Workshops and Courses

Once again, IPC APEX Expo presents a comprehensive technical conference and a full slate of professional development courses.

Technical Conference
This year's technical conference, being held March 31-April 2, offer new research and innovations from key industry players in the areas of board fabrication, design and electronics assembly. New sessions this year include a focus on moisture sensitivity, high temperature processing, die attach, and electronics and the environment. That's in addition to our annual focus on the key areas of soldering, advanced packaging, materials and reliability. Sign up for one day, the full conference or get the most for your money with the Maximum Value Package. Sign up by March 4th and save 20%.

Tuesday, March 31, 2009

PCB Materials
Moderator: Lameck Banda, Dow Chemical
Learn the latest innovations in polymers substrate materials, metallization materials and process and solder mask that are available to meet the challenges facing PCB designers and fabricators. Papers: "A Non-Vacuum Process for Deposition of Thin Copper on Flexible Base Materials" by Alex Beavers, Averatek Corporation; "Polyphenylene Ether Macromonomers Ii. Enhancement of Dielectric Materials" by Edward Peters, Sabic Innovative Plastics; and " Novel Dielectric Materials : Breaking the Gigahertz Barrier" by Roger Tieze, Ciba Specialty Chemicals. Session code S01. 1:30 pm - 3:00 pm.

PCB Reliability I
Moderator: Michael Freda, Sun Microsystems Inc.
This first in a series of three sessions focuses on new techniques for testing and qualifying the PCB. Papers: "Validated Test Method to Characterize and Quantify Pad Catering Under BGA Pads in Printed Circuit Boards" by Jennifer Burlingame, Cisco and "Qualification of Thin-Form Factor PWBs for Handset Assembly" by Mumtaz Bora, Kyocera Wireless Corporation. Session code S02. 1:30 pm - 3:00 pm.

Business
Moderator: Michael Beauchesne, Amphenol Printed Circuits, Inc.
Hear solutions to challenges posed by RoHS and REACH, as well as the latest on how to use cost-effective inspection in electronic assembly. Papers: "Preparing For Green The Impact of Eco-Friendly Product Development on Electronic Components, Systems, and Supply Chains" by Tom Keyserlingk, IHS; "To Be or Not To Be in Color: A 10-Year Study of the Benefits and Pitfalls of Including Color Information in AOI Systems" by Pamela Lipson, Imagen, Inc.; and "Bridging Supply Chain Gap For RoHS Exempt High-Reliability OEMs" by Hal Rotchadl, Premier Semiconductor Services. Session code S03. 1:30 pm - 3:00 pm.

Process Characterization
Moderator: Jasbir Bath, Bath Technical Consultancy
In this session, three technical presentations will cover the evaluation of process efficiency on your bottom line and how to avoid the solder joint defects associated with voids and poor solderability. Papers: " SMT Process Characterization and Financial Impact" by Fan Li, Research In Motion; "FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints" by Dongkai Shangguan, Flextronics Corporate Technology Group; and "Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly" by Mario Scalzo, Indium Corporation. Session code S04. 1:30 pm - 3:00 pm.

Lead Free Processing
Moderator: R. Wayne Johnson, Auburn University
Learn how you can remove some of the chaos from the lead-free world of today’s assembly. Papers: "Low-Silver BGA Assembly Phase I Reflow Considerations and Joint Homogeneity Third Report: A Variety of Low Silver Sac Alloys with Tin-Lead and Sac305 Paste" by Chrys Shea, Shea Engineering Services; "Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications" by Ben Kim, Celestica, Canada; and "Comparison of Thermal Fatigue Performance of SAC105, Sn-3.5Ag, and SAC305 BGA Components with SAC305 Solder Paste" by Gregory Henshall, Ph.D., Hewlett Packard. Session code S05. 1:30 pm - 3:00 pm.

High Performance Materials
Michael Beauchesne, Amphenol Printed Circuits, Inc.
Hear how new materials and fabrication technologies are making it possible to meet the demand for more and more bandwidth. Papers: "A Novel Approach to Copper Wrap Plate" by Rajwant Sidhu, DDi Corp; "The Influence of Material Reactivity in Dk/Df Electrical Performance" by Eric Liao, Taiwan Union Technology Corporation, Taiwan; and "Opening Eyes on Fiber Weave and CAF" by Russell Dudek, Compunetics, Inc., and John Kuhn, Dielectric Solutions, LLC. Session code S06. 3:15 pm - 4:45 pm.

PCB Reliability II
Moderator: David Hoover, Multek
This second session on PCB reliability looks at how PCB performance is affected by a lead-free processing environment and how lead-free and halogen-free materials influence long term reliability. Papers: "Bare Board Material Performance After Pb-free Reflow" by Joe Smetana, Alcatel; "Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics After Accelerated Thermal Aging" by Francesca Scaltro, Mat-Tech BV; and "Long Term Reliability Analysis of Lead-Free and Halogen-Free Electronics Assemblies" by Gregory Morose, University of Massachusetts. Session code S07. 3:15 pm - 4:45 pm.

