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Stencil, Solder Paste & Printing Defects - Solder Paste Slump

Solder slump is fairly uncommon today with so many well-developed paste products on the market. Slumping can occur when the ambient temperature in the workplace increases, which may happen during the summer periods when air conditioning is not available in the factory.

Figure 1: Solder slump can be traced back to thermal environment.

Slumping can also occur when boards are printed directly from a reflow oven. This can occur when a double sided product is being produced.

With the move to lead free soldering, exit temperatures from the reflow oven may be higher. This could impact double sided products in high volume production


More Stencil, Solder Paste & Printing Defects:

Slump
© 2007 Trafalgar Publications
Text and photos courtesy of Bob Willis