ASE continues to dominate this industry, closely followed by Amkor and Intel. TSMC kept its 5th place, just after JCET Group.
The market research and strategy consulting company Yole Développement (Yole) has developed comprehensive and accurate advanced packaging expertise for more than ten years. All year long, Yole’s analysts deliver in-depth analyses, including dedicated technology and market reports, reverse engineering and costing analyses, and monitors. More information.
Today, Yole releases the Advanced Packaging Quarterly Market Monitor, Q1 2022 update. With this new analysis, the packaging team offers in-depth coverage of the rapidly changing advanced packaging market dynamics and the main players’ status and strategies. Yole identified many changes during this quarter: the growing Chinese ecosystem, a strong market demand, the evolution of package technologies, and the supply chain disruption… all major events during this quarter have been deeply analyzed.
This Q1 2022 edition provides updates on unit shipments, wafer production, and revenue on a near-term and long-term basis. It provides capacity, CapEx, and supply chain insights into emerging markets and growth rates in mature markets in addition to package level forecasts and the annual rankings , based on 2021 revenues.
Gabriela Pereira, Technology & Market Analyst, Semiconductor, Memory & Computing, and part of the packaging team at Yole, asserts: “2021 was a great year for the advanced packaging industry, with ASE continuing to dominate the market, followed by Amkor. Intel kept its third position in the ranking, followed by JCET and TSMC. Furthermore, 2021 had larger YoY revenue growth than 2020, with the fastest-growing OSATs being mainly Chinese.”…
