International Edition

  • Electronics Design in Mind: Peters at FED Conference

    20211020_Peters_Messeteam_Kollasa-Michael Foto_Axel_Küppersb

    From 29 to 30 September, the 30th FED Conference will take place in Potsdam, Germany. This trade association for design, PCB and electronics manufacturing brings together experts from the electronics industry to exchange knowledge and experience through lectures and an exhibition. Peters hoists the flag on the platform at Lake Templin.

    This year, the focus is on the trade association’s anniversary. For 30 years now, the FED has organised for its members – including Peters – and the industry a forum for exchange and further education, with the aim of increasing the competitiveness of the electronics industry in Germany, Austria and Switzerland. Founded by a small circle of electronics designers, the FED has developed into a trade association with 700 members covering the entire value chain in the electronics industry. At the 30th FED Conference, it will duly celebrate its success story. Peters will be present at stand 22 of the exhibition in Potsdam. In addition, Michael Kollasa will be giving a lecture at the conference on 29 September at 3.15 p.m. in room 0.214: “Flexible solder resists – areas of application, performance and limitations”. “Electronic circuit carriers have a wide range of applications”, reports Michael Kollasa (photo) who is head of field sales at the Kempen-based family company.

    Electronic circuit carriers can be found in all electronic devices, in computers and telecommunications technologies, for example in machines and systems, vehicles, notebooks, mobile phones, household appliances and much more. According to Michael Kollasa, the focus of applications has expanded in recent years from flex circuits to the automotive industry (“flex-to-install”), sensor technology and medical technology. When selecting a coating system that is ideally suited to the specific application, one would have to consider various aspects, such as any requirements regarding fitting ac-curacy and resolution, as well as the compatibility between the film carriers and the solder resist process.

    The processing of photoimageable flexible solder resists implies a slightly different procedure than that of classic photoimageable solder resists, reports FED lecturer Michael Kollasa. Different types of solder resist are available to suit the different areas of application of flexible circuit carriers. Michael Kollasa: “They have been specially formulated for the respective applications.”

    On both days of the conference, participants and speakers can receive first-hand information, exchange knowledge and experience and make contacts. “We are looking forward to the FED Conference and to presenting our service portfolio to the industry on this platform, including several coating innovations,” says Michael Kollasa.

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