Don't miss: The Vendor Forum at booths 1383 & 1385
Global SMT & Packaging and Circuits Assembly are co-hosting a Vendor Forum to be held each day of APEX at their combined booths. Visitors on the show floor can drop by throughout the day to hear a range of presentations on a number of process-related issues. Panel discussions will also be held, with topics ranging from cleaning, printing and pick and place to solder and test.
Tuesday, March 31st
| Time |
Presentation |
Presenter/Moderator |
| 11:00-12:00 |
Cleaning panel discussion
Panelists: Mike Konrad (Aqueous Technologies), Steve Stach (Austin American), Mike Bixenman (Kyzen Corporation) and Dr. Harald Wack (Zestron). Watch this panel streaming live as it happens. |
Trevor Galbraith |
| 12:00-12:30 |
MagnaPrint - The advantages of a universal squeegee system |
Charlie Moncavage |
| 12:30-1:00 |
LUNCH BREAK |
|
| 1:00-1:30 |
Printing challenges with today's miniature components |
Mike Scimeca, FCT Assembly |
| 1:30-2:00 |
Innovative PCB cleaning fluids for
cleaning leading-edge technologies |
Mike Bixenman, Kyzen |
| 2:00-2:30 |
Reballing and prebumping BGAs, CSPs and QFNs |
Jan Martin, Manncorp |
| 2:30-3:30 |
Process reliability in selective soldering |
Christian Ott, SEHO USA |
| 3:00-3:30 |
Embedded device technology |
Mark McMeen, STI Electronics |
| 3:30-4:00 |
Reducing reflow costs in a challenging economy |
Fred Dimmock, BTU |
Wednesday, April 1st
| Time |
Presentation |
Presenter/Moderator |
| 11:00-12:00 |
Printing panel discussion
Panelists: Rita Mohanty (Speedline), Mike Scimeca (FCT) and Tim Jensen (Indium). Watch this panel streaming live as it happens. |
Mike Buetow |
| 12:00-12:30 |
Stencil cleaning for improved print yields |
Bill Schreiber, Smart Sonic Corp. |
| 12:30-1:00 |
Thermal quality management program |
Grant Peterson, ECD |
| 1:00-1:30 |
LUNCH BREAK |
|
| 1:30-2:00 |
New innovations for profiling PCBs |
Brian O'Leary, KIC |
| 2:00-2:30 |
White residue, electrical leakage and metal crystals - the rush to clean 'no clean' |
Mike Konrad, Aqueous Technologies |
| 2:30-3:30 |
Pick and place panel discussion
Panelists: Bob Waters (Juki), Derek Gaston (Europlacer) and Leo Van De Vall (Assembléon). Watch this panel streaming live as it happens. |
Trevor Galbraith |
| 3:30-4:00 |
Is automated selective soldering right for you? |
Eddie Groves, Pillarhouse Int'l |
| 4:00-5:00 |
Soldering & profiling panel discussion
Panelists: Keith Sweatman (Nihon Superior), Fred Dimock (BTU) and Michael Limberg (KIC). Watch this panel streaming live as it happens. |
Mike Buetow |
Thursday, April 2nd
| Time |
Presentation |
Presenter/Moderator |
| 11:00-12:00 |
Test and inspection panel discussion
Panelists: Steve Case (Cyberoptics), Brian D'Amico (MIRTEC), Chris Cain (Agilent) and Ron Lindell (VJ Electronix). Watch this panel streaming live as it happens. |
Trevor Galbraith |
| 12:00-12:30 |
Head in Pillow - BGA defects |
Mike Burgess, AIM Solder |
|
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