Text size
The global assembly journal for SMT and advanced packaging professionals
Error
  • RSF_WARNING_HELPER_MISSING

7.2 – Evaluation of wafer bumping stencils

Technical Articles

In order to better characterize the performance of wafer bumping stencils, a novel solder transfer ratio has been defined that relates the amount of solder paste volume transferred to a wafer to the actual stencil aperture volume.

To read more, a subscription is needed: Click here to subscribe

Add comment


Security code
Refresh

Your Account






Forgot login? Click here.
No account yet? Subscribe