Text size
The global assembly journal for SMT and advanced packaging professionals

Wafer-level solder sphere placement and its implications

User Rating: / 0
PoorBest 
There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing, electroplating, or sphere dropping. To read more, a subscription is needed: Click here to subscribe

Add comment


Security code
Refresh

Your Account






Forgot login? Click here.
No account yet? Subscribe