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The global assembly journal for SMT and advanced packaging professionals
Soldering and Profiling Discussion Panel
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Views: 8641
From: obliqik
Added: 2009-04-07
Category: Discussions & Debates
Duration: 0:33:46
Video Description: Mike Buetow of Circuits Assembly magazine moderates a discussion panel on soldering and thermal profiling at APEX 2009. Panelists include Keith Howell of Nihon Superior, Fred Dimock of BTU and Michael Limberg from KIC.

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