Articles & Papers
Pushing the barriers of wafer level device integration
Tuesday, July 8, 2008
—Techsearch has predicted a compound annual growth rate of more than 24% for wafer-level packages between 2005 and 2010. Contract electronics manufacturers and original design manufacturers face a range of handling problems when using these small silicon devices in assemblies.
White paper: Bumping BGAs using solder paste printing process for RFI shields packaging
Friday, January 26, 2007
—One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies consists of "snapping" the shell-like shields onto solder spheres that are soldered to printed circuit board [PCB] pads.
7.2 – Evaluation of wafer bumping stencils
Wednesday, March 7, 2007
—In order to better characterize the performance of wafer bumping stencils, a novel solder transfer ratio has been defined that relates the amount of solder paste volume transferred to a wafer to the actual stencil aperture volume.
Cost reduction of wafer level packaging
Monday, August 17, 2009
—Solid state imagers are being incorporated in an ever-expanding diversity of products.
Wafer–level cavity package with via–through pad interconnects
Monday, June 16, 2008
—The continued drive toward solid state imagers with greater pixel numbers and smaller pixels adversely affects yields, particularly through physical contamination during assembly of the camera module.
Metal–based wafer level packaging
Monday, August 17, 2009
—Metal based wafer bonding for WLP has several advantages, including
enhanced hermeticity, and it facilitates vertical integration.
Molded underfill process for the SiP
Friday, January 9, 2009
—For our application and experiment, a new underfilling process, molded underfill (MUF), is being investigated.
Wafer-level solder sphere placement and its implications
Friday, August 6, 2010
—There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing, electroplating, or sphere dropping.
Integrated testing, modeling and failure analysis of CSPnl for board level reliability
Friday, July 9, 2010
—The wafer level chip scale package (WLCSP) is gaining popularity for its performance and for its ability to meet miniaturization requirements of certain electronic products, especially handheld devices like cell phones.
PACTECH at NEPCON CHINA 2012
Pac Tech - Packaging Technologies is a worldwide leader in both Wafer Level Bumping & Packaging Services and in Advanced Packaging Equipment Manufacturing.
Pac Tech has over 15 years of experience in the industry and has manufacturing sites all around the world, including: Germany, United States, Japan, and Malaysia. These sites can supply both engineering and prototyping services, as well as high volume production.
For more information, please visit: www.pactech.de
Interview: Poornima Shenoy, president of the India Semiconductor Association
Debasish Choudhury interviews Poornima Shenoy, president of the India Semiconductor Association (ISA)
GPD GLOBAL at APEX IPC Expo 2012
GPD demonstrated at the APEX IPC Expo 2012 in San Diego, the PCD and MicroDot technologies on its MAX Series platform. MAX Series dispensing systems offer high accuracy, precision dispensing over a wide range of applications. The MAX Series platforms are ideal for die attach, underfill, MEMS, micro-volume conductive adhesive and paste applications. Max Series equipped with Micro-volume technology enables dispensing for 0201 components as well as die attach adhesives. Further expanding the Max Series capabilities with the continuously volumetric PCD dispense pump yields outstanding results with underfills, encapsulation and LED applications.
For more Information, please visit: www.gpd-global.com
Video Editor: Elisangela Dahlke
Juki at APEX 2009
Juki president Bob Black talks about the new equipment Juki brought to IPC APEX Expo 2009: the JX-100 15,000 pph entry-level placement machine, an upgraded 2080 fine pitch placer, the highest speed soldering machine on the market, and their new flexible, entry-level W510 soldering machine.
Bergen Systems Pvt Ltd at COMPONEX NEPCON India 2009
Pradeep Kaura of Bergen Systems Pvt Ltd introduces a new placement system and in-circuit tester.
OKI at NEPCON South China 2014
We congratulate OK International's Paul Wood at Nepcon South China for winning an award for their latest solder cleaning solution 'Solder Bee' and discusses how OKI respond to the rapid advances in new packages launched onto the market.
MIRTEC at SMT/HYBRID/PACKAGING 2010
David Bennett, managing director of MIRTEC Europe, shows off the MS-11 high speed inline solder paste inspection system and the MV-7XI with the award-winning integrated Intelli-Scan laser inspection system for detecting lifted leads and coplanarity.
Milara at IPC APEX Expo 2011
Stephen Brodeur introduces the fully inline Milara TouchPrint stencil printer series, which is now in full release. It features the fully integrated CyberOptics SE500 post-print inspection technology and Asymtek dot dispensing option.
Nordson Asymtek at IPC APEX Expo 2013
Trevor Galbraith interviews Dan W. Ashley, Market Specialist Printed Circuit Board Assembly of Nordson Asymtek at Apex Expo 2013
From our Columnists
Wafer level packaging and the third dimension
Tuesday, September 23, 2008
Depending on how liberal one is in their definition of what a wafer
level package is, the technology is either entering its second, third
or perhaps even its fourth or fifth decade of use.