Pb-Free Metallurgy
Moderator: Jasbir Bath, Bath Technical Consultancy
If you are struggling with these lead-free problems, join us for some real-world solutions. Papers: "Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies" by Lei Nie, University of Maryland; "Rework Process Window and Microstructural Analysis for Lead-Free Mirrored BGA Design Points C to Avoid Secondary (or Partial) Reflow of the Mirrored Solder Joints" by Matthew Kelly, IBM, and Polina Snugovsky, Celestica International Inc.; and "A Study on Copper Dissolution in Liquid Lead Free Solders in Static and Dynamic Conditions" by Jin Liang, EMC Corporation. Session code S08. 3:15 pm - 4:45 pm.

Test and Measurement
Moderator: Robert Hilty, Ph.D., Tyco Electronics
This session covers a range of test topics for today’s assemblies. Papers: "Low Cost Optical Thickness Measurement of Conformal Coatings" by Fritz Byle, Astronautics Corp. of America. Session code S09. 3:15 pm - 4:45 pm.

Copper Interconnect Intergrity
Moderator: Michael Freda, Sun Microsystems Inc.
This session will increase your understanding of the properties of this vital metal. Papers: "Influence of Electroless Copper on IC Reliability" by Tafadzwa Magaya, Atotech Deutschland GmbH BTT PTH, Electronics; "The Effect of Copper Plating Processes and Chemistries on Copper Dissolution" by Jennifer Nguyen, Flextronics Corporate Technology Group; and "A Test Methodology for Copper Dissolution in Lead-Free Alloys" by Christopher Hunt, Ph.D., National Physical Laboratory. Session code S10. 3:15 pm - 4:45 pm.

Wednesday, April 1, 2009

Laminates at Elevated Temperature
Moderator: Patricia Goldman, Dielectric Solutions, LLC
Industry experts discuss the hows and whys of laminate qualification for lead-free assembly. Papers: "Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates" by RaviKumar Sanapala, Tyco Electronics. Session code S11. 9:00 am - 10:00 am.

PCB Moisture Sensitivity
Moderator: Russell Nowland, Alcatel-Lucent
Learn about the impact of moisture on PCBs during processing and what the industry is doing to address this issue through the development of standards and testing. Papers: "Pb-Free Reflow, PCB Degradation, and the Influence of Moisture Absorption" by Craig Hillman, DfR Solutions and "MSL Rating of PWBs Used in Power Product and Board Mounted Power PWB Assemblies" by Robert Roessler, Lineage Power. Session code S12. 9:00 am - 10:00 am.

Jetting
Moderator: Robert Hilty, Ph.D., Tyco Electronics
Discover the latest innovations in jetting for both PCB fabrication and board assembly. Papers: "Electronics Manufacture by Inkjet Printing" by Electronics Manufacture by Inkjet Printing. Session code S13. 9:00 am - 10:00 am.

PCB Contamination Issues
Moderator: R. Wayne Johnson, Auburn University
This session showcases papers on the effects of contamination on tin-whisker growth and surface insulation resistance and electromigration under lead-free assembly conditions. Papers: "Metal Whiskers - Does Surface Contamination Have Any Impact on Whisker Formation?" by Paco Solis, Foresite and "Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders" by Michael Azarian, University of Maryland. Session code S14. 9:00 am - 10:00 am.

Design
Moderator: Gary Ferrari, FTG Circuits
Gain an understanding of design trends in packaging to meet those demands and learn about the design tools and procedures that can aid in meeting the demands of more functions in less space. Papers: "Design for Flip-Chip and Chip-Size Package Technology" by Vern Solberg, STC-Madison and "Predictability of PCB Layout Density" by Ruth Kastner, ADCOM, Israel. Session code S15. 9:00 am - 10:00 am.

Packaging and Reliability Issues
Moderator: Terrance Thompson, Chip Scale Review
This session addresses those reliability issues with a review of lead-free packaging available today for SMT assembly, an investigation of package-on-package reliability, and the reliability of MLCC packages in repair. Papers: "Designers Guide to Lead-Free SMT; Components, PCB Materials and Surface Coatings" by Vern Solberg, STC-Madison; "Assembly and Reliability Investigation of Package on Package" by Brian Roggeman, Unovis Solutions; and "Assembly and Reliability of Package on Package Devices" by Brian Toleno, Henkel Corporation. Session code S16. 10:15 am - 11:45 am.

PCB Reliability III: Test Techniques
Moderator: Patricia Goldman, Dielectric Solutions, LLC
Our third and final session in the PCB reliability track will cover thermal cycling for Lead-free, CAF testing of power products and highly accelerated stress testing of PCBs. Papers: "Considerations in Thermal Cycle Testing of PWBs - Lead Free Applications" by Paul Reid, PWB Interconnect Solutions Inc.; "A Comparison of via Reliability after Lead-Free Soldering using Thermal Cycling and Interconnection Stress Testing" by Christopher Hunt, Ph.D., National Physical Laboratory; and "Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World" by Kevin Knadle, Endicott Interconnect Technologies. Session code S17. 10:15 am - 11:45 am.

