StenTech® Inc., the leading multinational SMT Printing Solutions company, is pleased to announce that it received a 2023 GLOBAL Technology Award in the category of Stencils for its groundbreaking Advanced Nano Coating. The award ceremony took place during productronica, the world’s leading trade fair for electronics development and production in Munich, Germany.
Electronic packaging has constantly pushed the limits of miniaturization, necessitating precise solder paste deposition while meeting ever- evolving IPC requirements. StenTech’s award-winning Advanced Nano Coating provides an unparalleled solution to this challenge. Featuring a highly unique 1-3 um hardened nano coating applied to the bottom side and inside the apertures of the stencil, this revolutionary technology offers exceptional anti-adhesion properties, effectively repelling solder flux and ensuring superior transfer of paste.
By utilizing StenTech’s Advanced Nano Coating, transfer efficiency can be boosted by up to 25 percent, resulting in a remarkable reduction of bridging and paste-related defects. The “non-stick” characteristics of the coating also lead to reduced underside cleaning, contributing to improved yields and reduced expenses on rework and touch-up. Additionally, stencils coated with Advanced Nano are ready for use in just 30 minutes after coating, enhancing production efficiency and minimizing downtime.
“We are honored to receive the 2023 GLOBAL Technology Award for our Advanced Nano Coating,” said Greg Starrett, Director of Sales at StenTech. “This recognition is a testament to the hard work and dedication of our team in developing cutting-edge solutions that address the challenges faced by
electronic packaging in today’s fast-paced technology landscape.”
StenTech has solidified its position as the industry leader through its legacy of pioneering stencil technology. The company’s introduction of Fiber Diode lasers into North America has made a significant impact in the industry. With a highly experienced team of over 30 CAD designers, StenTech offers unparalleled support in stencil modifications, material recommendations, and thickness specifications, ensuring optimized stencil solutions for every application.
The GLOBAL Technology Awards, established in 2005, recognize the finest innovations in the printed circuit assembly and packaging industries. This prestigious awards contest brings together the global SMT and advanced packaging industry, celebrating the companies and individuals driving our industry forward with exceptional standards and groundbreaking solutions.