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  • Essemtec is presenting latest advancements and SMTconnect Premieres in Booth 4.209.

    • Tarantula Underfill
    • Fully Integrated PCB Inspection
    • BGA Dispensing and Reballing

    Tarantula Underfill is our new machine for various underfill applications. The benefits of the underfill solution are indisputable. The concept is developed on the proven Tarantula All-in-One dispensing platform. It can be equipped with 5 different valves, for a wide range of dispensing applications.

    Video Link, https://vimeo.com/932265918

    Furthermore, Essemtec showcases its flagship equipment Puma All-in-One with enhanced speed performance and new capabilities:

    • High-Speed Solder Paste Jetting Solution
    • Integrated Inspection System

    Essemtec’s All-in-One platforms with dispensing, pick and place functionalities demonstrate live the highest standards in electronics assembly on flexible substrates, jetting of multiple fluids 3 times faster and efficient rework on populated boards.

    With advanced processes we prove live the reballing and flux dispensing capabilities with pick and place, as well as inspection in one go.

    Our team of engineers will share tips of SMT topics to help you increasing the flexibility of your production line and optimizing your manufacturing costs.

    Visit us in Hall 4 at booth 209 and be inspired by our solutions!

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