PCB Metalization
Moderator: Peter Biocca, Kester
Metalization of PCB vias can be a challenge in the world of dense board features. Papers: "Blind Micro Via and Through Hole Filling in a Horizontal Conveyorized Production System" by Stephan Kenny, Atotech Deutschland GmbH; "Next Generation Pattern Electroplating Process for Microvia Filling and Through Hole Plating" by Mark Lefebvre, Rohm and Haas Electronic Materials; and "Reliable Acid Copper Plating for Metallization of PCB" by Maria Nikolova, MacDermid. Session code S18. 10:15 am - 11:45 am.

Paste & Printing I
Moderator: Robert Priore, Cisco Systems Inc.
At the heart of successful surface mount assembly is good, accurate solder paste deposition. Papers: "The Digital Solder Paste" by Rick Lathrop, Heraeus Inc. and "Using TGA Analysis to Establish Pb-free Solder Paste Heating Profiles and Estimate Stencil Life" by Gerjan Diepstraten, Cobar Europe BV. Session code S19. 10:15 am - 11:45 am.

Testing Strategies I
Moderator: David Hillman, Rockwell Collins
This session is the first of a three-session track on test strategy. Papers: "Analysis of Voiding Levels Under QFN Package Central Terminations and their Correlation to Paste Deposition Volumes and Propensity for Device Stand-off and Poor Joint Quality" by David Bernard, Dage; "Effect of Conductor Surface Roughness upon Measured Loss and Extracted Values of PCB Laminate Material Dissipation Factor" by Scott Hinaga, Cisco Systems, Inc.; and "The Landscape of PCB Technology is Changing Rapidly. How Will AOI Testing Keep Up?" by Pamela Lipson, Imagen, Inc. Session code S20. 10:15 am - 11:45 am.

Polymer Technology
Moderator: Douglas Sober, Kaneka Texas Corporation
This session highlights recent developments in adhesives, under film reinforcement for reliability, thermal interface materials and conductive adhesive. Papers: "Optimizing the Automated Assembly Process for Filled Polymer Based Thermal Bondlines" by David Rae, Unovis Solutions and "Effects of Environmental Exposure on the Performance of Electrically Conductive Film Adhesives for RF Grounding Applications" by Arthur Ackerman, Henkel Corporation. Session code S21. 1:30 pm - 3:30 pm.

Drilling
Moderator: David Hoover, Multek
Drilling still remains at the heart of via formation in PCB fabrication. Papers: "Automated Evaluation of Wear Condition of Micro Drill Bit" by Lianyu Fu, Shenzhen Jinzhou Precision Technology Corp. China; "Mechanically Drilled Controlled Depth Micro Vias an Alternative to Laser Drilling " by Robert Lupfer, DDi Corp.; "The Effect of the Incorporation of Tougheners on the Drillability of Epoxy-based Electrical Laminates" by Lameck Banda, Dow Chemical; and "Drilling of Printed Circuit Boards: Innovative Entry Materials for Improving Accuracy of Micro and Small Diameter Drills" by Rocky Hilburn, Laminating Company of America. Session code S22. 1:30 pm - 3:30 pm.

Soldering Topics
A potpourri of solder topics, from dross control to wave solder and selective solder techniques. Papers: "Economic and Technical Advantages of Chemical Dross Elimination and Prevention" by Dan Feinberg, Fein-Line Associates; "Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes" by Christian Ott, SEHO Systems GmbH, Germany; "The Study of the Nitrogen Effect for Wave Soldering Process" by Han Na Noh, LG Electronics; and "Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses" by Mark Woolley, Avaya. Session code S23. 1:30 pm - 3:30 pm.

Paste & Printing II
Moderator: Robert Priore, Cisco Systems Inc.
In this second session on paste and printing, stencil design will be covered. Papers: "Three Steps to Successful Solder Paste Selection" by John Vivari, EFD Inc., Solder Paste Group; "Step Stencil Design When 01005 and .4mm Pitch BGAs Coexist with RF Shields" by William Coleman, Photo Stencil Inc.; "Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly" by Chris Anglin, Indium Corporation of America; and "Broadband Printing: The New SMT Challenge" by Rita Mohanty, Speedline Technologies, Inc. Session code S24. 1:30 pm - 3:30 pm.

PCB Processing
Moderator: Kevin Knadle, Endicott Interconnect Technologies
PCB processing issues of surface treatment, etching, registration, and lamination will be discussed in this session. Papers: "Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide" by Akira Takeuchi, Nissin Inc.; "New Technology to Improve Etching Performance Using Shiny Side Surface Treatment for HDI" by Keisuke Yamanishi, Nippon Mining & Metals Co., Ltd.; " Improving Registration: When Precision is Not Enough" by Andrew Kelley, Xact PCB Ltd; and "Top Doing More With Less" by Deiter Backhaus, MBT, Monika Backhaus Technologieentwicklungen. Session code S25. 1:30 pm - 3:30 pm.

