Printed board cleanliness has historically been an unknown factor in the quality assessment of unpopulated (bare) printed boards; this has often been attributed to a lack of understanding of materials and processes. This document addresses the various printed board fabrication processes and how each may impact, directly or indirectly, the final cleanliness of packaged bare printed boards and ultimately printed board quality.
Dymax Corporation is pleased to announce the appointment of Margo Martin to Global Account Manager. In her new position, Margo will report to Jennifer Mann, Director of Sales and Marketing, and focus on several key global accounts to help them solve their most complex application problems and reduce manufacturing costs.
ASM Assembly Systems is very pleased to announce its future collaboration with its new sales partner, Technica USA, which has recently been signed to represent their SIPLACE line of SMT placement equipment, software and services. In order to better support the growing customer base in the Western USA, the SIPLACE team will also open a second US demo center, located at the Technica facility in San Jose, California. “In 2012 we significantly increased our market share in North America.
The first IC manufacturer to join imec’s R&D program on emerging memory technologies, GLOBALFOUNDRIES completes the value chain of imec’s research platform, which fuels industry collaboration from technology up to the system level. GLOBALFOUNDRIES is joining a team with a leading fabless company (http://www2.imec.be/be_en/press/imec-news/qualcomm2013.html) and several worldwide equipment suppliers providing the complete infrastructure necessary for R&D on STT-MRAM.
STI Electronics, Inc. offers a wide variety of electronics assembly and solder training courses, ranging from commercial to high-reliability requirements including NASA for through-hole, surface mount and cable/harness assembly, as well as staking and conformal coating. STI is an IPC Approved Certification center for all currently available courses (IPC-A-600, IPC-J-STD-001, IPC-A-610, IPC-7711/7721, IPC/WHMA-620). Most courses can be customized to meet a specific need or requirement and can be conducted at a customers’ site, STI’s facility in Madison, AL, or the new Warner Robins, GA location.
Digicom Electronics, Inc., a technology and quality-driven electronics manufacturing services (EMS) company, announces the availability of its new, multi-faceted website. The website features video clips of each process stage, articles, and information to assist those seeking an EMS in making a more informed selection. Digicom specializes in turn-key electronics manufacturing solutions for small to high-volume production, complex prototypes, PCB assemblies, and complete box-build systems.
ACD, a supplier to the electronics industry, announced Khoi (Henry) Dao’s five-year anniversary with the company. Henry has been a Flying Probe Test Operator at ACD since 2008. Henry is always willing to help out in other departments and is very dependable. He is instrumental in providing ACD’s customers with confidence in receiving a quality, defect-free assembly. This is accomplished by the use of both single- and double-sided testers.
Following several years of sustained and unprecedented growth, Pektron Group Ltd enhances its production capacities with important investment in upgrading two production lines to include six Hitachi Sigma Series machines. This increases the total number of Hitachi placement systems to fourteen on site at Pektron’s Derby (UK) manufacturing facility.
International Manufacturing Services, Inc. (IMS), a manufacturer and supplier of high quality thick film chip resistors, terminations, attenuators and other RF components to the electronics industry, announces the availability of its compact Thick Film 7GHz SMT Wilkinson Power Divider. The model IMD2613 has a 20% bandwidth and exhibits insertion loss less than 0.5dB at its center frequency.
Available across Europe the HEAVYCON EVO plug-in connectors, made from high-performance plastic, meet virtually all the requirements of heavy-duty industrial plug-in connectors as well as protection class IP65 and shock resistance IK08. The unique HEAVYCON EVO gland locking system results in a reduction in the variety of housings and an inventory saving of 70% for the customer.
A-Tek Systems Group is pleased to introduce the newest cleaning system from Kolb Cleaning Technology - the PS300 2HY. The PS300 2HY is the latest addition to the compact C-Series, and is a hybrid batch stencil cleaner yet so much more. the PS300 2HY is suitable for stencils, PCBs (soldered), misprints and solder frames in a single machine platform. As a fully automatic, single chamber system, the PS300 2HY features 3-4 Step PowerSpray® cleaning.
DfR Solutions, a leader in quality, reliability, and durability (QRD) solutions for the electronics industry, announced the new 3.0 release of its Automated Design AnalysisTM software, Sherlock. Sherlock is the first-of-its-kind automated design analysis software for analyzing, grading, and certifying the expected reliability of products at the circuit card assembly level.
Engineered Material Systems, Inc. (EMS), a leading global supplier of electronic materials for circuit assembly applications, debuts its 535-18M-57 UV Cured Epoxy Adhesive formulated for microelectronic assembly applications.
Moisture specialist Super Dry has launched a new series of custom size desiccant drying and storage solutions. Complementing the company’s extensive range of ultra low humidity storage cabinets, the latest SDR series answers expanding requirements to control and trace moisture sensitive components, boards and assemblies.
Technology innovator EWI announces the acquisition of an EOS direct metal laser-sintering (DMLS™) system, an additive manufacturing (AM) technology with the capacity to fuse metal powder into 3D components. The organization, which has long been engaged in the development of AM through both its Additive Manufacturing Consortium (AMC) and its spinout company Fabrisonic LLC, will apply the state-of-the-art EOSINT M 280 system to further advance AM technology and provide additional metal manufacturing solutions to OEMs and suppliers.
With its brand-new SIPLACE Di-Series the SIPLACE team of ASM Assembly Systems now offers proven placement quality and maximum process reliability in combination with innovative software also in the low-price segment. Technological details which are rare in this segment, such as digital vision systems, single and dual conveyors and modern, multi-language station software, are standard features on the SIPLACE Di-Series.
