Text size
The global assembly journal for SMT and advanced packaging professionals
Soldering and Profiling Discussion Panel
Select Category:
Rate Sign in to rate
Views: 7609
From: obliqik
Added: 2009-04-07
Category: Discussions & Debates
Duration: 0:33:46
Video Description: Mike Buetow of Circuits Assembly magazine moderates a discussion panel on soldering and thermal profiling at APEX 2009. Panelists include Keith Howell of Nihon Superior, Fred Dimock of BTU and Michael Limberg from KIC.
Comments (0)Add Comment

Write comment

busy

Your Account






Forgot login? Click here.
No account yet? Subscribe