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The global assembly journal for SMT and advanced packaging professionals

IC packaging technology retrospective

(Part one - opens in new window)

In the first part of this retrospective, seen in the February 2009 issue of Global SMT and Packaging, some of the early origins and issues of IC packaging were reviewed. The column left off noting that surface mount brought with it significant advantages to IC packaging but also that there was need to provide guidance for future development. The result of that effort is something that is now known as the ‘80% rule.’ This is a matter that warrants more detailed discussion, and this will be the primary subject of this part of this short series on IC packaging history.

Read the full column online

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