• Saki Receives NPI Award 2023 for Innovative 3D-AOI 3Di Series Solution

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    NPI award success recognizes Saki’s dedication to innovation, cutting-edge technology, and customer satisfaction

    Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, has been awarded a New Product Introduction (NPI) Award 2023 by Circuits Assembly Magazine in the category of “Inspection Equipment – AOI Systems”. At the award ceremony on January 23rd at the IPC APEX Expo 2023 in San Diego, Saki’s innovative in-line 3Di AOI machine series was recognized by an independent judging panel of practicing engineers for its industry-leading high-speed, high-performance inspection capability for incredibly complex, high-density packaging technologies.

    The 3Di series is Saki’s latest high-speed, high-precision, in-line 3D AOI solution for complex inspection of high-density printed circuit boards, and boards with a combination of ultra-small and tall components. It features a unique and easy onsite interchangeable camera system with 8μm and 15μm resolution options and an extended height measurement range up to 40mm. The closed-loop, dual servo-motor drive system, high-resolution linear scale, and durable high-rigidity machine frame enable high-speed movement of the optical head with impressive stop-position accuracy.

    In combination with the cutting-edge bespoke software, these hardware innovations achieve the industry’s fastest cycle time for AOI systems, produce ultra-sharp, high-resolution 3D images and offer maximum flexibility with quick and easy on-site changeover capability between the 8μm and 15μm camera systems. 

    The 3Di series simultaneously and accurately inspects high-density PCBs with ultra-small components (such as 0402mm or 0201mm), narrowed pitch ICs, THT, closely located pads, and tall parts.

    Further key features include:

    • Sophisticated software and hardware configuration that optimizes image processing to achieve the industry’s fastest cycle time;
    • Crisp and clear 3D multi-layer solder joint imagery achieved with a unique custom inspection algorithm;
    • Easy-to-modify configurations that provide impressive scalability through interchangeable camera heads, adaptable AI functions, and more – all effortlessly and rapidly undertaken on-site. 

    “We are thrilled to receive this prestigious annual award from Circuits Assembly in recognition of our innovative work in automated optical and X-ray inspection technology,” said Craig Brown, newly appointed General Manager of Saki America. “Our R&D team works tirelessly to develop unique solutions that meet the need for fast precision inspections of rapidly evolving component technologies. We believe this award is not only a testament to their dedication but also serves as a reminder of Saki’s commitment to providing reliable and innovative solutions for our customers around the world.”

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