Thursday, April 2, 2009

Embedded
Moderator: Dennis Fritz, MacDermid, Inc.
s embedded technology in your designs now? Will it be a part of your future product design? Papers: "The Electrical Performance of Buried Sheet Capacities" by J. Lee Parker, JLP Consultants LLC and "Reliability of Ultra-Thin Embedded Capacitor Laminates in Lead-Free Assembly" by Joel Peiffer, 3M Company. Session code S26. 9:00 am - 10:00 am.

Green Tales
Moderator: Michelle Ogihara, Seika Machinery, Inc.
Hear some tales of RoHS, from a light-hearted "view from the trenches" to the serious business of choosing a reliable testing laboratory. Papers: " RoHS War Stories" by Beverley Christian, Research In Motion Limited and "Laboratory 101: A Guide to Understanding Your Testing Laboratory" by Jim Cronin, Environmental Monitoring and Technologies Inc. Session code S27. 9:00 am - 10:00 am.

Surfaces Finishes
Moderator: Kim Hyland, Cisco Systems Inc.
Get up-to-the-minute information on HASL in the lead-free era and learn about a comparative study of the metallic finishes available for lead-free assembly. Papers: "Hot Air Solder Levelling in the Lead-free Era" by Keith Sweatman, Nihon Superior Co., Ltd., Australia and "Creep Corrosion of PWB Final Finishes: Its Cause and Prevention" by Chen Xu, Lucent Technologies Inc. Session code S28. 9:00 am - 10:00 am.

Cleaning I
Moderator: Barbara Kanegsberg, BFK Solutions, LLC
Learn about cleaning of dense assemblies and how to avoid "pockets" of contamination that can lead to product failure in this first of a two-session track on cleaning. Papers: "Collaborative Cleaning Process Innovations from Managing Experience and Learning Curves" by Mike Bixenman, Kyzen Corporation and "Cleanliness Failures - Pockets of Contamination that are Causing Field Failures and How to Avoid Them for Leaded and Lead-Free Processes" by Eric Camden, Foresite. Session code S29. 9:00 am - 10:00 am.

Testing Strategies II
This second session on test strategies will cover new advances in boundary scan and how to make the best of collected parametric data. Papers: "Virtual Access Technique Extends Test Coverage on PCB Assemblies" by Anthony Suto, Teradyne and "Improving Quality by Performing Deep Analytics on Real-tim In-Circuit Test Data" by Victor Nelson, Force10 Networks. Session code S30. 9:00 am - 10:00 am.

Advanced Technology
In this advanced technology session, you will learn the latest developments in pre-form handling and screen printing techniques for the manufacture of LEDs and thick-film circuitry on thin film, solderable substrates. Papers: "RFS Handler Cone Chuck Simplification for Effective Handling Performance" by RFS Handler Cone Chuck Simplification for Effective Handling Performance; "Flexible LED Arrays Made by a Screen Printing Process" by Robert Turunen, DKN Research; and "All Screen-Printing Process Has Been Developed to Build High-Resolution Thick Film Circuits with High Conductivity and Soldering Capabilities on Thin Heat-Resistant Films" by Masafumi Nakayama, NY Industries, Ltd. Session code S31. 10:15 am - 11:45 am.

PCBs and the Environment
Moderator: Beverley Christian, Research In Motion Limited
What are the emerging legislative challenges in the environmental arena? Will it include halogen-free? And what is the real environmental cost of a process? Papers: "Design for Low-Halogen Green Electronics" by Joanne Shipe, DSM Engineering Plastics; "Liquid Photo Resist and Solder Mask Processing: The Real Environmental Impact" by Steven Johnson, GENESIS Material Technology; and "Challenges in Implementing a Halogen-Free Process" by Tim Jensen, Indium Corporation of America. Session code S32. 10:15 am - 11:45 am.

Die Attach Processes
Moderator: Dennis Fritz, MacDermid, Inc.
This session covers flip chip, wire bonding and stud bump technologies that may challenge you now or in the future. Papers: "Flip Chip Bonding - Mainstream for All Pin Counts" by Jacques Coderre, Unovis Solutions and "Selective Electroless Nickel and Gold Plating of Individual Integrated Circuits for Gold Stud Bump Flip-Chip Attachment" by David Lee, Johns Hopkins University. Session code S33. 10:15 am - 11:45 am.

Cleaning II
Moderator: Barbara Kanegsberg, BFK Solutions, LLC
Cleaning chemistries, in line cleaning and batch cleaning are highlighted in this last cleaning track session. Papers: "Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution" by Umut Tosun, ZESTRON America ; "Oscillating Nozzle Technology for Improved Cleaning Performance" by Eric Becker, Speedline Technologies, Inc.; and "Cleaning Today’s Assemblies in Batch Systems - A Comparison of Processes from Around the World" by Jay Soma, Petroferm. Session code S34. 10:15 am - 11:45 am.

