FREE WEBINAR RECORED ON:
Wednesday, April 6, 2016
Eutectic gold-tin, silver epoxies, solder, silicones and sintered materials have all been used for LED die attach. The webinar will compare the process, performance and reliability attributes of these die attach technologies for LED assembly. It will address the fit between these die-attach materials, different chip structures (like lateral, vertical and flip-chip) and their LED power levels. Optimal solutions for fast growing flip-chip and CSP package structures and chip-on-board (COB) modules will be discussed. Finally it will describe the positioning of different technologies for applications in general lighting segment.
Who should attend?
LED Package Designers, Packaging Engineers, Light Engine Designers, SMT Assembly Engineers, Reliability Engineers, Material Scientists, Power Module Assembly Engineers, Automotive Assembly, Display Backlight Assemblers
What you will learn
Role of die attach in LED performance and reliability, Die Attach material technologies, processes and performance, Selection of suitable die attach material for different chip structures including flip-chip, CSP and chip-on-board modules
Authors biography
Gyan Dutt works for Alpha as Technical Marketing Manager for LED Technologies. He is responsible for the planning, organization and implementation of the ALPHA® product portfolio for LED packaging, interconnect and assembly. He has more than 12 years of experience in technical marketing, product development and applications engineering in semiconductor packaging in the US and Asia-Pacific Regions.[/vc_column_text][/vc_column_inner][vc_column_inner width=”1/2″][vc_raw_js]JTNDc2NyaXB0JTIwdHlwZSUzRCUyMnRleHQlMkZqYXZhc2NyaXB0JTIyJTIwc3JjJTNEJTIyaHR0cHMlM0ElMkYlMkZmb3JtLmpvdGZvcm0uY29tJTJGanNmb3JtJTJGODA1MTU0MTY3OTkxNjMlMjIlM0UlM0MlMkZzY3JpcHQlM0U=[/vc_raw_js][vc_column_text]
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