IPC APEX Expo 2012

Christopher Associates to Introduce Leading-Edge SPI at the 2012 IPC APEX EXPO

Written by dburford Tuesday, 21 February 2012 14:54

Christopher Associates Inc. introduces the S-1 solder paste inspection system from MEK. The S-1 represents the leading edge in solder paste inspection technology.

 

Nordson YESTECH to feature new high speed FX SL automated optical inspection solution at APEX 2012

Written by dburford Friday, 17 February 2012 20:04

Upgraded system inspects PCBs at over twice the inspection speed of previous generation models

Company will conduct live demonstrations of their complete line of AOI and automated x-ray inspection (AXI) systems in booth #3209

   

Ersa presents brand new products at APEX

Written by dburford Friday, 17 February 2012 17:46

Ersa-ECOSELECT-1How can production costs be substantially reduced? Ersa machines and plants set the standards in the field of flexible, energy-efficient and sustainable production technologies. The modular design allows customized, sustainable solutions and is the basis for increased profits in your electronics production!

 

New product introduction: ZESTRON to launch HYDRON® WS 325 at APEX 2012

Written by dburford Friday, 17 February 2012 11:01

BG-300dpi-10x10-logoZESTRON, high precision cleaning products, services and training solutions for the electronics manufacturing industry, will launch its latest cleaning agent HYDRON® WS 325 at the IPC APEX 2012 (booth #3621) held at the San Diego Convention Center, San Diego, CA, from 2/28 until 3/1/12.

   

Indium Corporation technology experts presenting at APEX

Written by dburford Friday, 17 February 2012 09:55

Several Indium Corporation technology experts will share their technical expertise at APEX in San Diego, California, February 28-March 1, 2012.
 

IPC APEX Expo keynote panel forecasts game changers in the industry

Written by dburford Friday, 17 February 2012 09:16

What will have the greatest impact on the electronics industry in five years? Will it be technology, manufacturing, government regulations or global competition? The Wednesday Keynote at IPC APEX EXPO® 2012, February 28–March 1 at the San Diego Convention Center, will feature five panelists who will provide their unique perspectives on what the game changers will be for the industry.

   

New underfill for 0.4-mm pitch POP’s

Written by dburford Tuesday, 14 February 2012 09:26

CN-1736

ZYMET CN-1736

CN-1736 is designed to enhance the drop test reliability of 0.4-mm pitch Package-on-Packages (POP’s) and other fine pitch packages.  Its low viscosity, 650 cps, permits fast, void-free flow into very narrow gaps.

 

GOEPEL electronic to exhibit test equipment at IPC APEX 2012

Written by dburford Thursday, 09 February 2012 11:01

GOEPEL electronic will be present again at this year's IPC APEX in San Diego, CA, exhibiting the latest JTAG/Boundary scan solutions and AOI, AXI, and THT inspection solutions at booth # 2450. 

   

Free technical programs and activities at IPC APEX EXPO provide solutions to critical industry challenges

Written by dburford Thursday, 09 February 2012 10:02

Renowned for the industry’s premier technical conference and courses, IPC APEX EXPO® also includes ample opportunities to learn about industry issues and find solutions free of charge.
 

Charlie Barnhart & Associates LLC (CBA) to host roundtable discussions at IPC APEX Expo

Written by dburford Wednesday, 08 February 2012 16:50

Charlie Barnhart & Associates LLC (CBA), provider of hard data about the cost drivers and risks of global electronics manufacturing, will cohost of a day of roundtables and interviews at the upcoming IPC APEX Expo, scheduled to take place February 28-March 1, 2012 at the San Diego Convention Center in California. 

   

GOEPEL electronic to exhibit test equipment at IPC APEX 2012

Written by dburford Wednesday, 08 February 2012 10:30

GOEPEL electronic will be present again at this year's IPC APEX in San Diego, CA, exhibiting the latest JTAG/Boundary scan solutions AOI, AXI, and THT inspection solutions at booth # 2450.