Testing Strategies III
The final session in the test track focuses on probe testing. Papers: "ICT Probe Penetrability of Solder Paste Flux Residues with a Vacuum-Actuated Fixture" by ICT Probe Penetrability of Solder Paste Flux Residues with a Vacuum-Actuated Fixture; "Navigating Automated Optical Inspection (AOI) in Today’s Production Environments" by Stacy Kalisz Johnson, Agilent Technologies; and "Solving Today’s In-Circuit Test Challenges on Difficult to Probe PCB Targets" by Stacey Marotta, QA Technology. Session code S35. 10:15 am - 11:45 am.

Professional Development Courses
64 comprehensive, intensive professional development courses and workshops are on offer this year. Find out about the latest in advanced technologies, design, eco-compliance, lead-free technologies, materials, process improvements, solder joint reliability and more. Courses are held on March 29 & 30 and April 2.

Sunday, March 29th

Achieving High Reliability for Lead-Free Solder Joints—Material Considerations
Ning-Cheng Lee, Indium Corporation of America
This course addresses how multiple factors contribute to failure modes and how to select proper solder alloys and surface finishes to achieve high reliability. Course code PD-01. 8:30 am - 4:30 pm.

What is HDI Technology? Do You Need HDI?
Michael Carano, OMG Electronic Chemicals; Happy Holden, Mentor Graphics
Developed for PCB fabricators as well as designers, this full-day workshop covers key technologies for fabricators who want to get into HDI fabrication, as well as key design recommendations and stackups for designers and hardware engineers who want to know what HDI can do for their next printed circuit board. Course code PD-02. 8:30 am - 4:30 pm.

Design for Reliability: Reliability Testing, Data Analysis and Failure Analysis of Lead-Free Solder Joints
Ning-Cheng Lee, Indium Corporation of America
Solder is the electrical and mechanical “glue,” and solder joint reliability is one of the most critical issues faced by users. Course code PD-03. 8:30 am - 4:30 pm.

Lean and Green SMT - Lean Lead-Free SMT Manufacturing
W. James Hall, ITM Consulting Inc.; Phil Zarrow, ITM Consulting Inc.
This course covers the essentials of lean manufacturing as they apply to SMT electronic assembly and examines the state of the industry in applying and optimizing lead-free materials, solder, equipment and processes. Course code PD-04. 8:30 am - 4:30 pm.

Power Delivery System Design
Lee Ritchey, Speeding Edge
Gain a thorough understanding of power delivery systems (PDS) that you can immediately apply to your designs, use to troubleshoot existing designs or incorporate into next-generation product iterations. Course code PD-05. 8:30 am - 4:30 pm.

Base Material Basics: Manufacture and Market
Douglas Sober, Kaneka Texas Corporation
This course will provide an in-depth analysis of all grades of base materials used in printed boards — from low-cost, paper-based (FR-1) to high-speed/high-frequency PTFE. Course code PD-06. 9:00 am - 12:00 pm.

Making Circuit Boards, One Chemical at a Time
Donald Cullen, MacDermid, Inc.
This course will provide a chemical view of PCB manufacture and a unique summary of the overall manufacturing sequence. Course code PD-07. 2:00 pm - 5:00 pm.

Life-Testing Basics
Thomas Clifford, TJB Consultants
Discover the basics of life-testing, concentrating on thermal-cycle reliability. Course code PD-08. 9:00 am - 12:00 pm.

Introduction to TDR/T Network Analysis
Don DeGroot, CCNi; Michael Janezic, Ph.D., National Institute of Standards and Technology
Expand your understanding of TDR and TDT, and learn how to apply it to high-speed board design and design verification. Course code PD-09. 2:00 pm - 5:00 pm.

Compliance with the Energy using Products (EuP) Directive
Graham Adams, PlesTech Ltd.
The Energy-using Products (EuP) Directive was developed to improve the life cycle performance of products by integrating environmental considerations and requirements into the product design and launch process. Course code PD-10. 9:00 am - 12:00 pm.

Designing Environmentally Sound Product to Meet Legislation and Increasing Expectations from the Marketplace
Graham Adams, PlesTech Ltd.
This course will explore how to integrate it into product design so you can meet legislation requirements, reduce the environmental impact of your products, gain market advantage and even reduce costs. Course code PD-11. 2:00 pm - 5:00 pm.

Failures and their Prevention in Lead-Free Electronic Assemblies
Puligandla Viswanadham, Ph.D., University of Texas at Arlington
Research into the microstructural aspects of lead-free alloys is still in its infancy, and the influence of minor elements on the behavior of lead-free solders has not been adequately explored. Course code PD-12. 9:00 am - 12:00 pm.

Fundamentals in Solder Joint Reliability
Werner Engelmaier, Engelmaier Associates, L.C.
This course explores the mechanisms underlying thermally induced solder joint fatigue, combined with the temperature-, time- and stress-dependent behavior of solder. Course code PD-13. 2:00 pm - 5:00 pm.