IC packaging technology retrospective
Monday, March 2, 2009
—All IC packaging technology structures since the invention of the
integrated circuit itself have been tasked to perform, at a minimum,
the simple and fundamental tasks of interconnecting and protecting the
semiconductor die and making it useful for interconnection at the next
7.7 – IC packaging
Thursday, August 16, 2007
—While the glamour of the integrated circuit has diminished little over the nearly five decades of its existence, it has become increasingly clear in the last several years that the performance of semiconductor chips is being gated by the IC package.
PiP, PoP and PuP
Monday, April 6, 2009
—Since the beginning, all IC packages have been designed to perform the
basic tasks of interconnecting and protecting the semiconductor die and
making it useful for interconnection at the next level.
6.2 – Standards for IC packages: blessing or burden?
Wednesday, February 1, 2006
—Since shortly after the introduction of the first ICs there has been an effort to put in place standards for IC packages.
Is a standard lead pitch for components possible?
Tuesday, July 3, 2012
—IC packaging technology has led the march of progress since the earliest days of the electronics industry. Decisions made by those responsible for packaging integrated circuits have a ripple effect that extends to the rest of the electronics industry.
3d: Benefits and challenges
Thursday, September 26, 2013
—While a substantial amount of electronic interconnection has been performed in the 3rd dimension throughout the history of electronics, the pursuit of 3D interconnections at chip level is relatively new, even though some prescient inventors in the earliest days of the semiconductor industry foresaw its potential benefit.
Microelectronics Assembly and Packaging (MAP) workshop 2008 review
Monday, February 9, 2009
—The 8th International workshop on microelectronics assembly and
packaging technologies was held in late November of last year and
continues to be one of the best-kept open secrets of the IC packaging
7.8 – IC packaging and interconnection technologies’ 4th dimension challenge
Tuesday, September 4, 2007
—Over the course of the last five or six years there has been an explosion of innovation in the realm of IC packaging.
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Sensor System accurately monitors material level in pressurized reservoirs
Thursday, October 23, 2014—A new Low-Level-Sensing Reservoir System from Dymax Corporation prevents empty material reservoirs from introducing air into dispensing lines, thereby eliminating contamination during the dispensing process. The system utilizes an adjustable sensor for use with pressurized reservoirs, and features an SB-100 controller which activates a warning when the material in the reservoir reaches a specified low level.
XJTAG releases boundary scan for Teradyne TestStation
Wednesday, October 22, 2014—XJTAG, a supplier of boundary scan technology, announced the release of the XJLink2-CFM and XJLink2-CFMx. The new modules provide Teradyne users with integrated access to XJTAG’s powerful test and programming tools, operating under the control of the TestStation™ test program.
Cree Releases SPICE Models for C2M SiC Power MOSFETs
Wednesday, October 15, 2014—To take full advantage of all the benefits of SiC technology, power converters must be redesigned specifically for SiC devices. SiC MOSFETs have significantly different characteristics than silicon devices, and thus require SiC-specific models for accurate circuit simulations. Cree’s behavior-based and temperature-dependent SPICE model delivers accurate simulation results without compromising speed and includes self-heating and transient thermal capabilities.
Fabrico offers OSHA HCS labelling requirements for products containing hazardous chemicals
Tuesday, October 14, 2014—Fabrico, the leader in design and manufacturing services for flexible materials and advanced assembly, provides packaging and label printing of OSHA’s Hazardous Communication Standard (HCS), which requires manufacturers of products that contain potentially harmful chemicals to apply hazard information and pictograms on their packaging and labels.
SolderStar engineers a new profiling platform to ensure quality control of today’s complex technologies
Thursday, October 9, 2014—With technologies constantly changing and smaller and more complex designs being developed, it poses a problem in the manufacture of quality printed circuit boards making the use of reflow oven profiling ever more important. With this in mind, SolderStar Ltd, a leading specialist manufacturer in the design and development of thermal profiling equipment for the lead-free electronics industry, has developed the DeltaProbe, a new add-on technology that ensures a quality product.
Everett Charles Technologies launches versatile RF probes for semiconductor test
Thursday, October 9, 2014—Everett Charles Technologies (ECT) launches two new members of the ZIP™ probe family designed to meet signal integrity challenges driven by the ever increasing speed of semiconductors devices. Z0 and Z1 probes are a cost effective solution that provide excellent mechanical reliability and electrical performance.
Altium announces Altium Designer 15 to ease high speed PCB design woes
Wednesday, October 8, 2014—Altium Limited, a global leader in Electronic Design Automation, native 3D PCB design systems and embedded software development toolkits, announced the upcoming release of its professional printed circuit board (PCB) and electronic system level design software, Altium Designer 15.
EV Group unveils room-temperature covalent bonder for engineered substrate and power device production applications
Tuesday, October 7, 2014—EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the EVG®580 ComBond®―a high-vacuum wafer bonding system, which enables electrically conductive and oxide-free covalent bonds at room temperature.
New inline selective soldering machine published:
Monday, October 6, 2014—The “PD” (parallel & double) version of the Interselect Inline machines highly increases the flexibility and the through-put. With the double conveyor and two solder pots this system can process up to two circuit boards in each module. The machine can be used in two different modes:
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