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Friday, July 30, 2010
By number of organizations, Europe has the edge over the U.S., then comes Asia.
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Friday, July 30, 2010
Enlist the services of InterTech Development Company’s Applications Laboratory for test fixture design services
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Friday, July 30, 2010
Digitaltest, renowned supplier of ICT, Functional and Flying Probe test hardware and software for assembled printed circuit boards celebrates its 30th anniversary.
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Friday, July 30, 2010
Mr. Silvia has served IMS for more than 27 years and has been a member of IMS’ Board of Directors since 1990.
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Friday, July 30, 2010
The INOCART-MSD includes software features unavailable with other material handling systems.
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Friday, July 30, 2010
With a visitor increase of 5% and an increase in the conference and tutorial participants by 9%, the event reflects the economic recuperation.
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Thursday, July 29, 2010
This brings Siemens’s search for a strategic, industrial investor for its Siemens Electronics Assembly Systems GmbH & Co. KG subsidiary (SEAS) to a successful conclusion.
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Friday, July 30, 2010
The IP67 SEAL-D connector utilizes a proprietary sealing technology that maintains the same physical size and footprint as standard D-Sub products.
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Friday, July 30, 2010
HI-BRITE lights allow the intensity to be increased and focused to provide illumination to the part, even at a distance.
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Wednesday, July 28, 2010
The new adapters in the series adapt 0.40 mm devices to boards with a 1.00 mm pitch.
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Wednesday, July 28, 2010
The Diamond series atmospheric robots represent a significant engineering advancement in the design and reliability of wafer handling equipment.
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Wednesday, July 28, 2010
Module only 8mm high
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Tuesday, July 27, 2010
Y-RED® – The Modular Test Contactor System
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Tuesday, July 27, 2010
The viewLinc system provides continuous records, 24/7 alarming, and automated reporting.
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Monday, July 26, 2010
INOPLACER Basic stands for sophisticated technology at a very attractive price.
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Friday, July 23, 2010
The new WPC features a non-stop module (NSM) that allows operators to add full trays and remove empty ones without having to interrupt the production flow.
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Latest Questions...
Could thievage affect oven profiles?
Category: Solder, flux & soldering
<p> We have started using a second supplier for our multilayered PCBs and they leave a considerable ammount of copper thievage on both external and internal layers as it improves their yield.</p>
<p> Does anyone think that this increase in the volume of copper in the boa
Reflow Specifications for Hallogen Free PCB with Hallogen Free PAste
Category: Solder, flux & soldering (1 answer)
<p> We are using Hallogen Free Solder Paste with Air Reflow. We are using reflow specs as mentioned below...</p>
<p>Peak Temp: 245+/- 5 Degree C; Over 230 Degree C : 50~60 Sec; 150~200 Degree C : 90~110 Sec.</p>
<p>Are these specs are OK or need some changes. Is
Solder Iron Tip Go/No Go Indicators
Category: Solder, flux & soldering (2 answers)
<p>We have been asked to write a specification for our supplier, to guide/instruct their line supervision on how to control the use of solder iron tips. Basically, something along the lines of a (daily/weekly) checklist of visual indicators for them that is as objective as possible.</p
Market for short run prototypes?
Category: Components & placement (17 answers)
I run a small R&D business in which we do custom electronic and firmware (software) design. Our typical project produces 2 or 3 prototype PCB's and then 10-20 first beta product boards. From there the client usually sends the design off to a large board house for volume production.
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Friday, July 9, 2010
The wafer level chip scale package (WLCSP) is gaining popularity for its performance and for its ability to meet miniaturization requirements of certain electronic products, especially handheld devices like cell phones.
Friday, July 9, 2010
Electrical and thermal bonds are such an integral part of electronic and semiconductor construction that they may often be taken for granted. Modern electronic assembly methods employ a myriad of bonding processes, each one a vital step in the manufacture of the final product.
Tuesday, June 15, 2010
This paper details a breakthrough technology for automatic test equipment (ATE) fixtures. These new fixtures address the current market needs for faster delivery times, lower cost and access to finer pitch and smaller test targets.
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| Joe Fjelstad |
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The electronic interconnection hierarchy
The electronics interconnection industry is the foundation of the electronics industry, and it has steadily grown and evolved from its earliest days. However, the path to where it is today was anything but linear and never completely predictable.
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SMT Hybrid Packaging 2010
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 SMT Hybrid Packaging 2010 offers a comprehensive and compact presentation of products from design and development to PCB production, packaging, components and test systems. This is the Germany's leading event for System Integration in Micro Electronics. SMT Exhibition 2010 will provide an opportunity for companies gather together under one roof to exhibit their products and services that may lead to international tie-ups. Held June8-10, 2010, in Nuremberg, Germany. Visit our Show Central area for SMT Hybrid Packaging 2010.
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IPC APEX EXPO 2010
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 IPC APEX Expo 2010 lived up to expectations and confirmed the fact that the global recession was truly behind us. Although the traffic on the show floor was heavier than last year, the aisles were far from packed, but it is fair to say that the quality of the visitors couldn’t have been better. Visit our Show Central area for IPC APEX Expo 2010 for video clips from the show and more.
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Productronica 2009
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 Productronica is the world’s leading international trade fair for innovative electronics production. It is the only event of its kind that covers the complete range of current and forward-looking products, technologies and system solutions in their entire breadth and depth and along the entire value-added chain. As a result, it is the industry's largest and most important gathering. Held November 10-14, 2009 in Nuremberg, Germany. Visit Productronica Show Central to watch the panel discussions on pick & place, cleaning and counterfeit components that took place as well as videos from the exhibition floor.
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SMTAI 2009
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 The SMTAI Technical Committee was hard at work reviewing more abstracts than we have ever received at any time in the past five years. The final selection consists of 120 papers making up the industry's strongest technical program yet again! Attendees at SMTAI 2009 can look forward to 18 short courses, AIMS co-location, Emerging Technologies, the Lead-Free Symposium, the Contract Manufacturing Symposium, and a special keynote speaker from Jet Propulsion Labs. Making this year even more special is the 25th Anniversary Dinner and Celebration of SMTA's silver anniversary in the industry. Held October 4-8, 2009 in San Diego, CA. Show Central area coming soon!
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IPC Midwest 2009
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If you make or buy boards or assemblies in the Midwest, mark your calendar now to attend the event that's only focused on you. From a comprehensive show floor to exceptional educational opportunities, this is the event that can change your business in 2009! Held September 23-24, 2009 in Shaumburg (Chicago), IL. Visit our Show Central area for IPC Midwest 2009.
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Industry News