• AIM to Highlight NC259FPA Ultrafine Solder Paste & Present on Low Temp Solder at IPC APEX 2024

    NC259FPA (1)

    AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming IPC APEX EXPO 2024 taking place April 9-11 at the Anaheim Convention Center in Anaheim, California. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

    NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 μm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

    AIM’s Timothy O’Neill and Gayle Towell will also be presenting a paper titled “Advancing the Understanding of Low- Temperature Solder in Electronics Rework and Assembly.” This presentation will outline the current low-temperature solder

    landscape, unveil new research and the case for low temperature rework, and discuss use cases and the future prospects of low temperature solder more broadly.

    Timothy O’Neill is the Director of Product Management for AIM Solder. Mr. O’Neill has over 25 years of industry experience and is a Certified IPC Specialist. He is a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA. Gayle Towell is AIM Solder’s Content Specialist. Holding master’s degrees in both mathematics and physics from the University of Oregon, Mrs. Towell facilitates communications, develops presentations, and ensures AIM’s technical papers and documentations meet the highest scientific standards.

    To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the IPC APEX EXPO, booth 1623 April 9-11, or visit www.aimsolder.com. To catch the presentation on low temperature solder, attend Assembly Materials Session 1 on Wednesday, April 10 from 1:30-3:00PM.

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