Trevor Galbraith had a chance to sit down with Semblant CEO Steven Lowder at SMTA International in Orlando. Semblant develops nanomaterials process solutions for the electronics industry using a fusion of science and engineering that blends the disciplines of chemistry and physics with mechanical and electrical engineering.
MYDATA are one of the leading manufacturers of mid-range, high-mix pick ‘n place machines and specialty printers in the world. Trevor Galbraith interviews MYDATA’s Senior Vice President and General Manager, Robert Goethner at SMT/Hybrid/Packaging in Nuremberg, Germany.
Bernd Lange is the chief technology officer for LPKF Laser & Electronics. We spoke at their booth at SMT HYBRID PACKAGING in Nuremberg earlier this year about the latest developments of two of their newest, most exciting products,
GPD Global has a unique technology for precise control of volumetric fluids from water up to 70,000 centipoise. Trevor Galbraith spoke to GPD’s President and CEO, Sven Wedekin at APEX about their technology and plans for the future.
Jennifer Category: Cleaning (3 answers) We have a customer that believes that multiple wash steps (three) degrades the value of an 0805 resistor. We have never had this issue before?? I am at a loss. Any suggestions?
These days, we can find microcapsules in almost every industrial sector, where they take numerous roles. However, dispensing these fragile materials can be a problem since clearly it is important that the microcapsules be undamaged by the dispensing process. In adhesive technology, microcapsules can fulfil several functions. For example, microcapsules may be an integral part of the control of reaction and curing processes.
February was a bad month for the global electronics industry—especially in SE Asia. Lunar New Year shutdowns, some “adjustments” to the Apple supply chain and normal post-Christmas seasonality combined to create a major contraction in February. Although “recovery” was underway in late 2012, Chinese, Taiwanese and European PMI manufacturing indices contracted in February. This PMI decline was reflected in Taiwan/China electronic equipment shipments as they plunged below their February 2012 levels. appears to be unsustainable.
I must say I love San Diego as an event location, lots of hotels and places to eat close by, great transport links, and during APEX the local area has a buzz about it, which is great for exhibitors and visitors. Productronica is also a great show, but everyone is scattered throughout Munich and its suburbs. Here you cannot go into any hostelry without seeing a face or two that you recognize; indeed The Field becomes the APEX afterparty for the whole show.
Heat is the bane of semiconductor devices, and yet it is a natural byproduct of their operation. There is in fact an inverse relationship between product reliability and the range and number of number thermal excursions experienced by a semiconductor device; thus knowing what kind of thermal challenge is presented by a particular design is key to addressing and solving the problem in an intelligent and proactive way.
Most of the electronics industry by now knows about tin whiskers (hello, Toyota anyone?). They know whiskers are metallic filaments that emanate from the surface of tin platings. They know these filaments are conductive and can cause shorts across adjacent conductors. And they know that these shorts can cause some really bad failures. But with all of this knowledge, the industry is still struggling on how to predict and prevent these “Nefarious Needles of Pain.”
Once again SMT Hybrid Packaging acts as a platform providing comprehensive information on innovations, products and solutions in the field of System Integration in Micro Electronics. From 16 – 18 April 2013 visitors will find well-known companies such as ASYS, Assembleon, AAT Aston, Heraeus, KSG Leiterplatten, LPKF and Yamaha in Nuremberg, Germany. Moreover, numerous first time as well as small- and medium-sized exhibitors will be present on the show.
Delivering answers, solutions and opportunities for future innovation in electronics manufacturing, IPC APEX EXPO® 2013 will take place February 19–21, at the San Diego Convention Center. Information and online registration are now available. www.IPCAPEXEXPO.org
Unlike any other show, IPC APEX EXPO hosts an exhibition with more than 400 of the industry’s top suppliers, professional development courses, standards development meetings, executive management meetings as well as the world’s most highly selective technical conference in electronics manufacturing.
Visit our Show Central area for IPC APEX Expo 2013 to see what's in store on the show floor.
SMTA International Electronics Exhibition 2012
SMTA International (SMTAI) 2012 boasts the electronics assembly industry's strongest technical conference and an extensive exhibition. The quality of technical information and networking offered at this event gives your company the advantage to become more competitive, profitable and successful. SMTAI will be held Oct. 14 - 18, 2012 (conference) / Oct. 16 - 18, 2012 (exhibition), at the Walt Disney World Dolphin Hotel, Orlando Florida.
NEPCON South China 2012 will take place between August 28 and August 30 at the Shenzhen Convention & Exhibition Center. As the largest and longest-running SMT exchange platform in South China, the annual event is a popular industry highlight. To date, several electronics manufacturers have accepted invitations to exhibit at the event, many of them giants of global electronics manufacturing. More
SMT Hybrid Packaging celebrates 25th anniversary In 2012 SMT Hybrid Packaging celebrates the 25th jubilee. With companies like Heraeus, ERNI, ERSA, Multi-Components, SEHO and Systronic there will be companies in Nuremberg who are exhibiting since the first exhibition in 1987. This year over 530 companies will present the latest trends and products in the field of System Integration in Micro Electronics from 8-10 May in Nuremberg. http://www.mesago.de/en/SMT/home.htm
IPC APEX Expo, William Shatner to Keynote IPC APEX EXPO 2012 Shatner’s opening keynote address on Tuesday, February 28, is free to all registered IPC APEX EXPO attendees. Following his keynote, he will sign copies of his latest book which will be available for purchase on-site. The IPC APEX EXPO conference and exhibition will run February 28–March 1, 2012; standards development meetings, professional development courses and other show activities will take place February 26–March 1. For more information on IPC APEX EXPO or to register, visit www.IPCAPEXEXPO.org