Yole new report on 3DIC & WLP Equipment and Materials
Friday, 13 May 2011 00:06
Wafer-level-packages have emerged as the fastestgrowing semiconductor packaging technology with more than 27% CAGR in unit shipments forecasted over the next 5 years. In that context, we are pleased to publish a brand new report on "Equipment & Materials for 3DIC and WLP". For the first time, Yole's analysts have gathered all the necessary information to benchmark the different process alternatives required for wafer-level-packaging and 3DIC integration based on TSV interconnects.
This unique package includes:
- 2010-2016 wafer forecast for wafer-level-packages with a unique market segmentation
- Detailed 3DIC & WLP process flows and scenarios analysis putting in evidence which are the critical steps related to each wafer-level-packaging platform
- Equipment & material market forecasts in unit, volume and revenues from 2010-2016 related to 3DIC & WLP
- 350+ players DATABASE screening and profiling the detailed activity of the key equipment and material suppliers of the emerging 3DIC & WLP tool-box
Take a look at Yole's web site to find out more about this new research study: detailed description, table of contents, downloadable brochure and report sample.
For single orders placed directly with Yole, you will benefit from a pre-publication discount before 3rd June 2011.