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  • ITW EAE to Showcase Latest Electronic Assembly Equipment Developments at IPC APEX

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    ITW EAE will be showcasing its latest developments at IPC APEX, April 9 – 11 in Anaheim. The ITW EAE booth #2327 will have MPM, Camalot, Electrovert and Vitronics Soltec Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.

    Camalot will be demonstrating their Advanced Tilt and Rotate option on the Prodigy dispensing system. This innovative and patented feature reduces wet out areas and improves capillary flow for underfill by accurately dispensing on the side walls of packages. State-of-the-art rotary actuators provide a fast, high precision, zero backlash mechanism that allows proprietary motion and controls allow articulation of the dispense pump in sub-degree increments for both axes as many times as you need, in other words total flexibility.

    Electrovert wave solder will feature the new Deep Wave option on the Electra wave soldering system. The new Deep Wave option offered by Electrovert provides the ability to pump up to a 20 mm wave height. The deep wave option overcomes the challenges associated with deep pockets and masking and provides a wave depth necessary to achieve topside hole fill. Electrovert will also feature the new Heavy-Duty Finger Conveyor option which is designed to address the increasing demands of PCB production in terms of weight, throughput capability and process flexibility.

    Electrovert Cleaners will feature the NEW Matrix style manifold with Intermix spray technology. Electrovert Cleaners will feature the NEW Matrix style manifold with Intermix spray technology. The new manifold design will allow for manual or automated adjusting the height of the nozzles for increased cleaning performance without any increase in energy consumption. Higher efficiency of energy transfer at the board allows for cleaning under low stand-offs and heavily populated boards. Prepared to meet the evolving demands of future cleaning challenges, this new Electrovert Cleaning technology is ready to effectively tackle tomorrow’s demands.

    MPM will conduct live demonstrations on the Momentum II Elite printer. Elite family has the industry leading accuracy, cycle time, and reliability, and its advanced technologies and features bring the benefits of versatility and flexibility, quality and throughput, ease of use. One machine does it all!

    Vitronics Soltec will feature the ZEVAm+ Selective Soldering solutions with the patented Bridge Prevention Technology acts as a hot nitrogen knife to prevent bridging for small pitch up to 1mm (40mil) pin to pin distance even with longer leads and increased drag speed. This design is only feasible with the design freedom of 3D metal printing technology. Additionally, the ZEVAm+ Selective Soldering machine accommodates larger board sizes, supporting dimensions up to 510mm x 510mm (20 x 20 inches). This modification is specifically aimed at meeting the needs of high-mix, low-volume manufacturers, with a particular focus on industries like automotive. The growing demand for electronic vehicles is driving an increased need for larger board sizes in manufacturing processes.

    Vitronics Soltec will feature Centurion Reflow Oven with True N2 to Air Switching. The True N2 to Air Switching feature offers versatility and convenience, allowing users to seamlessly switch between nitrogen and air atmospheres with the push of a button. This capability ensures optimal cleanliness of the reflow oven tunnel, where operating in air or nitrogen mode. In addition to that, Idle Mode demonstrates Vitronics Soltec’s commitment to sustainability by reducing power and nitrogen consumption when the machine is not in active production. This not only helps to minimize operating costs but also algins with environmental initiatives aimed at conserving resources.

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