Text size
Regional sites: DACH(German) | UK & Ireland | China | SE Asia | Korea | Select Language ->
The global assembly journal for SMT and advanced packaging professionals

GSP US (v14.12) Read it online or PDF


iPad Application

Global SMT & Packaging Advertising

Sandy Daneau
Tel: 239-234-1600

Trevor Galbraith
Tel: +1 (239) 287 5401

SE Asia
Debasish Choudhury
Tel: +91-9811710191

Paul Chen
Office: +86 2154049130

Tel: +1 (239) 245-9264 x106

Tel: +1 (239) 245-9264 x101

Email ad materials to ads@globalsmt.net

SMT Hybrid 2014 Gallery

SMT Hybrid Packaging 2014-18
SMT Hybrid Packaging 2014-21
SMT Hybrid Packaging 2014-22
SMT Hybrid Packaging 2014-8
SMT Hybrid Packaging 2014-6
    Follow us: RSS Mobile Twitter

Productronica 2013, Munich, Germany


Panel of Experts

The Custers
2014 & 2015 growth at moderate pace

The global electronic supply chain is growing, but this expansion is currently at primarily single digit rates. Compared to the same 3-month period a year earlier world semiconductor shipments are up 11.5%, PCBs up 5.2%, electronic equipment up 2.8% and the Global PMI leading indicator up 3.3%.
The JPMorgan/Markit Economics Global PMI has been in expansion territory (PMI>50) for the last few years however regional performance varies.
Perhaps strangely the USA and Europe are currently expanding faster than many Asian countries with China and Japan in recent contraction modes.  

Read more

Joe Fjelstad
Component carrier material selection for SAFE product designs

The last two columns focused on electronic component issues related to solderless assembly for electronics (SAFE). They stressed the importance of making thoughtful, proactive decisions in component selection rather than reactive ones, or using whatever happens to pop up first in a component search. 

Read More

Craig Hillman
Physics of failure

When I tell people that I am a practitioner of physics of failure, the response is typically predictable:
I either get a blank look, or a large smile breaks out as if landsman has been discovered after many years in the wilderness.
What is physics of failure? In some respects, that is a good question. Historically, there are some nice academic definitions that will tend to put you to sleep.  

Read More

Show Central

SMTA International 2014

The SMTA International conference includes focused technical tracks covering Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, and Quality and Reliability.  Technical sessions will be held on Monday through Thursday.  Tutorials are half-day educational courses offered on Sunday, Monday, and Thursday. Thursday’s tutorial on “Reliability 360: How to Verify Design Robustness Early in the Process” is free for SMTA and IPC members who register in advance.

Visit our Show Central area for SMTA International 2014 to see what's in store on the show floor.

NEPCON South China 2014

NEPCON South China, the Asian electronics manufacturing industry’s most essential event, is scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.  This year, the show will again be a comprehensive display of the application of state-of-the-art technologies and products in electronics manufacturing - Matching the right trade partners for high efficiency, high value business discussions.

See our Show Central area for NEPCON South China to find out what's in store on the show floor

SMT Hybrid Packaging 2014

From 6 – 8 May 2014 the SMT Hybrid Packaging, the leading exhibition for System Integration in Micro Electronics, opens its doors in Nuremberg. One highlight for young engineers is in hall 9. Here, the Beratungsgruppe Wirth + Partner offers a free of charge career consulting. It includes among other things a target oriented career coaching and an application package’s checking service. A job board informs about vacant positions of present exhibitors and enables the interested visitors to have a first face to face discussion with the prospective employer.

Visit our Show Central area for SMT Hybrid Packaging 2014 to see what's in store on the show floor.


IPC APEX Expo 2014

Changing technologies that are driving the electronics industry will be center stage throughout the IPC APEX EXPO® technical conference, which takes place Tuesday, March 25 to Thursday, March 27, 2014, at the Mandalay Bay Convention Center in Las Vegas.

In keeping with the event’s theme, “New Ideas … For New Horizons,” industry experts will present 100 technical papers detailing original research and innovations in the areas of board fabrication and design, electronics assembly and test.

Visit our Show Central area for IPC APEX Expo 2014 to see what's in store on the show floor.


Your Account

Forgot login? Click here.
No account yet? Subscribe