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Thousands of colleagues from more than 50 countries convened at this year's IPC APEX Expo, featuring the industry's premiere technical conference, standards development meetings, professional development courses, and an exhibition featuring more than 425 suppliers with the newest products and emerging technologies.
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Video: Panel Discussions at APEX 2009
Cleaning Debate
Trevor Galbraith of Global SMT & Packaging magazine moderates a panel on cleaning materials and processes. Panelists: Mike Bixenman, Kyzen Corporation; Mike Konrad, Aqueous Technologies; Steven Stach, Austin American Technologies; Dr. Harold Wack, ZESTRON.
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Soldering & Profiling
Mike Buetow of Circuits Assembly magazine moderates a discussion panel on soldering and thermal profiling. Panelists: Keith Sweatman, Nihon Superior; Fred Dimock, BTU; Michael Limberg, KIC.
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Pick & Place Debate
Trevor Galbraith of Global SMT & Packaging moderates a discussion panel on pick & place. Panelists: Bob Waters, Juki; Brian Duffy, MYDATA; Leo Van De Vall, Assembléon.
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Stencil/Screen Printing
Mike Buetow moderates a panel discussion on stencil/screen printing. Panelists: Rita Mohanty, Speedline; Bob Dervaes, FCT Assembly; Tim Jensen, Indium.
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Test & Inspection
Trevor Galbraith moderates a panel discussion on test & inspection. Panelists: Brian D'Amico, MIRTEC; Dr. Steven Case, Cyberoptics; Chris Cain, Agilent; Ron Lindell, VJ Electronix.
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© 2009 Trafalgar Publications Ltd.—Visit Global SMT & Packaging magazine online
Contact your local sales rep to learn how to get more exposure for your company's booth at this and other industry trade shows.
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