Industry Experiences in Lead-Free Rework
Douglas Peck, AEIC
Learn from the experiences of lead-free assemblers that have implemented new processes and materials in their rework operations. Course code PD-14. 9:00 am - 12:00 pm.

PCB Design Fundamentals for High Density Lead-Free Electronics
Vern Solberg, STC-Madison
Only when PCB design related disciplines are properly defined and implemented can maximum assembly process yield be achieved. Course code PD-15. 2:00 pm - 5:00 pm.

Designing with Your "Thumbs"
Susy Webb, Fairfield Industries
This course provides general “rules of thumb” for how and why things should be done to achieve successful board designs. Course code PD-16. 9:00 am - 12:00 pm.

Make the Most of Your Design Cycle Time
Susy Webb, Fairfield Industries
Layout time is often one of the last things considered in the project cycle, so designers need to manage their time wisely to get the job done on schedule. Course code PD-17. 2:00 pm - 5:00 pm.

Flexible Circuit Technology: Structures, Applications, Materials and Manufacturing Processes
Joe Fjelstad, Verdant Electronics
This course will explore this increasingly important member of the electronics interconnection family as it evolves and changes to solve an increasing number of interconnection problems. Course code PD-18. 9:00 am - 12:00 pm.

Flexible Circuits: More Than Just an Electrical Interconnect
Mark Verbrugge, Minco Products Inc.
This course will examine the electrical and mechanical features that must be incorporated into flexible circuit design, and how these features will interact (good and bad). Course code PD-19. 2:00 pm - 5:00 pm.

High Speed Printed Circuit Design - A Practical Approach
Richard Hartley, L-3 Communication, Avionics Systems
Get a comprehensive introduction to high speed circuit and printed circuit board design, and help ensure your success with designs using current and future fast and ultra fast ICs. Course code PD-20. 9:00 am - 12:00 pm.

PCB Base Materials for High Speed, High Frequency and Lead-Free Applications
Richard Hartley, L-3 Communication, Avionics Systems
This course will examine base materials commonly used in high speed digital and high frequency analog circuits. Course code PD-21. 2:00 pm - 5:00 pm.

Introduction to Advanced Packaging
R. Wayne Johnson, Auburn University
This course reviews semiconductor trends driving packaging requirements in terms of routing, electrical performance, thermal management and reliability, including low-k dielectrics and lead free. Course code PD-22. 9:00 am - 12:00 pm.

Advanced Packaging Technologies and Future Interconnection Trends
Joe Fjelstad, Verdant Electronics
This course reviews common IC packages, including chip scale, BGA, 3-D stacked and folded packages. A review of wafer-level packaging is also covered. Course code PD-23. 2:00 pm - 5:00 pm.

Product Cost Reduction Using Supply Chain Modeling
Chet Palesko, Savansys Solutions LLC
This course examines how OEMs and suppliers can collaborate to develop a model that optimizes product manufacturing cost. Course code PD-24. 9:00 am - 12:00 pm.

Survival Is Not Mandatory: 10 Things Every CEO Should Know about Lean
Steven Williams, Plexus Corp.
This course provides a 20,000-ft. view of lean that will help decision makers understand how lean can help any organization survive. Course code PD-25. 2:00 pm - 5:00 pm.

Lead-Free Surface Finishing for PWBs
Donald Gudeczauskas, UIC/Uyemura International Corp.; George Milad, UIC/Uyemura International Corp.
Ball grid arrays, wire bonding pads, press fit and contact switches are all outside the traditional realm of HASL and electrolytic nickel gold tab plating, and require innovative solutions. Course code PD-26. 9:00 am - 12:00 pm.

Taking Terror Out of Lead-Free Circuit Board Surface Finishes and Assembly
Bihari Patel, Bihari Patel SMT Connection, Inc.
The instructor will share his experience with lead free in double-sided, fine-pitch and ball grid array and the use of new, mixed and emerging technologies. Course code PD-27. 2:00 pm - 5:00 pm.

Optimizing the Wave Soldering Process
Ray Chartrand, CharTrain Consulting
Learn about the interactions between surface finishes, flux chemistries and time versus temperature in this course. Course code PD-28. 9:00 am - 12:00 pm.

Leaded and Lead-Free SMT Process Verification
Ray Chartrand, CharTrain Consulting
This course explores methods and tools for verifying and controlling the SMT assembly process. Course code PD-29. 2:00 pm - 5:00 pm.

Ten Questions, Observations and Insights to Measure Confidence in a PCB Manufacturing Facility
Richard Snogren, Bristlecone LLC
This course provides you with practical guidance on how to evaluate PCB manufacturers. Course code PD-30. 9:00 am - 12:00 pm.

PCB Costs - How Designers Affect PCB Costs
Richard Snogren, Bristlecone LLC
This course provides a systematic view of PCB cost drivers, and explores how they can be optimized during the design phase.Course code PD-31. 2:00 pm - 5:00 pm.

