January 2011 (Volume 11, Issue 1)

Read the Americas edition online or download the PDF .

Contents

Looking forward to a busy 2011
Trevor Galbraith

Technology Focus
Experiences in transferring recipes from an eight-zone reflow oven
Fred Dimock, BTU International, Inc.

Ramp to volume
Matt Wuensch, Mentor Graphics, Valor Division

Qualifying first source/second source ensures production integrity
Karl Fischbeck, Techcon System

Special Features
2011 Milestone Birthdays
Henkel unites R&D expertise in state-of-the-art site
Interview—Martin Ziehbrunner, Essemtec AG
Case study—Solder pallet cleaning: 50% cost reduction
Event report—International Conformal Coating Workshops at Deurne, the Netherlands

Regular Columns
Pin in hole intrusive reflow defects
Bob Willis

2011: A “single digit” growth year?
Walt Custer and Jon Custer-Topai

Adequacy/correctness of accelerated reliability test databases for Pb-free solders
Werner Engelmaier

Regular Features
Industry News
New Products
Association News
IMAPS Europe (Europe edition)
International Diary