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The global assembly journal for SMT and advanced packaging professionals

Global SMT & Packaging Magazine

Global SMT & Packaging Magazine
15.07 Read it Online

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Sandy Daneau
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Panel of Experts

The Custers
Seasonal Upturn on the Horizon
Global electronic equipment revenues grew an estimated 1.2% in the first quarter of 2015 vs. the same quarter in 2014. This compares to 4.2% q/q growth in the prior quarter. Electronic equipment growth clearly slowed early this year.
Growth by sector of the 1Q’15 global supply chain varied significantly by product group. Smartphones (thanks to Apple’s high share and very high average iPhone selling prices) drove the communication sector’s lofty growth where many electronic equipment categories struggled.
Joe Fjelstad
Thought Experiment: “What might the electronics industry look like if it was to start anew today?” PART FOUR

Those readers who have been following this series of musings on the prospects for the elimination of solder from the electronics manufacturing paradigm and especially those who are coming to share some belief in the concept that there is real value in the end of solder, I offer the caveat that they should not get their hopes up to high.

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Craig Hillman
Physics of failure

When I tell people that I am a practitioner of physics of failure, the response is typically predictable:
I either get a blank look, or a large smile breaks out as if landsman has been discovered after many years in the wilderness.
What is physics of failure? In some respects, that is a good question. Historically, there are some nice academic definitions that will tend to put you to sleep.  

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Show Central

productronica 2015

messeimpressionenTakes place in Munich from November 10 – 13, 2015. The world's leading trade fair for electronics development and production sets new standards with a number of innovations. Besides its new cluster concept, the premiere of a new award and a new forum concept, for the first time ever, IT2Industry, the trade fair and open conference for intelligent, digitally networked working environments, takes place at the same time as productronica. This year's focus topics are industrial electronics, automotive electronics and PCB & EMS.

Visit our show central area to see what's in store on the show floor


NEPCON South China 2015

NC150701“Internet+” is definitely the defining phrase of 2015. Thanks to a national internet+ strategy, the electronics industry is transitioning from a “made in China” ethos, to Chinese-led smart manufacturing, featuring advanced smart automation technologies. Those able to combine cross-disciplinary know-how will win big in the upcoming smart age. NEPCON South China 2015, planned for the Shenzhen Conference and Exhibition Center from August 25 to August 27, comes during a surge of industry momentum. The event will showcase the best innovative electronics manufacturing equipment and automation technologies available in 2015.

Visit our show central area to see what's in store on the show floor

SEMICON West 2015

SEMI announced that SEMICON West 2015 will feature the Silicon Innovation Forum (SIF), a unique forum for strategic investors and key decision makers to meet new and emerging early-stage companies developing the future of microelectronics. SIF is organized by SEMI (www.semi.org) in partnership with top research institutes and strategic investment groups such as Applied Ventures, Intel Capital, Samsung Ventures, and more. The event is strategically co-located with SEMICON West (www.semiconwest.org) - the premier U.S. electronics manufacturing event.

Visit our Show Central to find out what's happening on the show floor

NEPCON China 2015

From April 21 to April 23, 2015, at the Shanghai World Expo Exhibition & Convention Center, the 25th edition of NEPCON China will bring together over 500 well-known electronics manufacturers from 22 countries and regions. Come to the show to discuss the latest industry trends and see the leading technologies with over 21,000 other visitors. Top quality and abundant opportunity await you at NEPCON China 2015!

Visit our Show Central area for NEPCON China 2015 to see what's in store on the show floor.

SMT Hybrid Packaging 2015

With the Open Source Workshop on Wednesday, 6 May 2015 in the afternoon, SMT Hybrid Packaging 2015 presents a new workshop concept. Unlike other workshops, all participants actively discuss three different subject areas of the “Challenges of 3D-IC Integration for PCB Technologies”. Each group is supervised by a moderator who guides the time-limited discussions in the respective subject areas. After the show, the results will be summarized and made available to the participants.

Visit our Show Central area for SMT Hybrid Packaging to see what's in store on the show floor.

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