Purchasing Basics for the PCB Buyer
Gary Ferrari, FTG Circuits
Gain a solid knowledge-base to guide you through the essentials of purchasing today’s high technology printed wiring boards. Course code PD-32. 9:00 am - 12:00 pm.

The PWB Fabrication Process - Simplified
Gary Ferrari, FTG Circuits
This course will provide a detailed description of the board fabrication process with a special look at how specific design decisions affect the manufacturability of the printed board. Course code PD-33. 2:00 pm - 5:00 pm.

Monday, March 30th

Applying SPC to the Surface Mount Manufacturing Line
William Messina, Data Sleuths
This course will teach the statistical methods necessary for using statistical process control (SPC) on the SMT manufacturing line. Course code PD-34. 8:30 am - 4:30 pm.

Lead-Free Soldering Processes - Survival, Quality, Reliability
Werner Engelmaier, Engelmaier Associates, L.C.
The threat to the reliability of electronic products comes from three sources: solder joint reliability, printed circuit board survival during soldering (and long-term reliability) and component survival of soldering processes. Course code PD-35. 8:30 am - 4:30 pm.

Lead-Free Flip-Chip Wafer-Level Packaging (WLP) for 3D System-in-Packages (SiP) and Printed Circuit Board (PCB) Assemblies
John Lau, Institute of Microelectronics
This course examines the use of lead-free flip-chip wafer-level packaging for 3D SiP with through-silicon-vias (TSV) and PCBs. Course code PD-36. 8:30 am - 4:30 pm.

PCB Fabrication Basics: Process and Specification
Don Schmieder, Plexus Corp.; Jim Vanden Hogen, Plexus Corp.
Using a PCB fabrication specification for reference, participants will learn how to develop their own specifications, including ones for RoHS-compliant PCBs. Course code PD-37. 8:30 am - 4:30 pm.

Advanced Tools for PCB Testing and Failure Analysis
Bob Neves, Microtek Laboratories
This course will discuss advanced test tools and emerging test technology. The benefits of test data provided by electrical and environmental tests, surface analysis techniques and organic material identification will also be addressed. Course code PD-38. 9:00 am - 12:00 pm.

Electrostatic Discharge (ESD), Factory Issues and Product Quality
Hartmut Berndt, B.E. STAT Elektronik Elektrostatik, Germany
This workshop will provide an overview of possible causes for ESD. Additionally, the course will cover ESD control steps and the ESD Control Program (ECP) according to ANSI/ESD S20.20 and IEC 61340-5-1. Course code PD-39. 2:00 pm - 5:00 pm.

Stencil Printing Process for Solder Paste Application—An In-Depth Look
S. Manian Ramkumar, Rochester Institute of Technology
This course will provide a thorough understanding of the print process for solder paste print applications. Course code PD-40. 9:00 am - 12:00 pm.

Advanced Component Packages and Processes
S. Manian Ramkumar, Rochester Institute of Technology
This course will introduce SMT users to the terminology, classifications, construction and assembly process for advanced component packages. Course code PD-41. 2:00 pm - 5:00 pm.

Implementing a Halogen-Free Circuit Board Assembly Process
Tim Jensen, Indium Corporation of America; Ronald Lasky, Indium Corporation of America
This course will lay out the drivers behind the halogen-free movement, and the plans and actions necessary to successfully assemble a totally halogen-free PCB. Course code PD-42. 9:00 am - 12:00 pm.

Statistical Process Control (SPC) for SMT Process
Rita Mohanty, Speedline Technologies, Inc
This course, designed based on the principles of Six Sigma, gives a simple overview of SPC, focusing on the common cause/special cause and within/between variation concept. Course code PD-43. 2:00 pm - 5:00 pm.

Implementing HDI Technology - An OEM Model
Implementing HDI Technology - An OEM Model
This intensive workshop shows you what is involved in HDI product implementation by walking you through a program used successfully by a number of aero/military and telecom OEMs. Course code PD-44. 9:00 am - 12:00 pm.

Materials for HDI and Advanced PCBs
John Andresakis, Oak-Mitsui Technologies
This workshop, designed for both the PCB designer and fabricator, will explore existing and future materials suitable for incorporating into HDI product. Course code PD-45. 2:00 pm - 5:00 pm.

Printed Circuit Board Fabrication - Back to Basics
Michael Carano, OMG Electronic Chemicals
In this course, we will identify and explain the basics of printed circuit board fabrication and the different troubleshooting techniques. Course code PD-46. 8:30 am - 4:30 pm.

Choice of Materials for Flexible Circuits and Flex-Rigid Boards
Jerome Sallo, Ph.D., Sallo Consulting
This course considers flexible base materials, including polyimide, polyester, PEN and LCP. Course code PD-47. 8:30 am - 4:30 pm.

Nanoelectronics, MEMS and MOEMS: Products and Packages
Ken Gilleo, ET-Trends LLC
In this course, you will get a comprehensive but concise view of MEMS (Micro-Electro-Mechanical Systems) and MOEMS (also known as optical-MEMS), along with a survey of emerging nanotechnology—minus the hype. Course code PD-48. 9:00 am - 12:00 pm.

