International Edition

  • Nordson Electronics Solutions introduces new Helios ® system for dispensing single-component thermal interface materials

    helios
    • Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste.

    Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, introduces a system-solution for dispensing single-component (1K) thermal interface materials by integrating the ASYMTEK Helios ® SD-960 Series fluid dispensing platform with the new FS-EP1 Fluid Supply/Feeding System One-Gallon Pail Pump.


    Single-component thermal interface materials (TIMs), often used as gap fillers in electronics
    manufacturing, are highly viscous and abrasive, making them difficult to feed from the original packaging
    to the dispense valve. Facility air pressure and chunk pumps are commonly used to transfer these thick
    materials. However, these are not long-term solutions because the air pressure is often insufficient or the
    pump wears out faster, leading to premature failure. The new FS-EP1 pail pump pushes material to the
    dispense valve using a closed-hydraulic system. Low shearing of the material ensures that highly
    conductive thermal gap fillers do not separate, and material properties remain unaffected. There are no
    moving parts in contact with the gap filler, and no moving parts outside the pump enclosure, not even in
    the fluid line.

    Equipment details:
     The new FS-EP1 pump is designed to make high-performance bulk dispensing safe and easy to
    maintain and to minimize down-time. The pump enclosure securely holds a one-gallon pail at the
    operator’s waist-level so that it is simple to load and remove. When it’s time to change out the
    pail, a semi-automated air-bleed routine with priming valve ensures that air is removed from the
    system, operating behind the closed, safety-interlocked doors. This operation helps to maintain
    safety while minimizing down-time and material waste. Other features, such as the highly durable
    hydraulic pump, the intuitive operator interface, and the quick, tool-free seal changeover,
    establish new benchmarks in performance and maintenance.

    The Helios dispensing platform handles medium- and large-volume dispensing applications —
    typically in diameters larger than 1mm — that include many single- and two-component fluid
    materials and pastes, like highly abrasive TIM. Helios dispenser processes are controlled by
    dedicated Fluidmove ® fluid dispensing software that includes user-programmable dispense
    geometries.

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