IPC APEX Expo 2012

Christopher Associates to Introduce Leading-Edge SPI at the 2012 IPC APEX EXPO

Written by dburford Tuesday, 21 February 2012 14:54

Christopher Associates Inc. introduces the S-1 solder paste inspection system from MEK. The S-1 represents the leading edge in solder paste inspection technology.

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Nordson YESTECH to feature new high speed FX SL automated optical inspection solution at APEX 2012

Written by dburford Friday, 17 February 2012 20:04

Upgraded system inspects PCBs at over twice the inspection speed of previous generation models

Company will conduct live demonstrations of their complete line of AOI and automated x-ray inspection (AXI) systems in booth #3209

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Ersa presents brand new products at APEX

Written by dburford Friday, 17 February 2012 17:46

Ersa-ECOSELECT-1How can production costs be substantially reduced? Ersa machines and plants set the standards in the field of flexible, energy-efficient and sustainable production technologies. The modular design allows customized, sustainable solutions and is the basis for increased profits in your electronics production!

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New product introduction: ZESTRON to launch HYDRON® WS 325 at APEX 2012

Written by dburford Friday, 17 February 2012 11:01

BG-300dpi-10x10-logoZESTRON, high precision cleaning products, services and training solutions for the electronics manufacturing industry, will launch its latest cleaning agent HYDRON® WS 325 at the IPC APEX 2012 (booth #3621) held at the San Diego Convention Center, San Diego, CA, from 2/28 until 3/1/12.

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Indium Corporation technology experts presenting at APEX

Written by dburford Friday, 17 February 2012 09:55

Several Indium Corporation technology experts will share their technical expertise at APEX in San Diego, California, February 28-March 1, 2012.
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IPC APEX Expo keynote panel forecasts game changers in the industry

Written by dburford Friday, 17 February 2012 09:16

What will have the greatest impact on the electronics industry in five years? Will it be technology, manufacturing, government regulations or global competition? The Wednesday Keynote at IPC APEX EXPO® 2012, February 28–March 1 at the San Diego Convention Center, will feature five panelists who will provide their unique perspectives on what the game changers will be for the industry.

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New underfill for 0.4-mm pitch POP’s

Written by dburford Tuesday, 14 February 2012 09:26

CN-1736

ZYMET CN-1736

CN-1736 is designed to enhance the drop test reliability of 0.4-mm pitch Package-on-Packages (POP’s) and other fine pitch packages.  Its low viscosity, 650 cps, permits fast, void-free flow into very narrow gaps.

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GOEPEL electronic to exhibit test equipment at IPC APEX 2012

Written by dburford Thursday, 09 February 2012 11:01

GOEPEL electronic will be present again at this year's IPC APEX in San Diego, CA, exhibiting the latest JTAG/Boundary scan solutions and AOI, AXI, and THT inspection solutions at booth # 2450. 

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Free technical programs and activities at IPC APEX EXPO provide solutions to critical industry challenges

Written by dburford Thursday, 09 February 2012 10:02

Renowned for the industry’s premier technical conference and courses, IPC APEX EXPO® also includes ample opportunities to learn about industry issues and find solutions free of charge.
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Charlie Barnhart & Associates LLC (CBA) to host roundtable discussions at IPC APEX Expo

Written by dburford Wednesday, 08 February 2012 16:50

Charlie Barnhart & Associates LLC (CBA), provider of hard data about the cost drivers and risks of global electronics manufacturing, will cohost of a day of roundtables and interviews at the upcoming IPC APEX Expo, scheduled to take place February 28-March 1, 2012 at the San Diego Convention Center in California. 

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GOEPEL electronic to exhibit test equipment at IPC APEX 2012

Written by dburford Wednesday, 08 February 2012 10:30

GOEPEL electronic will be present again at this year's IPC APEX in San Diego, CA, exhibiting the latest JTAG/Boundary scan solutions AOI, AXI, and THT inspection solutions at booth # 2450.

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