EP-TeQ A/S, the Partner in consulting, sales, service and support of equipment for Electronic Production and Quality Assurance, announces that they have signed a contract with Digitaltest for sales of their hardware and software products for the Nordic and Baltic Countries.
ESCATEC, the EMS innovator, has just installed a Nikon XTV160 2.5D X-Ray inspection system as part of its continual upgrade programme. This €150,000 installation is used for inspecting solder joint quality of PCBA for hidden interconnections and features, like BGA balls, QFN interconnections or bond wires.
Bourns, Inc., a manufacturer and supplier of electronic components, announced that TTI, Inc., a global distributor of connector, passive, electromechanical and discrete components, has awarded its prestigious 2012 TTI Global Operations Excellence Award to Bourns. Bourns was recognized as the supplier which earned TTI’s Supplier Excellence Award in three regions – the Americas, Europe and Asia, and the company that received the highest total points globally.
Michigan headquartered, national electronics distributor Murray Percival Company, has announced that they have been named as sales representatives for MIRTEC AOI and SPI systems in Western Pennsylvania. The decision means that MIRTEC products will now be included throughout their entire territory of Michigan, Indiana, Ohio, and Kentucky as well as Western PA.
Each SMTA Certification program is a three-day offering consisting of a 1.5-day refresher workshop on topics in SMT Processes or Six Sigma/Greenbelt. The program concludes on days two and three with an open and closed book examination. SMTA Certification is intended for manufacturing and process engineers, but production, design, test and quality engineering personnel, as well as SMT assembly managers may also consider participating.
Printed board cleanliness has historically been an unknown factor in the quality assessment of unpopulated (bare) printed boards; this has often been attributed to a lack of understanding of materials and processes. This document addresses the various printed board fabrication processes and how each may impact, directly or indirectly, the final cleanliness of packaged bare printed boards and ultimately printed board quality.
Dymax Corporation is pleased to announce the appointment of Margo Martin to Global Account Manager. In her new position, Margo will report to Jennifer Mann, Director of Sales and Marketing, and focus on several key global accounts to help them solve their most complex application problems and reduce manufacturing costs.
ASM Assembly Systems is very pleased to announce its future collaboration with its new sales partner, Technica USA, which has recently been signed to represent their SIPLACE line of SMT placement equipment, software and services. In order to better support the growing customer base in the Western USA, the SIPLACE team will also open a second US demo center, located at the Technica facility in San Jose, California. “In 2012 we significantly increased our market share in North America.
International Manufacturing Services, Inc. (IMS), a manufacturer and supplier of high quality thick film chip resistors, terminations, attenuators and other RF components to the electronics industry, announces the availability of its compact Thick Film 7GHz SMT Wilkinson Power Divider. The model IMD2613 has a 20% bandwidth and exhibits insertion loss less than 0.5dB at its center frequency.
Available across Europe the HEAVYCON EVO plug-in connectors, made from high-performance plastic, meet virtually all the requirements of heavy-duty industrial plug-in connectors as well as protection class IP65 and shock resistance IK08. The unique HEAVYCON EVO gland locking system results in a reduction in the variety of housings and an inventory saving of 70% for the customer.
A-Tek Systems Group is pleased to introduce the newest cleaning system from Kolb Cleaning Technology - the PS300 2HY. The PS300 2HY is the latest addition to the compact C-Series, and is a hybrid batch stencil cleaner yet so much more. the PS300 2HY is suitable for stencils, PCBs (soldered), misprints and solder frames in a single machine platform. As a fully automatic, single chamber system, the PS300 2HY features 3-4 Step PowerSpray® cleaning.
DfR Solutions, a leader in quality, reliability, and durability (QRD) solutions for the electronics industry, announced the new 3.0 release of its Automated Design AnalysisTM software, Sherlock. Sherlock is the first-of-its-kind automated design analysis software for analyzing, grading, and certifying the expected reliability of products at the circuit card assembly level.
Engineered Material Systems, Inc. (EMS), a leading global supplier of electronic materials for circuit assembly applications, debuts its 535-18M-57 UV Cured Epoxy Adhesive formulated for microelectronic assembly applications.
Moisture specialist Super Dry has launched a new series of custom size desiccant drying and storage solutions. Complementing the company’s extensive range of ultra low humidity storage cabinets, the latest SDR series answers expanding requirements to control and trace moisture sensitive components, boards and assemblies.
