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The global assembly journal for SMT and advanced packaging professionals

White paper: Bumping BGAs using solder paste printing process for RFI shields packaging

One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies consists of "snapping" the shell-like shields onto solder spheres that are soldered to printed circuit board [PCB] pads.To read more, a subscription is needed: Click here to subscribe

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