Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Hentec Industries/RPS Automation is pleased to announce that Rochester Electronics has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine. The Odyssey 1325 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys. Designed to tin component leads for re- conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling. The Odyssey 1325 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF- 38524E and ANSI-J-STD-002 standards.
About Rochester Electronics:
Headquartered in Newburyport, Massachusetts, Rochester Electronics is the world’s largest continuous source of semiconductors offering a full range of manufacturing services including design, wafer processing, assembly, and test all providing single solutions and faster time-to- market. For more information, please visit: www.rocelec.com.