Global SMT & Packaging Show Central: APEX 2008
Global SMT & Packaging magazine           

Video Coverage

Discover the latest developments in wafer processing, test, assembly and packaging, materials, photovoltaic and more at SEMICON West 2008.

This year's show is being held July 15–17, 2008, at the Moscone Center in San Francisco, California, and will feature a wide range of programs and events, along with an impressive exhibition. Here are just some of the things you might find interesting:

Hot! TechXPOTs
TechXPOTsDiscover the hottest technology and market trends in micro- and nanoelectronics at the TechXPOTs—three “shows-within-the-show”—featuring exhibits, products, FREE live technical presentations and more! TechXPOTs offer visitors the opportunity to see the latest technologies; meet with leading, innovative companies; and interact with technologists, peers, and colleagues. Explore the trends of tomorrow and find solutions for today’s technology and manufacturing challenges at the TechXPOTs. This year's TechXPOTs focus on emerging markets; test, assembly and packaging; and device scaling. More info.

Product   Product   Product

Hot! EHS and Sustainability Programs and Events
Growing public and corporate interest in sustainability and environmental issues are creating new challenges and opportunities for companies and individuals across the global microelectronics and related industries. SEMICON West 2008 is the place to get connected to the current trends and issues driving environment, health, safety, and sustainability in the industry today. More info and full schedule.

Short Courses and Workshops
SEMICON West features a number of short courses and workshops from PTI and SPIE, covering topics from "Introduction to IC Design and Fabrication" and "Design of Experiements (DOE) for Semiconductor Manufacturing and Development" to "DFM, Profitable Scaling Through Design-Technology Co-optimization." More info and full schedule.

The SEMI/Gartner Market Symposium (held at the San Francisco Marriott)
Jim CliffordMonday, July 14, 2008 | 1:00pm to 5:30pm
The SEMI Market Symposium, co-presented by SEMI and Gartner Dataquest, provides a midyear market update and a forum to discuss pertinent business issues. SEMI and Gartner Dataquest will present market forecasts and analysis for the semiconductor, capital equipment and semiconductor materials industries. The symposium's keynote speech, "A Changing Model for a Changing Landscape," will be given by Jim Clifford, senior vice president and general manager of operations for QUALCOMM CDMA Technologies. More details and full schedule.

SEMI Packaging Summit (held at the Novellus Theater at the Yerba Buena Center for the Arts)
Tuesday, July 15, 2008 | 10:30am to 12:30 pm
3D through silicon via (TSV) technology is one of the hottest topics in the industry today. Potential applications for 3D TSV include image sensors, flash, DRAM, processors, FPGAs and power amplifiers. There is no question that 3D TSV will be adopted, but the timing for mass production depends on how the cost of the new technology compares with that of existing technologies. While image sensors for camera modules are already in volume production, the adoption time for other applications is longer than originally predicted, as is common with the introduction of many new technologies. Design, thermal, and test issues remain a barrier to TSV adoption in some applications, though progress is being made.

Novellus Theater at YBCAHow to Breathe New Life Into Old Fabs (held at the Novellus Theater at the Yerba Buena Center for the Arts)
Tuesday, July 15, 2008 | 1:30 pm to 5:30 pm
Although 300mm fabs and talk of 450mm wafers capture the headlines, there are profits to be made when existing fabs are upgraded or "repurposed" for new products and technologies. Fab repurposing is going on across the globe and spurring additional business and growth opportunities equipment and materials supplies, and their customers. Companies up and down the supply chain will show how they are profiting from fab repurposing.

North American Photovoltaic Advanced Manufacturing Technology Conference (held at InterContinental Hotel)
Session 1: Tuesday, July 15 | 2:00pm to 6:00pm Session 2: Wednesday, July 16 | 9:00am to 10:00am
The North America Photovoltaic Advanced Manufacturing Technology Conference will focus on the solutions, the manufacturing equipment, and technology that the industry is able to provide to the wafer, cell and module makers in order to become more competitive in the global energy market. Industry leaders will present their suggestions for improvements both for the fast developing thin-film as well as for bulk silicon production facilities. Different elements of the production process will be highlighted: integrated logistics and automation; quality control and traceability, (advanced) statistical process control [(A)SPC] and preventive maintenance. New technology breakthroughs will also be presented.

Video Coverage

Moscone Center
Click map to view this location on Google Maps.

Located in the urban heart of San Francisco's downtown district, The Moscone Center is easily accessible by public transit, including ferry and streetcar, BART, MUNI Metro and Caltrain. Driving in from the San Francisco International Airport or via either the Golden Gate or Bay bridges is also convenient. Several transportation services are also available from the airport.

Public Transit
Ferry and streetcar. To get to Moscone Center from the Ferry Building, walk through the building and exit on onto Embarcadero Boulevard. Cross the street to a streetcar platform and catch the F-line streetcar down Market Street to Third Street. Walk two blocks down Third Street. The facility is on your right, on either side of Howard Street.

