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The global assembly journal for SMT and advanced packaging professionals



Global SMT & Packaging Magazine

Global SMT & Packaging Magazine
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Special Topics: Lean manufacturing & Six Sigma
Lean manufacturing considers the expenditure of resources for any goal other than the creation of value for the end customer to be wasteful, and thus a target for elimination. "Lean" is centered around creating more value with less work.

Six Sigma, using a set of quality management methods, seeks to improve the quality of process outputs by identifying and removing causes of defects and variability in manufacturing. Each Six Sigma project carried out within an organization follows a defined sequence of steps and has quantified financial targets--cost reduction or profit increase.

Kaizen, Japanese for "improvement", focuses on continuous improvement in manufacturing activities.

Statistical Process Control (SPC) is an effective method of monitoring a process through the use of control charts.

Learn about these and other business and process improvement tools and philosophies here.
Articles & Papers
EMS
Monday, June 8, 2009Lean Sigma, an approach that has been in practice for several years, mixes the lean manufacturing concept and problem solving approach with Six Sigma for a more efficient manufacturing process.

Tools & Methods for Lean Production Management in EA
Monday, June 16, 2008Lean manufacturing is far from a new concept, and many within the electronics assembly (EA) industry are already familiar with the principles and concepts behind it.

SPC and usage difficulties in SMT
Tuesday, November 18, 2008The idea of monitoring manufacturing processes using statistical methods goes back to the 1920s when Walter A. Shewhart, an American physicist, engineer and statistician, was engaged by the Western Electric Company in Chicago to find a way to produce their products with a certain quality level. 

Placement optimisation in a lean manufacturing environment
Wednesday, February 6, 2008Tier 2 and Tier 3 EMS companies face increasing pressure from competition in low-cost manufacturing countries to produce assembled boards at lower cost, with increased complexity and to tighter deadlines.

6.10 – Inventory management: combining business intelligence & material handling hardware
Monday, January 8, 2007Most business intelligence (BI) tools and supply chain management (SCM) applications address inventory issues from either a software perspective or a material handling perspective;.
Efficient line changeover: the key to lean manufacturing
Monday, April 6, 2009Changes in the domestic printed circuit board assembly industry have resulted in a dominant shift to a high-mix, low-volume (HMLV) manufacturing environment resulting in a high frequency of line changeovers.

Nanotechnology and mathematical methods for high–performance thermal interface materials
Monday, June 16, 2008Higher power chips have resulted from a variety of new developments in the electronics industry.

 

Solder-bearing RF shields streamline PCB assembly, reduce costs, improve quality and eliminate signal leakage
Thursday, October 31, 2013This Tech Bulletin addresses the specific challenges involved with soldering RF shields to PCBs and explains how using solder-bearing technologies to pre-apply solder to the shields can significantly improve assembly processes and productivity, while enhancing quality of the final product.  
This issue has become especially important with the widespread requirements for RF shielding that is used in small form-factor products such as Smartphones, tablets and other handheld devices that require consistent quality within very high-volume production environments.

Parts management
Tuesday, January 4, 2011Almost 30 years after the fact, we’re still asking PCB designers to “build their own fonts” (so to speak) on a daily basis, to great expense.
 
Videos
Hitachi at IPC APEX Expo 2011
Matt Wyglendowski introduces the new Sigma platform from Hitachi. The focus of the machine is flexibility, high speed placement and accuracy, and offers one of the largest component ranges in the industry.
MYDATA Automation at IPC APEX Expo 2009
Brian Duffey introduces the Flow Line for lean manufacturing.
Valor Division of Mentor Graphics Corporation SMT/HYBRID/PACKAGING 2011
Michael Ford shows off some interesting new materials management products from the Valor Division of Mentor Graphics, which are of incresaing interest to manufacturers during this time of component and materials shortages.
SEHO at SMT HYBRID 2015
Heike Schlessmann tells Trevor Galbraith about SEHO's latest Lean Select system at the SMT HYBRID show in Nuremberg
Yamaha at APEX 2015
The Sigma G5 mounter is under discussion as Trevor Galbraith interviews George Babka on the YAMAHA booth at the APEX show in San Diego, California
CES14 Audi
Global SMT Columnist Phil Stoten speaks to Marcus Keith, GM, Project Management for AUDI at CES 2014 in Las Vegas
Alpha at APEX 2015
Alpha's Director of Global Product Management Tom Hunsinger talks to Trevor Galbraith at APEX 2015 in San Diego, CA
Vi Technology at SMT/HYBRID/PACKAGING 2010
Chris Davies, Vi Technology's sales director, shows off the 5K Perform for high-quality, high-reliability detection for boards up to 535 mm square. Equipped with Vi Technology's proven vision technology, it can inspect components down to 01005.
DEK at SMT/HYBRID/PACKAGING 2011
Stefan Techau talks about the three new highlights of their product range: ProActiv, which enhances print quality; Nano-ProTek for coating stencils for improved yield; and HawkEye inspection software.
From our Columnists
Thermal management, part 2
Friday, August 12, 2011Last month opened this discussion of thermal management, providing background as to the importance of thermal management predicated on transistor density increase, and the rise in on-chip frequencies that are combining to increase thermal energy densities on the IC.
Thermal management, part 1
Wednesday, July 6, 2011As chip features shrink, transistor density increases, on-chip frequencies rise, and so also do the thermal energy densities on the IC.
 
