Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Hentec Industries/RPS Automation announces that it is pleased to exhibit its full line of selective soldering, component lead tinning and solderability test equipment at the upcoming SMTA Dallas Expo & Tech Forum to be held at the Plano Event Center, in Plano, Texas on March 28, 2023, and the SMTA Houston Expo & Tech Forum to be held at the Stafford Centre in Stafford, Texas on March 30, 2023.
At both SMTA events, Tom Baro, National Sales Manager for Hentec/RPS will be on-site to discuss how Hentec/RPS selective soldering, component lead tinning and solderability test equipment can improve the production quality of your printed circuit board assembly operation. The Vector and Valence selective soldering systems feature unlimited program storage, integrated system software, witness camera and auto fiducial correction. Available in either standalone or SMEMA in-line configurations, the Vector and
Valence are offered with topside preheat, spray or drop-jet fluxer, dual flux nozzles, and custom or wave solder nozzles. All Vector and Valence systems are UL and CE certified and carry both a two-year system warranty and a four-year solder pot warranty.
Hentec/RPS Odyssey robotic hot solder dip machines are MIL spec complaint component lead tinning machines designed for gold removal, re-tinning applications, including high reliability and military applications as well as BGA de-balling. The Pulsar solderability test system features a dip-and-look qualitative test method to verify the solderability of the surface of electronic components and can be easily performed by shop floor personnel with minimal training.