Technology innovator EWI announces the acquisition of an EOS direct metal laser-sintering (DMLS™) system, an additive manufacturing (AM) technology with the capacity to fuse metal powder into 3D components. The organization, which has long been engaged in the development of AM through both its Additive Manufacturing Consortium (AMC) and its spinout company Fabrisonic LLC, will apply the state-of-the-art EOSINT M 280 system to further advance AM technology and provide additional metal manufacturing solutions to OEMs and suppliers.
With its brand-new SIPLACE Di-Series the SIPLACE team of ASM Assembly Systems now offers proven placement quality and maximum process reliability in combination with innovative software also in the low-price segment. Technological details which are rare in this segment, such as digital vision systems, single and dual conveyors and modern, multi-language station software, are standard features on the SIPLACE Di-Series.
Trevor Galbraith had a chance to sit down with Semblant CEO Steven Lowder at SMTA International in Orlando. Semblant develops nanomaterials process solutions for the electronics industry using a fusion of science and engineering that blends the disciplines of chemistry and physics with mechanical and electrical engineering.
MYDATA are one of the leading manufacturers of mid-range, high-mix pick ‘n place machines and specialty printers in the world. Trevor Galbraith interviews MYDATA’s Senior Vice President and General Manager, Robert Goethner at SMT/Hybrid/Packaging in Nuremberg, Germany.
Bernd Lange is the chief technology officer for LPKF Laser & Electronics. We spoke at their booth at SMT HYBRID PACKAGING in Nuremberg earlier this year about the latest developments of two of their newest, most exciting products,
GPD Global has a unique technology for precise control of volumetric fluids from water up to 70,000 centipoise. Trevor Galbraith spoke to GPD’s President and CEO, Sven Wedekin at APEX about their technology and plans for the future.
Aegis Software provides single-vendor information systems for high-reliability manufacturers, providinga critical complement to enterprise-level ERP and PLM capabilities.
Best IR rework machine Category: Components & placement (6 answers) What is the best IR rework machine to replace LGA775 LGA1155 type sockets in the market?
Jennifer Category: Cleaning (3 answers) We have a customer that believes that multiple wash steps (three) degrades the value of an 0805 resistor. We have never had this issue before?? I am at a loss. Any suggestions?
These days, we can find microcapsules in almost every industrial sector, where they take numerous roles. However, dispensing these fragile materials can be a problem since clearly it is important that the microcapsules be undamaged by the dispensing process. In adhesive technology, microcapsules can fulfil several functions. For example, microcapsules may be an integral part of the control of reaction and curing processes.
February was a bad month for the global electronics industry—especially in SE Asia. Lunar New Year shutdowns, some “adjustments” to the Apple supply chain and normal post-Christmas seasonality combined to create a major contraction in February. Although “recovery” was underway in late 2012, Chinese, Taiwanese and European PMI manufacturing indices contracted in February. This PMI decline was reflected in Taiwan/China electronic equipment shipments as they plunged below their February 2012 levels. appears to be unsustainable.
I must say I love San Diego as an event location, lots of hotels and places to eat close by, great transport links, and during APEX the local area has a buzz about it, which is great for exhibitors and visitors. Productronica is also a great show, but everyone is scattered throughout Munich and its suburbs. Here you cannot go into any hostelry without seeing a face or two that you recognize; indeed The Field becomes the APEX afterparty for the whole show.
Heat is the bane of semiconductor devices, and yet it is a natural byproduct of their operation. There is in fact an inverse relationship between product reliability and the range and number of number thermal excursions experienced by a semiconductor device; thus knowing what kind of thermal challenge is presented by a particular design is key to addressing and solving the problem in an intelligent and proactive way.
Most of the electronics industry by now knows about tin whiskers (hello, Toyota anyone?). They know whiskers are metallic filaments that emanate from the surface of tin platings. They know these filaments are conductive and can cause shorts across adjacent conductors. And they know that these shorts can cause some really bad failures. But with all of this knowledge, the industry is still struggling on how to predict and prevent these “Nefarious Needles of Pain.”
Once again SMT Hybrid Packaging acts as a platform providing comprehensive information on innovations, products and solutions in the field of System Integration in Micro Electronics. From 16 – 18 April 2013 visitors will find well-known companies such as ASYS, Assembleon, AAT Aston, Heraeus, KSG Leiterplatten, LPKF and Yamaha in Nuremberg, Germany. Moreover, numerous first time as well as small- and medium-sized exhibitors will be present on the show.
