Cleanliness of PC assemblies and SIR testing techniquesEnsuring cleanliness consistency and the dependability of SIR testing results relies on a variety of factors including the substrate material, test coupon design, paste and coating used etc. This panel will discuss how to setup and optimize SIR test coupons to achieve accurate and repeatable results.
Electrically Conductive Adhesives (ECAs) applications and alternativesThe applications for ECA’s as an alternative to low-temperature solders continues to rise as the number of heat-sensitive devices rises with new applications. This panel will discuss the advantages, disadvantages and use-cases for using ECAs in electronics assembly.
Component sourcing and supply chain visibility
As the chip shortage starts to ease later in the year, what are the lessons learned from the recent supply chain shortage and how should OEMs and manufacturers be better-placed to manage these shocks in the future? This will panel will discuss the current status and the future trends and challenges.
Digital Twin and establishing a Design for Manufacturing (DFM) strategy
The use of digital twin as a tool to digitally map your board design, materials and processes helps reduce design turns and the time for NPI to reach production. This panel will discuss tips on how to optimize the process using digital twins.
ESD challenges and strategies – what you need to knowESD can cause serious damage to sensitive components on board assemblies, if not carefully manages. This panel will discuss best practice for establishing an ESD strategy in your factroy.
Head-inPillow – what causes it, how do you spot it and how do you avoid it?Traditionally head-in-pillow (HiP) is one of the most difficult defects to detect, This panel will look at symptoms, causes and cures.
Attracting talent – what are the key skills needed by modern manufacturers?As factories modernise and automate, SMT operators need to upskill to manage the increasingly data driven environment. This panel of HR experts discuss the challenges of sourcing and hiring the right talent.
What impact does Advanced Packaging have on “Factory of the Future”
Large tier one companies are ahead in strategizing for Factory of the Future, but what can small to mid-sized companies learn from them?
This webinar will review the intersection of additive manufacturing and ESD
A current review of 3D printed ESD materials will be explored, in addition to the unique printing and processing capabilities that allow Fortify’s printers and materials to meet the requirements of electronics manufacturers.