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Global SMT & Packaging Magazine

Global SMT & Packaging Magazine
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Sandy Daneau
Skype: sdaneau.1
Tel: 239-234-1600

Trevor Galbraith
Tel: +1 (239) 287 5401

China & Japan
Paul Chen
Office: +86 2154049130

Tel: +1 (239) 245-9264 x106

Tel: +1 (239) 245-9264 x101

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Yole new report on 3DIC & WLP Equipment and Materials

Industry News

Wafer-level-packages have emerged as the fastestgrowing semiconductor packaging technology with more than 27% CAGR in unit shipments forecasted over the next 5 years. In that context, we are pleased to publish a brand new report on "Equipment & Materials for 3DIC and WLP". For the first time, Yole's analysts have gathered all the necessary information to benchmark the different process alternatives required for wafer-level-packaging and 3DIC integration based on TSV interconnects.

This unique package includes:

  • 2010-2016 wafer forecast for wafer-level-packages with a unique market segmentation
  • Detailed 3DIC & WLP process flows and scenarios analysis putting in evidence which are the critical steps related to each wafer-level-packaging platform
  • Equipment & material market forecasts in unit, volume and revenues from 2010-2016 related to 3DIC & WLP
  • 350+ players DATABASE screening and profiling the detailed activity of the key equipment and material suppliers of the emerging 3DIC & WLP tool-box

Take a look at Yole's web site to find out more about this new research study: detailed description, table of contents, downloadable brochure and report sample.

For single orders placed directly with Yole, you will benefit from a pre-publication discount before 3rd June 2011.

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