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  • Free Webinar: Reworking 01005-0201 Components by Hand or Machine

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    Free Webinar: Reworking 01005-0201 Components by Hand or Machine __ Sponsored by Indium Corporation from Global SMT TV on Vimeo.[/vc_column_text][vc_column_text disable_pattern=”false”]

    Thursday, March 23, 2017

    Reworking 01005 or 0201 components is extremely difficult as these are the smallest chips used in mainstream assembly lines today. The components are so small that the operator must use a microscope to remove them by hand.

    Special tools and equipment have been designed to help the operator remove and replace these surface mount components. Some of the challenges associated with these components are close proximity, placement accuracy and proper solder volume application.

    This webinar will show you how to rework these difficult components by hand as well as on a rework machine. The result is better process control with thermal temperature profiles, and accuracy of placement with correct solder volumes.

    Who Should Attend

    • Operators that actually carry out the rework on these small components will find it beneficial.
    • Process Engineers that are involved in the rework process of PCBs in the factory.
    • Production Managers that are responsible for  reworked PCBs.
    • Quality Manager that set the standard that is  acceptable for rework of these surface mount components.
    • Process Manger that is responsible for capital equipment purchases within the factory.

    What You Will Learn

    • How to rework these parts by hand.
    • How to rework on a convection rework machine.

    Champion Presenter

    Advanced Product Applications Manager
    Metcal – A brand of OK International

    Paul Wood is an industry expert in the BGA/CSP/Array package rework arena. With 34 years of service at OK International, Inc., and 43 years experience in the electronics assembly industry,  Mr. Wood has used his global experience in rework to keep electronic assembly manufacturers on the leading edge of technology.

    Mr. Wood is the Advanced Product Applications Manager for Metcal, specializing in new technology rework applications.  He is also an expert in working with lead-free advanced BGA packaging rework equipment.

    Mr. Wood works extensively with component manufacturers and advanced packaging professionals to find the latest rework solutions, and incorporates new processes for them into the design of their rework systems.  Mr. Wood is often asked to present papers and seminars on BGA/CSP rework at conferences worldwide.

    Born in Liverpool, England, UK, he has resided in the USA for the past 20 years.  Mr. Wood is married and lives in Pleasanton, CA.  He is based at Metcal’s worldwide headquarters in Cypress, CA.

    [/vc_column_text][/vc_column_inner][vc_column_inner width=”1/2″][vc_raw_js]JTNDc2NyaXB0JTIwdHlwZSUzRCUyMnRleHQlMkZqYXZhc2NyaXB0JTIyJTIwc3JjJTNEJTIyaHR0cHMlM0ElMkYlMkZmb3JtLmpvdGZvcm0uY29tJTJGanNmb3JtJTJGODA1MTUzODMyOTkxNjElMjIlM0UlM0MlMkZzY3JpcHQlM0U=[/vc_raw_js][vc_column_text disable_pattern=”false”]Sponsored by:

    AMERICAS   Utica  Chicago Clinton Rome

    Phone: +1 (315) 853-4900

    Email: [email protected]

    Website : www.indium.com

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