX Expo, William Shatner to Keynote IPC APEX EXPO 2012 Shatner’s opening keynote address on Tuesday, February 28, is free to all registered IPC APEX EXPO attendees. Following his keynote, he will sign copies of his latest book which will be available for purchase on-site. The IPC APEX EXPO conference and exhibition will run February 28–March 1, 2012; standards development meetings, professional development courses and other show activities will take place February 26–March 1. For more information on IPC APEX EXPO or to register, visit www.IPCAPEXEXPO.org