 
Latest SMT Answers questions
There are no questions related to this area at this time. Visit the SMT Answers section to ask your own or explore questions from other process areas and topics.
Latest Products
A cool solution - Techsil’s new heat transfer tapes for thermal management in electronic systems
Thursday, July 9, 2015Heat is often the enemy of performance in today’s intricate electronic systems, Techsil’s new thermally conductive, pressure sensitive adhesive tapes provide a cooling solution by efficiently transmitting heat away from sensitive components. These double-sided tapes are designed for bonding heat sinks on PCBs, LED strips and IC packages, mounting of ICs, GPUs, heat pipes and for heat sink assembly.

Finetech's new Sigma bonder
Wednesday, July 8, 2015Finetech introduces the new FINEPLACER® Sigma bonder, designed to provide a solution for large die up to 100mm, combined with a working area of 450 x 300 mm. The FINEPLACER® Sigma is ideally suited for high-density array applications and high bond force (up to 1000N) requirements, coupled with Finetech's renowned sub-micron placement accuracy.

Altium announces new feature updates to enterprise data management solution for enhanced design data management
Wednesday, June 10, 2015Altium Limited, a Global Leader in Electronic Design Automation, Has Released an Update to Their Enterprise PCB Design Data Management Solution - Altium Vault. This New Update Includes a Number of New Features for Improved Component Management, Data Management, Project Collaboration, and Infrastructure Management.

Altium releases never-before-seen roadmaps for entire product portfolio to Public
Monday, June 1, 2015Altium Limited, a has announced the public release of roadmaps for their entire product lineup. this never-before-seen look into the inner workings of product development at Altium provides a rare perspective on the future goals for the company’s PCB focused design and management tools.

Selective soldering now an even more affordable alternative
Tuesday, May 26, 2015The IS-T-300 from Manncorp is an all-in-one selective fluxing and soldering system, designed to deliver high quality and consistent, efficient performance at a price point that will make the technology even more attractive to a wider range of users. For only $49,995, the IS-T-300 comes fully-equipped with advanced features like high-precision drop-jet fluxing, laser-controlled wave height compensation, and CAD data import.

GE’s phoenix x|aminer inspection system now available with CMOS flat panel detector-based computed tomography
Friday, May 1, 2015GE (NYSE:GE) Measurement & Control, a division of GE Oil & Gas, introduced the CMOS-flat panel detector version of the 5-axis phoenix x|aminer. With computed tomography (CT) capability and a CT-dedicated software package, the latest version generates extremely high quality imaging for 3D and 2D inspection in the electronics sector. The new functionality saves time and costs in failure analysis, process control in printed circuit board assemblies and component inspection, and in research and development.

Data I/O introduces PSV5000 automated programming system
Friday, April 24, 2015

Data I/O Corporation (NASDAQ: DAIO), global provider of advanced programming and IP management solutions for flash, flash-memory based intelligent devices and microcontrollers, announced the release of the PSV5000 automated programming system. The PSV5000 is the newest automated programming solution in Data I/O’s award-winning PSV family.

Peak Group adds new fixture interface for boundary scan to portfolio of PXI automatic test systems
Wednesday, April 22, 2015The new PXI 1149/VPC(x) Pull-Thru receiver ensures an outstanding signal quality in the interface between GOEPEL electronic's PXI/PXIe SCANFLEX(R) Boundary Scan controllers and test fixtures, and completely eliminates the complication of any kind of manual wiring in the configuration of the interface.
Mycronic launches the Prexision-MMS
Monday, April 20, 2015Mycronic AB (publ), launches the Prexision MMS, a measurement system, for quality assurance of advanced photomasks. The product launch will take place during Photomask Japan. In connection with this event Mycronic hosts a global customer seminar and gathers together customers, partners and other manufacturers within the display industry.
 
Manufacturers
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