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The global assembly journal for SMT and advanced packaging professionals

Microelectronics Assembly and Packaging (MAP) workshop 2008 review

Regular Columns

The 8th International workshop on microelectronics assembly and packaging technologies was held in late November of last year and continues to be one of the best-kept open secrets of the IC packaging industry. The conference was the brainchild of Professor Hajime Tomokage of Fukuoka University. Professor Tomokage is one of the most charismatic individuals one is likely to meet in this industry and is the engine the drives the event. He is also a key person at the Asia Semiconductor Trading Support Association (ASTSA) and in that role has been successfully building bridges around the Pacific Rim to help encourage the exchange of technical ideas and concepts as well as market information and opportunities through various memoranda of understanding with other universities and associations in other countries in the region. The opening event this year, as in years past, included an opening signing ceremony of a memorandum of understanding between the India Semiconductor Association, represented by its president, Ms Poornima Shenoy, and ASTSA, represented by Professor Tomokage, expanding into South Asia the exchange. 

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