Delivering answers, solutions and opportunities for future innovation in electronics manufacturing, IPC APEX EXPO® 2013 will take place February 19–21, at the San Diego Convention Center. Information and online registration are now available. www.IPCAPEXEXPO.org
Unlike any other show, IPC APEX EXPO hosts an exhibition with more than 400 of the industry’s top suppliers, professional development courses, standards development meetings, executive management meetings as well as the world’s most highly selective technical conference in electronics manufacturing.
Visit our Show Central area for IPC APEX Expo 2013 to see what's in store on the show floor.
SMTA International Electronics Exhibition 2012
SMTA International (SMTAI) 2012 boasts the electronics assembly industry's strongest technical conference and an extensive exhibition. The quality of technical information and networking offered at this event gives your company the advantage to become more competitive, profitable and successful. SMTAI will be held Oct. 14 - 18, 2012 (conference) / Oct. 16 - 18, 2012 (exhibition), at the Walt Disney World Dolphin Hotel, Orlando Florida.
NEPCON South China 2012 will take place between August 28 and August 30 at the Shenzhen Convention & Exhibition Center. As the largest and longest-running SMT exchange platform in South China, the annual event is a popular industry highlight. To date, several electronics manufacturers have accepted invitations to exhibit at the event, many of them giants of global electronics manufacturing. More
Visit our Show Central area for NEPCON South China 2012 to see what's in store on the show floor.
SMT Hybrid Packaging celebrates 25th anniversary In 2012 SMT Hybrid Packaging celebrates the 25th jubilee. With companies like Heraeus, ERNI, ERSA, Multi-Components, SEHO and Systronic there will be companies in Nuremberg who are exhibiting since the first exhibition in 1987. This year over 530 companies will present the latest trends and products in the field of System Integration in Micro Electronics from 8-10 May in Nuremberg. http://www.mesago.de/en/SMT/home.htm
Visit our show central area for SMT Hybrid Packaging 2012 to see what's in store.
NEPCON China 2012
Thank you for your participation at NEPCON China 2012.
This is the 2nd reminder of onsite noise control for your kind attention.
As part of our customer service program, we would like to seek your support and co-operation to control the sound level of your speakers and audio/visual display
in your booth in order to ensure a smooth and successful event:
Please ensure that sound level of your booth is being controlled below 75 decibel. It should not cause any interference or annoyance to visitors or other Exhibitors.
Please also place your speakers and other sound devices in a position where direct sound will be channeled into your booth and not the aisles.
The Organizer will reserve the right to reduce the sound level or switch off audio / visual displays causing problems if the sound level is over 75 decibel.
We urge your best understanding and cooperation on the above rules, which is to ensure we jointly build a friendly and comfortable environment for your own business networking on-site.
Thank you very much for your kind attention. Should you have any further inquiries, please feel free to contact your Reed representatives or our customer servicing hot line at: 86 21 2231 7015.
We wish you all the best at NEPCON China 2012.
Visit our show central area for NEPCON China 2012 to see what's in store.
IPC APEX Expo 2012
IPC APEX Expo, William Shatner to Keynote IPC APEX EXPO 2012 Shatner’s opening keynote address on Tuesday, February 28, is free to all registered IPC APEX EXPO attendees. Following his keynote, he will sign copies of his latest book which will be available for purchase on-site. The IPC APEX EXPO conference and exhibition will run February 28–March 1, 2012; standards development meetings, professional development courses and other show activities will take place February 26–March 1. For more information on IPC APEX EXPO or to register, visit www.IPCAPEXEXPO.org
SMTA International (SMTAI) 2012 boasts the electronics assembly industry's strongest technical conference and an extensive exhibition. The quality of technical information and networking offered at this event gives your company the advantage to become more competitive, profitable and successful. SMTAI will be held Oct. 14 - 18, 2012 (conference) / Oct. 16 - 18, 2012 (exhibition), at the Walt Disney World Dolphin Hotel, Orlando Florida.
NEPCON South China 2012 will take place between August 28 and August 30 at the Shenzhen Convention & Exhibition Center. As the largest and longest-running SMT exchange platform in South China, the annual event is a popular industry highlight. To date, several electronics manufacturers have accepted invitations to exhibit at the event, many of them giants of global electronics manufacturing. 
SMT Hybrid Packaging celebrates 25th anniversary
Thank you for your participation at NEPCON China 2012.
IPC APEX Expo, 
Industry News