BART, MUNI Metro. Disembark at the Powell Street Station. Exit to 4th and Market Streets. Turn right on 4th. Walk two blocks south to Howard and turn left. The Moscone Center is located on the 700 block of Howard Street.

CalTrain. From the Caltrain Station (Fourth & Townsend): Across Fourth street from the train station, catch either the #15, #30, or #45 lines. Get off at Third and Folsom. Walk one block north up towards Howard St. Turn left on Howard. The Moscone Center is located on the 700 block of Howard Street.

Driving & Parking
From the airport, go north on Interstate 101 and follow the directions below.

North on Interstate 101. Take 80 East. Then take the 4th Street exit. Take a left on Bryant, a left on Third and a left on Howard. The Moscone Center is located on the 700 block of Howard Street.

Via the Bay Bridge. Take the Fremont Street Exit to Howard Street and turn left on Howard. The Moscone Center is located on the 700 block of Howard Street.

Via the Golden Gate Bridge. Take the Lombard Street exit to Van Ness Avenue. Turn right on Van Ness. Travel south to Grove. This will be approximately two miles. Turn left on Grove Street. Continue to Market Street. Cross Market Street and travel south on 8th Street to Folsom. Turn left on Folsom, left on Third and left on Howard. The Moscone Center is located on the 700 block of Howard Street.

Parking. Parking is available in a number of parking garages in the area. More information and a parking map can be found on the Moscone Center's website.

Other transportation from the airport
Several services available to transport you between the San Francisco International Airport and downtown San Francisco: SFO Airporter/415-495-8404; SuperShuttle/415-558-8500; Lorrie's Airport Service/415-334-9000 or SamTrans/817-1717. For more information on ground access transportation to and from SF0 call 1-800-SF0-2008.

Hotels
SEMICON West has partnered with Convention Management Resources (CMR) to provide housing services for exhibitors and visitors. CMR guarantees the lowest rates without fees or pre-payment, exclusive amenities, and personalized assistance. More information: Exhibitors | Visitors


Technology On Show

Amkor - Booth 7352
Amkor Technology, Inc. introduces a high-performance flip chip packaging technology using an advanced molding process technology that is expected to provide a number of design, cost and performance advantages for field programmable gate arrays (FPGAs), CPUs, graphics processors, and ASICs.
BTU International - Booth 7524
ProductBTU International will feature the new Pyramax 75A reflow oven.
CIMAC - Booth 2716
A new simulation software application known as FabVi (Fab Virtual image) clones semiconductor equipment automation and automated material handling system interface functions for MES software validation testing to help maintain fab efficiency and equipment utilization.
Cimetrix - Booth 5356
Cimetrix, Inc. introduces a new and innovative tool control solution - CIMControlFramework(TM).
Dage - Booth 7401
Dage Precision Industries, a Nordson company, will introduce its newly enhanced 4000HS high-speed bondtester toolset.
DEK - Booth 8111
Building on its decades of materials deposition expertise, DEK has developed several unique advanced technology systems to enable next-generation semiconductor packaging and solar cell production processes.
ECT Semiconductor Test Group
- Booth 7847

Everett Charles Technologies (ECT) Semiconductor Test Group (STG) will highlight various advanced technology products.
FINETECH - Booth 7838
ProductFINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda.
Henkel - Booth 8311
ProductDesigned to streamline the die attach for stacked die applications, Hysol® QMI5100 and Hysol QMI5200 combine the properties and functions of die attach film and dicing tape into one product.
Hesse & Knipps - Booth 7357
Hesse & Knipps GmbH, Paderborn, offers a unique quality control system for monitoring the bond process in real time to the electronics industry.
Indium Corporation - 7834
Indium9.32 Die-Attach Solder Paste is a halogen-free, no-clean, die-attach solder paste that continues to be an industry leader around the world.
JUKI - Booth 7360
ProductJuki focuses on their CX-1 advanced placement system, capable of placing SiP, MCM and other mixed-technology applications as well as standard SMT components.
NuSil Technology - Booth 6468
NuSil will debut its new Electronics Selection Guide, with special features on the benefits of using silicone in harsh environments and NuSil's approach to reducing contamination.
Palomar - Booth 7515
Palomar Technologies, provider of precision automation equipment and contract assembly services for microelectronics, will showcase the latest application capabilities of its high value-added microelectronic packaging services and equipment.
STC - Booth 8235
Wednesday, 09 July 2008
The Semiconductor Test Consortium, Inc. (STC) have created two new working groups and expanded the charter of an existing working group .
Umicore Electronic Materials - Booth 8421
Visit us at our booth no. 8421 at Semicon West and learn more about our MicrobondDocfish product series for bumping applications and beat the champions in a Euro 2008 like competition!
   


© 2008 Trafalgar Publications