International Edition

  • Dow to showcase new silicone technologies for advanced semiconductor packaging at SEMICON Taiwan 2021

    Pneumatic spray gun is used to apply ultraviolet-cure conformal coating (3-6714 UV Conformal Coating or 3-6748 UV Conformal Coating) to an electronic circuitboard.

    Dow (NYSE: Dow) will preview its latest silicone technologies for advanced semiconductor packaging at SEMICON Taiwan 2021 in Booth #I2616. These next-generation silicone-organic hybrid adhesives, silicone hotmelt solutions and silicone die-attach films (DAF) deliver improved performance, durability, uniformity and processability vs. traditional organics. Dow’s high-performance technologies are engineered to address top trends in advanced semiconductor packaging, including ever-thinner, smaller and more-complex designs, by mitigating stress from mismatched coefficients of thermal expansion (CTEs) that can cause warpage. They also provide greater durability and reliability for applications exposed to harsh environmental conditions in industries such as aerospace and automotive electronics.

     

    Pneumatic spray gun is used to apply ultraviolet-cure conformal coating (3-6714 UV Conformal Coating or 3-6748 UV Conformal Coating) to an electronic circuitboard.
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