Flexible Circuitry: A World of Applications
Ken Gilleo, ET-Trends LLC
This course compares traditional copper-flex to the polymer thick film (PTF) now used to make value-maximized keyboards, calculators, medical sensors and RFID tags style="background-color: #FFFFCC". Course code PD-49. 2:00 pm - 5:00 pm.

Lead-Free Reliability - How to Alleviate Failures
Jennie Hwang, H-Technologies Group Inc.
Gain an understanding of ultimate reliability of lead-free packaging and assembly in this course, which provides practical how-to information backed by scientific data. Course code PD-50. 9:00 am - 12:00 pm.

Interactive Discussion on Lead-Free Electronics
Jennie Hwang, H-Technologies Group Inc.
Get answers to your questions about lead-free electronics during this interactive course. Course code PD-51. 2:00 pm - 5:00 pm.

Lead Free for the Exemptee — Surviving in a Lead-Free World
W. James Hall, ITM Consulting Inc.; Phil Zarrow, ITM Consulting Inc.
This survival course provides RoHS exemptees with the background and guidance to develop a strategy for protecting the long-term viability and reliability of their products and business. Course code PD-52. 9:00 am - 12:00 pm.

Lessons Learned - Lead-Free Surface Mount Technology
Chrys Shea, Shea Engineering Services
This course reviews the most common problems that have occurred in lead-free soldering, how to avoid them and methods to address them if they do arise. Course code PD-53. 2:00 pm - 5:00 pm.

Taking Stress out of Lead-Free Assembly by Weeding out PCB Fabrication Defects Before Assembly
Bihari Patel, Bihari Patel SMT Connection, Inc.
This course will explore deficiencies in fabrication and explain how they can be addressed through following best practices, using several examples from the instructor’s experiences. Course code PD-54. 9:00 am - 12:00 pm.

Practical Tips for Reballing Devices
Ray Cirimele, B E S T Inc.; Robert Wettermann, B E S T Inc.
This course tackles methods of reballing, including the solder preform and stencil technique. Course code PD-55. 2:00 pm - 5:00 pm.

Surface Mount Technology: Principles and Practice in a Lead-Free World
Ray Prasad, Ray Prasad Consultancy Group
This course identifies the technical issues companies must resolve in order to implement mixed-assembly electronics products for tin-lead and lead free. Course code PD-56. 9:00 am - 12:00 pm.

Troubleshooting Yield Problems in a Lead-Free World
Ray Prasad, Ray Prasad Consultancy Group
This course focuses on three major areas of defects in SMT (design, assembly and the quality of incoming materials) and addresses DFM and BGA-related issues. Course code PD-57. 2:00 pm - 5:00 pm.

LGA and QFN Design, Assembly and Rework Guide
Bob Willis, Electronic Presentation Services
This practical, “how to” course will review each step of the implementation process for LGA and QFN devices and present results of practice process trials with these devices. Course code PD-58. 9:00 am - 12:00 pm.

Vapor-Phase or Convection Reflow Soldering for Lead-Free and Tin-Lead Assembly
Bob Willis, Electronic Presentation Services
This how-to-do-it course uses examples and visual aids to examine all aspects of the different processes, and covers soldering performance and yield from different joint terminations, solder finishes and joint structures. Course code PD-59. 2:00 pm - 5:00 pm.

True Design for Reliability - Understanding What Is and What Is Not DFR
Craig Hillman, DfR Solutions
True DFR requires a technical knowledge of electronic packaging, discrete components, printed board, solder assembly and connectors—and how these aspects of electronics can fail in regards to environmental stresses. Course code PD-60. 9:00 am - 12:00 pm.

Understanding Failure and Root-Cause Analysis in Lead-Free Electronics
Craig Hillman, DfR Solutions
A wide variety of case studies will be presented, including red phosphorus in epoxy encapsulants, creepage corrosion in immersion silver and solder joint failures. Course code PD-61. 2:00 pm - 5:00 pm.

Thursday, April 2nd

Via Hole Filling Technology and Processes: An Overview of Materials, Processes, Equipment and the Technology Drivers for Via Hole Filling
Michael Carano, OMG Electronic Chemicals
This workshop describes the technological drivers behind the need for via filling in a highly effective and reliable fashion for high density, high aspect ratio printed wiring boards. Course code PD-62. 10:00 AM - 2:00 PM

Lead-Free Lessons Learned: Wave Soldering
Chrys Shea, Shea Engineering Services
his workshop addresses those implications based on the basic principles of wave soldering Course code PD-63. 10:00 AM - 2:00 PM

Data Management for Eco-Compliance
Krista Botsford, Botsford Eco-Tech Partners
This workshop will cover the basics of a data management system, and explain what data should be available for an audit based on existing eco-compliance legislation. Course code PD-64. 10:00 AM - 2:00 PM